Abstract: Provided is a curable resin composition that has excellent heat resistance and low warpage and is, furthermore, capable of improving light transmittance in cured products, a dry film and its cured product of, and an electronic component containing the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a thermosetting resin, (C) a thermosetting accelerator and (D) inorganic particles, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic anhydride having an aliphatic structure and has a number-average molecular weight of 500 to 1000; a dry film and its cured product; and an electronic component containing the cured product were obtained.

Abstract: Provided is a curable resin composition having developability and resolution improved without degrading the heat resistance and the chemical resistance, furthermore, a curable resin composition that is useful as a PID material for optical uses or a material for optical sensor protective films and enables the formation of a cured product having both higher transparency and excellent heat resistance, a dry film containing the curable resin composition, a cured product thereof and a printed wiring board including the cured product. A curable resin composition containing (A) an amide-imide resin, (B) a compound having an ethylenic double bond and (C) a photopolymerization initiator, wherein the amide-imide resin (A) is a reaction product of an isocyanurate-type polyisocyanate synthesized from an isocyanate having an aliphatic structure and a tricarboxylic acid anhydride and has a number-average molecular weight of 500 to 1000.

Abstract: Disclosed is a photocurable resin composition which comprises a photopolymerization initiator having two oxime ester groups in the molecule, a resin containing a carboxyl group, and a compound having two or more ethylenically unsaturated groups in the molecule. The composition can achieve high sensitivity, can provide a dried coating film having excellent touch dryness of fingers, can prevent the generation of an out gas during curing or the like, and can achieve all of excellent alignment accuracy, high productivity and high reliability in the formation of a solder resist for a printed wiring board or the like.

Abstract: [Problems] The present invention provides a photocurable resin composition having excellent adhesion with a substrate and excellent resolution; a film obtained by using the photocurable resin composition; a cured product obtained by curing the photocurable resin composition; and a printed wiring board comprising the cured product. [Means for Solution] The photocurable resin composition according to the present invention is characterized by comprising (A) a carboxyl group-containing resin, (B) an acylphosphine oxide-based photopolymerization initiator, (C) a titanocene-based photopolymerization initiator, (D) a photosensitive monomer and (E) a polymerization inhibitor.

Abstract: Disclosed is a photocurable resin composition which comprises a photopolymerization initiator having two oxime ester groups in the molecule, a resin containing a carboxyl group, and a compound having two or more ethylenically unsaturated groups in the molecule. The composition can achieve high sensitivity, can provide a dried coating film having excellent touch dryness of fingers, can prevent the generation of an out gas during curing or the like, and can achieve all of excellent alignment accuracy, high productivity and high reliability in the formation of a solder resist for a printed wiring board or the like.

Abstract: The present invention provides a photocurable and thermosetting resin composition having excellent surface curability and deep curability, allowing pattern formation with a laser beam having a wavelength of 350 to 410 nm, and being useful as a solder resist for laser direct imaging, the composition including a carboxylic resin (A), an oxime ester-based photopolymerization initiator (B) such as 2-(acetyloxyiminomethyl)thioxanthene-9-one, and another photopolymerization initiator than (B) such as 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, and a sulfur compound (E) such as 2-mercaptobenzothiazole.

Abstract: An alkali development-type solder resist includes (A) a carboxyl group-containing photosensitive resin obtained by reacting (a) a compound having two or more cyclic ether or thioether groups in the molecule with (b) an unsaturated monocarboxylic acid, reacting the product with (c) a polybasic acid anhydride, reacting the resulting resin with (d) a compound having a cyclic ether group and an ethylenic unsaturated group in the molecule, and reacting the product additionally with (c) a polybasic acid anhydride, (B) an oxime ester-based photopolymerization initiator containing a specific oxime ester group, (C) a compound having two or more ethylenic unsaturated groups in the molecule, and (D) a thermosetting component, wherein the dry film obtained by applying the composition has an absorbance of 0.3 to 1.2 per 25 ?m of the film thickness at a wavelength of 350 to 375 nm.

Abstract: There are provided a photosensitive composition used in one-shot exposure of exposing it via a photomask to light from a UV lamp or in direct writing with light from a UV lamp or laser light to form a patterned latent image to be developed with an alkaline aqueous solution, wherein a difference between maximum absorbance and minimum absorbance, in a wavelength range of 355 to 405 nm, of a dry coating thereof before light exposure is within 0.3 per 25 ?m film thickness of the dry coating, and a dry film obtained by applying the photosensitive composition onto a carrier film and then drying it.

Abstract: Provided is a photocurable resin composition developable with a rare alkali solution, including a carboxylic acid-containing resin (A), a coloring agent (B) composed of a compound having an aminoantraquinone skeleton, a photopolymerization initiator (C), and a compound (D) having two or more ethylenically unsaturated groups within one molecule thereof, the composition being sufficiently colored while controlling absorption in the ultraviolet region using the coloring agent composed of a compound having an aminoantraquinone skeleton, having high sensitivity to ultraviolet and laser exposure, and providing good dry tack in a state of a dry coating film.

Abstract: An alkali development-type solder resist includes (A) a carboxyl group-containing photosensitive resin obtained by reacting (a) a compound having two or more cyclic ether or thioether groups in the molecule with (b) an unsaturated monocarboxylic acid, reacting the product with (c) a polybasic acid anhydride, reacting the resulting resin with (d) a compound having a cyclic ether group and an ethylenic unsaturated group in the molecule, and reacting the product additionally with (c) a polybasic acid anhydride, (B) an oxime ester-based photopolymerization initiator containing a specific oxime ester group, (C) a compound having two or more ethylenic unsaturated groups in the molecule, and (D) a thermosetting component, wherein the dry film obtained by applying the composition has an absorbance of 0.3 to 1.2 per 25 ?m of the film thickness at a wavelength of 350 to 375 nm.

Abstract: A photocurable and thermosetting resin composition developable with a dilute alkaline solution containing: (A) an ethylenic unsaturated group-containing and carboxylic acid-containing resin, (B) a coumarin skeleton-containing sensitizer having a maximum absorption wavelength of 360 to 410 nm, as represented by the following Formula (I): (C) a photopolymerization initiator, (D) a compound having two or more ethylenic unsaturated groups in the molecule, (E) a filler, and (F) a thermosetting component.

Abstract: The present invention provides a photocurable and thermosetting resin composition having excellent surface curability and deep curability, allowing pattern formation with a laser beam having a wavelength of 350 to 410 nm, and being useful as a solder resist for laser direct imaging, the composition including a carboxylic resin (A), an oxime ester-based photopolymerization initiator (B) such as 2-(acetyloxyiminomethyl)thioxanthene-9-one, and another photopolymerization initiator than (B) such as 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, and a sulfur compound (E) such as 2-mercaptobenzothiazole.

Abstract: There are provided a photosensitive composition used in one-shot exposure of exposing it via a photomask to light from a UV lamp or in direct writing with light from a UV lamp or laser light to form a patterned latent image to be developed with an alkaline aqueous solution, wherein a difference between maximum absorbance and minimum absorbance, in a wavelength range of 355 to 405 nm, of a dry coating thereof before light exposure is within 0.3 per 25 ?m film thickness of the dry coating, and a dry film obtained by applying the photosensitive composition onto a carrier film and then drying it.

Abstract: A photocurable and thermosetting resin composition comprising (A) a carboxyl-group containing resin, (B) an oxime ester-based photopolymerization initiator containing an oxime ester group, (C) an aminoacetophenone-based photopolymerization initiator and/or a phosphine oxide-based photopolymerization initiator, (D) a compound having at least two ethylenically unsaturated groups in its molecule, (E) a filler, and (F) a thermosetting component is capable of being developed with a dilute alkaline solution and cured with a laser emission source having a maximum wavelength of 350 nm to 420 nm.