Abstract: A barrel plating or high-speed rotary plating method for electronic components, and a neutral tin plating solution used therein. A plating solution that includes (A) stannous ions, (B) an acid or a salt, (C) a complexing agent, and (D) a diamine that has a polyoxyalkylene chain, and that has a pH in a range between 4 and 8 is used. The use of this neutral tin plating solution prevents the electronic components from coupling together during the barrel plating, enabling an improvement in manufacturability in barrel plating.

Abstract: A composition containing a cationic polymer obtained from a reaction product of nitrogen-containing heterocyclic compound and epihalohydrin; and a phosphorus compound. The composition can be used as a surface treatment for gold or gold alloy. The composition can seal pinholes on the surface of the gold or gold alloy.

Abstract: A composition containing a cationic polymer obtained from a reaction product of nitrogen-containing heterocyclic compound and epihalohydrin; and a phosphorus compound. The composition can be used as a surface treatment for gold or gold alloy. The composition can seal pinholes on the surface of the gold or gold alloy.

Abstract: An electrolytic copper plating solution is disclosed which can form a rectangular circuit pattern. A method for conducting electrolytic plating on a board by using the electrolytic copper plating solution and an electrolytic circuit which is formed by using the electrolytic copper plating solution is also described. The electrolytic copper plating solution contains two kinds of specific surfactants.

Abstract: An electrolytic copper plating solution is provided which has an excellent via filling ability without using formaldehyde, which is harmful to the environment. An electrolytic copper plating solution which contains compounds which have an —X—S—Y— structure wherein X and Y are individually atoms selected from a group comprising hydrogen, carbon, sulfur, nitrogen, and oxygen atoms and X and Y can be the same only when they are carbon atoms and specific nitrogen-containing compounds. Good filled vias can be made without causing a worsening of the exterior appearance of the plating by using this electrolytic copper plating solution.

Abstract: Copper electroplating liquid which does not use formaldehyde, which is harmful to the environment, and which exhibits excellent via filling ability is offered. The copper electroplating liquid of this invention includes the compound that has the structure of —X—S—Y— where X and Y are each an atom selected from the group of hydrogen atoms, carbon atoms, sulfur atoms, nitrogen atoms and oxygen atoms, and X and Y can be the same only when they are carbon atoms, and a specific urea derivative. When the copper electroplating liquid is used, deterioration of the appearance will not occur and a good filled via can be formed.

Abstract: Copper electroplating liquid which does not use formaldehyde, which is harmful to the environment, and which exhibits excellent via filling ability is offered. The copper electroplating liquid of this invention includes the compound that has the structure of —X—S—Y— where X and Y are each an atom selected from the group of hydrogen atoms, carbon atoms, sulfur atoms, nitrogen atoms and oxygen atoms, and X and Y can be the same only when they are carbon atoms, and a specific urea derivative. When the said copper electroplating liquid is used, deterioration of the appearance will not occur and a good filled via can be formed.

Abstract: An electrolytic copper plating solution is provided which has an excellent via filling ability without using formaldehyde, which is harmful to the environment. An electrolytic copper plating solution which contains compounds which have an —X—S—Y— structure wherein X and Y are individually atoms selected from a group comprising hydrogen, carbon, sulfur, nitrogen, and oxygen atoms and X and Y can be the same only when they are carbon atoms and specific nitrogen-containing compounds. Good filled vias can be made without causing a worsening of the exterior appearance of the plating by using this electrolytic copper plating solution.