Patents by Inventor Yolande Elodie Nguena Dongmo

Yolande Elodie Nguena Dongmo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10679966
    Abstract: A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: June 9, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David Danovitch, Yolande Elodie Nguena Dongmo, Richard Langlois
  • Patent number: 10559549
    Abstract: A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: February 11, 2020
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: David Danovitch, Yolande Elodie Nguena Dongmo, Richard Langlois
  • Publication number: 20180233482
    Abstract: A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.
    Type: Application
    Filed: February 14, 2017
    Publication date: August 16, 2018
    Inventors: David Danovitch, Yolande Elodie Nguena Dongmo, Richard Langlois
  • Publication number: 20180233483
    Abstract: A method for removing an electrical component from a substrate where the component is coupled to the substrate by connection elements. The method includes disposing liquid gallium (Ga) at or near an edge of the component and dispersing the liquid Ga between the substrate and the component such that the liquid Ga contacts one or more of the connection elements. The method also includes maintaining the liquid Ga between the substrate, component and one or more of the connection elements for a prescribed time period and removing the component from the substrate by applying a mechanical force to the component.
    Type: Application
    Filed: November 20, 2017
    Publication date: August 16, 2018
    Inventors: David Danovitch, Yolande Elodie Nguena Dongmo, Richard Langlois