Patents by Inventor Yoncai Wang

Yoncai Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150310963
    Abstract: A method of making a thin-film multi-layer micro-wire structure includes providing a substrate and a layer on the substrate with one or more micro-channels having a width less than or equal to 20 microns. A conductive material including silver nano-particles and having a percent ratio of silver that is greater than or equal to 40% by weight is located in the micro-channels and cured to form an electrically conductive micro-wire. The electrically conductive micro-wire has a width less than or equal to 20 microns and a depth less than or equal to 20 microns. Each micro-wire is electrolessly plated to form a plated layer located at least partially within each micro-channel between the micro-wire and the layer surface in electrical contact with the micro-wire. The plated layer has a thickness less than a thickness of the micro-wire so that the micro-wire and plated layer form the thin-film multi-layer micro-wire.
    Type: Application
    Filed: April 29, 2014
    Publication date: October 29, 2015
    Inventors: ROGER G. MARKHAM, Ronald Steven Cok, Yoncai Wang, Mitchell Lawrence Wright