Patents by Inventor Yonathan David

Yonathan David has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Evaluating a contact between a wafer and an electrostatic chuck
    Patent number: 11694869
    Abstract: A method, a non-transitory computer readable medium and a device. The method may include (a) introducing a voltage difference between an absolute value of a negative pole of the electrostatic chuck and an absolute value of a positive pole of the electrostatic chuck, the introducing occurs while the wafer is supported by the electrostatic chuck and is contacted by one or more conductive contact pins of the electrostatic chuck; (b) monitoring, by an electrostatic sensor that comprises a sensing element, a charge at a point of measurement located at a front side of the wafer, at different points of time that follow a start of the introducing of the voltage difference, to provide monitoring results; and (c) determining an electrical parameter of the contact between the wafer and the electrostatic chuck, based on the monitoring results.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: July 4, 2023
    Assignee: Applied Materials Israel Ltd.
    Inventors: Adam Faust, Yosef Basson, Guy Eytan, Yonathan David
  • EVALUATING A CONTACT BETWEEN A WAFER AND AN ELECTROSTATIC CHUCK
    Publication number: 20220181115
    Abstract: A method, a non-transitory computer readable medium and a device. The method may include (a) introducing a voltage difference between an absolute value of a negative pole of the electrostatic chuck and an absolute value of a positive pole of the electrostatic chuck, the introducing occurs while the wafer is supported by the electrostatic chuck and is contacted by one or more conductive contact pins of the electrostatic chuck; (b) monitoring, by an electrostatic sensor that comprises a sensing element, a charge at a point of measurement located at a front side of the wafer, at different points of time that follow a start of the introducing of the voltage difference, to provide monitoring results; and (c) determining an electrical parameter of the contact between the wafer and the electrostatic chuck, based on the monitoring results.
    Type: Application
    Filed: December 8, 2020
    Publication date: June 9, 2022
    Applicant: APPLIED MATERIALS ISRAEL LTD.
    Inventors: Adam Faust, Yosef Basson, Guy Eytan, Yonathan David