Abstract: A micro USB memory package and method for manufacturing the same, which can meet the USB standard specification, can have a light, thin, short and small configuration, can have various applications, and can simply expand the memory capacity thereof. The micro USB memory package comprises a substrate with a plurality of circuit patterns formed on the top surface thereof, at least one of passive elements connected with the circuit patterns of the substrate, at least one of controllers connected with the circuit patterns of the substrate, at least one of flash memories connected with the circuit patterns of the substrate, and an encapsulation part encapsulating the passive elements, the controllers and the flash memories on the substrate, and at least one of USB lands connected with the circuit patterns by a conducting via are formed on the under surface of one side of the substrate.

Abstract: The present invention relates to a micro USB memory package and a method for manufacturing the same. The object of the present invention is to provide a micro USB memory package and a method for manufacturing the same, which can meet the USB standard specification, can have light, thin, short and small configuration, can have various applications, and can simply expand the memory capacity thereof.

Abstract: A semiconductor chip package comprising a substrate with mounting leads and a manufacturing method thereof are provided. The semiconductor chip package comprises a substrate having a lower surface and an upper surface. A semiconductor chip with a plurality of bonding pads on an active surface is disposed on the upper surface of the substrate. The substrate includes a plurality of electrode pads on the upper surface and electrode terminals on the sides of the lower surface. Each of said electrode pads is electrically connected to a corresponding one of bonding pads and each of said electrode terminals is electrically connected to a corresponding one of the electrode pads. Further, the package includes a plurality of mounting leads, each having one end electrically connected to a corresponding one of said electrode terminals and the other end extending outwardly from the substrate to serve as external connection terminals.