Abstract: The invention provides a nutritional supplement and/or pharmaceutical composition for tableting comprising an embedded lubrication matrix. The embedded lubrication matrix comprises an oily liquid finely dispersed in an oil insoluble material. A method of lubricating a nutritional supplement or pharmaceutical composition for tableting using a matrix with embedded lubrication is also provided.

Abstract: An optical imaging system includes a first lens, a second lens, a third lens, a fourth lens, a fifth lens, a sixth lens, and a seventh lens sequentially disposed in numerical order along an optical axis of the optical imaging system from an object side of the optical imaging system toward an imaging plane of the optical imaging system, wherein the optical imaging system satisfies 0.5<L12345TRavg/L7TR<0.9, where L12345TRavg is an average value of overall outer diameters of the first to fifth lenses, L7TR is an overall outer diameter of the seventh lens, and L12345TRavg and L7TR are expressed in a same unit of measurement.

Abstract: A high-frequency heating method for a hot stamping process includes: a first heating step of high-frequency heating a steel sheet, which has an aluminum (Al) coating layer formed on an iron (Fe)-based base material, to a first target temperature at a first heating rate; a second heating step of melting the coating layer by high-frequency heating the steel sheet, which has passed through the first heating step, to a second target temperature at a second heating rate, wherein the second heating rate is lower than the first heating rate; and a third heating step of high-frequency heating the steel sheet, which has passed through the second heating step, to a third target temperature at a third heating rate, wherein the third heating rate is lower than the second heating rate. A compound is formed by a reaction between a material of the coating layer and a material of the base material in the second heating step.

Abstract: Flexible structured-pipelined CORDIC techniques efficiently perform various CORDIC operations and support different parameters for MIMO MEQ processing. The structured-pipelined CORDIC techniques simplify signal processing flow, unify input requirements and output delay, and simplify integration. Look-up table techniques provide quick generation of control signals, reduce design and verification efforts, and facilitate design automation. In addition, the structured-pipelined CORDIC techniques are conducive to hardware sharing and reuse. The structured-pipelined CORDIC techniques reduce integrated circuit area and power consumption.

Abstract: A backlight device and a manufacturing method thereof are provided. The backlight device includes a substrate, a Light-Emitting Diode (LED) layer and a band-pass filter. The LED layer is disposed on the substrate and includes a plurality of LED chips arranged at intervals. The band-pass filter is disposed on the LED layer and is provided with openings formed at positions corresponding to the LED chips.

Abstract: Provided is a method of forming a filter module. The method includes: forming a non-pore ion-exchange membrane including: preparing a mixed solution of a polymer material and an ion-exchange material; and electrospraying the mixed solution to obtain the non-pore ion-exchange membrane; and interposing the non-pore ion-exchange membrane between a first polymer nanofiber web and a second polymer nanofiber web to form the filter module.

Abstract: A semiconductor package sawing device is provided that includes a semiconductor package sawing unit, an automatic tool providing portion disposed adjacent to the semiconductor package sawing unit, and a semiconductor package alignment portion. The automatic tool providing portion includes a transfer unit for transferring a chuck unit to the semiconductor package sawing unit.

Abstract: A method of obtaining contact resistance values of a semiconductor package, the semiconductor package includes a package substrate, a semiconductor chip mounted on the package substrate, a molding member disposed on the package substrate to surround the semiconductor chip, and an electromagnetic interference (EMI) shielding layer disposed on side surfaces of the package substrate and on the molding member. The package substrate includes a substrate body having a first surface and a second surface which are opposite to each other, first to fourth upper interconnection patterns disposed on the first surface of the substrate body in a first region of the package substrate and in contact with the EMI shielding layer, and an interconnection structure disposed in a second region of the package substrate.

Abstract: A conversion circuit board, including: a microprocessor module; a power module; a communication module; a first interface module; and a second interface module. The microprocessor module is adapted to communicate with a motherboard of an air conditioner via the communication module. The microprocessor module is adapted to connect to a first brushless direct current motor and a second brushless direct current motor via the first interface module and the second interface module, respectively. The power module supplies powers for the microprocessor module, the communication module, the first interface module, and the second interface module.

Abstract: A method for enabling multiplayer gameplay includes: executing, by a cloud gaming server, a first user's gameplay of a video game, wherein executing the first user's gameplay includes processing input received over a network from a first controller device that is associated with the first user to direct gameplay events occurring in the first user's gameplay; presenting, over the network, a live video feed of the first user's gameplay to a remote second user; processing a request for the second user to join the first user's gameplay; initiating gameplay by the second user in the first user's gameplay, wherein initiating gameplay by the second user includes processing input received over the network from a second controller device that is associated with the second user to direct at least some of the gameplay events occurring in the first user's gameplay.

Abstract: An electronic device and a method of payment by the electronic device are provided. The electronic device includes a local wireless communication circuit, a first biometric sensor and a second biometric sensor, a security module configured to store payment information corresponding to a payment card, a processor electrically connected to the first biometric sensor, the second biometric sensor, the local wireless communication circuit, and the security module, and a memory electrically connected to the processor, wherein the memory is configured to store instructions that cause the processor to select at least one of the first biometric sensor or the second biometric sensor, based on a security policy of an issuer of the payment card or a security policy of the payment card, authenticate a user by using the selected biometric sensor, and if the authentication is successful, transmit the payment information to an external device through the local wireless communication circuit.

Abstract: A receiver for a wireless charging system, capable of receiving power energy using non-contact type magnetic induction, includes a coil capable of receiving the power energy and a part for generating a predetermined output power from the power energy received by the coil, a portable terminal, an NFC coil further provided outside of the coil, and a ferrite sheet further provided at the coil and the NFC coil.

Abstract: A deposition apparatus for depositing a material on a wafer, the apparatus including a lower shower head; an upper shower head disposed on the lower shower head, the upper shower head facing the lower shower head; and a support structure between the upper shower head and the lower shower head, the wafer being supportable by the support structure, wherein the upper shower head includes upper holes for providing an upper gas onto the wafer, the lower shower head includes lower holes for providing a lower gas onto the wafer, the support structure includes a ring body surrounding the wafer; a plurality of ring support shafts between the ring body and the lower shower head; and a plurality of wafer supports extending inwardly from a lower region of the ring body to support the wafer, and the plurality of wafer supports are spaced apart from one another.

Abstract: Disclosed are a safety service system and a method thereof. The safety service system comprises: a collection unit for collecting position information and image information related to a protected person who is registered by a protector; and a service providing unit for providing the position information and the image information to one or both of the protector and a security company upon detection of a signal that the protected person is in danger.

Abstract: A light emitting device can include a sapphire substrate; a first conductivity type semiconductor layer disposed on the sapphire substrate; an active layer disposed on the first conductivity type semiconductor layer; a plurality of p-type conductors disposed on the active layer, and separated from each other; a first pad disposed on the first conductivity type semiconductor layer; and a second pad disposed on the plurality of p-type conductors, in which the plurality of p-type conductors are arranged in a first direction, the second pad is spaced apart from the first pad in a second direction, the second direction is perpendicular to the first direction, each of the plurality of p-type conductors has a first width in the first direction and a second width in the second direction, the first width being less than the second width, the plurality of p-type conductors are evenly spaced apart by a first distance in the first direction, and the first distance being less than the first width of each of the plurality

Abstract: A display device includes a plurality of pixels. Each pixel includes a first transistor that controls an amount of current received from a first power supply voltage line connected via a second node to an organic light emitting diode in response to a voltage of a first node, a second transistor connected between a data line and the second node and that includes a first gate electrode connected to a first scan line, a light emitting line connected to a gate electrode of at least one light emitting transistor located in a current path between the first power supply voltage line and the organic light emitting diode, and a seventh transistor connected between one of at least one second gate electrode of the second transistor and the light emitting line. Accordingly, a threshold voltage of a switching transistor included in each of the plurality of pixels may be negatively shifted.

Abstract: A method for identifying a pseudo wireless access point, applied to an electronic device, includes: determining whether an abnormal file operation is detected, when the electronic device is connected to a wireless network through a wireless access point; determining the wireless access point to be a pseudo wireless access point, when the abnormal file operation is detected; and executing an early warning instruction. A system for identifying a pseudo wireless access point is also provided. The present disclosure can timely discover a phishing wireless access point and prevent loss of a user's privacy and property.

Abstract: An inter-prediction method and apparatus uses a reference frame generated based on deep learning. In the inter-prediction method and apparatus, a reference frame is selected, and a virtual reference frame is generated based on the selected reference frame. A reference picture list is configured to include the generated virtual reference frame, and inter prediction for a target block is performed based on the virtual reference frame. The virtual reference frame may be generated based on a deep-learning network architecture, and may be generated based on video interpolation and/or video extrapolation that use the selected reference frame.

Abstract: Example array substrates are provided. One example array substrate includes an underlying substrate, an antenna and a component layer, where the antenna and the component layer are located on a same side of the underlying substrate, where the component layer and the antenna are disposed at intervals, where the component layer includes a plurality of metal laminates and a plurality of dielectric laminates that are stacked, and where the plurality of metal laminates and the plurality of dielectric laminates are alternately disposed to form a plurality of thin film transistors.

Abstract: An indicator-type door lock that may prevent the door lock device from being enlarged while user may intuitively identify the lock state of the door lock at the outside. An indicator-type door lock including: a handle shaft having a handle for unlocking and a push button for locking; a driving body mounted with the handle shaft; a door lock main body having a main body cover with at least one display portion displaying the locked state of the door lock to the outside, and installed in front of the driving body; an indicator member installed within the door lock main body to be pivoted to a certain radius, and being exposed through the display portion; and a turning drive member for pivoting the indicator member located within the handle shaft and rotated inside the handle shaft when the push button is pressed to pivot indicator member.