Abstract: A semiconductor package which is multifunctional, thin, and high in mounting reliability includes an insulating film; a first electronic component formed on one of the main surfaces of the insulating film; a second electronic component formed outwardly on the other of the main surfaces opposite to the one of the main surfaces; an external output terminal formed outwardly on the other of the main surfaces; and internal wiring formed in the insulating film so as to provide electrical continuity between the external output terminal and each of the first electronic component and the second electronic component. The insulating film is composed of a first insulating film and a second insulating film opposite to each other; the internal wiring is interposed between the first insulating film and the second insulating film, and the protruding end of the external output terminal is outside beyond the protruding end of the second electronic component.