Patents by Inventor Yong An

Yong An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • BEARING FAILURE DETECTION IN A HYDRAULIC FRACTURING RIG
    Publication number: 20190353557
    Abstract: A rig management system is disclosed. The rig management system may be configured to receive vibration data from a set of sensors installed on one or more elements of a hydraulic fracturing rig. The rig management system may be configured to perform a first processing of the vibration data utilizing a moving window technique to identify a possible failure of a set of bearings. The rig management system may be configured to perform a second processing utilizing a set of processing techniques after identifying the possible failure of the set of bearings. The rig management system may be configured to determine that the possible failure is an actual failure based on a result of performing the second processing. The rig management system may be configured to perform an action after determing that the possible failure is the actual failure.
    Type: Application
    Filed: May 21, 2018
    Publication date: November 21, 2019
    Applicant: Caterpillar Inc.
    Inventors: Yanchai Zhang, Yong Sun, Mingang Wang, Xuefei Hu, Zhaoxu Dong, Chunhui Pan
  • Providing Advertisements from Related Search Queries
    Publication number: 20190355017
    Abstract: Methods, systems and apparatus for identifying advertisements previously presented when processing related search queries related to a submitted search query, and providing the advertisements identified from the related search queries for presentation on a search results page for the submitted search query.
    Type: Application
    Filed: July 31, 2019
    Publication date: November 21, 2019
    Inventors: Hui Li, Yong Zhang, Gangjiang Li, Boon-Lock Yeo
  • IC PRODUCT COMPRISING AN INSULATING GATE SEPARATION STRUCTURE POSITIONED BETWEEN END SURFACES OF ADJACENT GATE STRUCTURES
    Publication number: 20190355832
    Abstract: One illustrative IC product disclosed herein includes first and second final gate structures and an insulating gate separation structure positioned between the first and second final gate structures. In one embodiment, the insulating gate separation structure has a stepped bottom surface with a substantially horizontally oriented bottom central surface that is surrounded by a substantially horizontally oriented recessed surface, wherein the substantially horizontally oriented bottom central surface is positioned a first level above the substrate and the substantially horizontally oriented recessed surface is positioned at a second level above the substrate, wherein the second level is greater than the first level.
    Type: Application
    Filed: July 26, 2019
    Publication date: November 21, 2019
    Inventors: Jiehui Shu, Chang Seo Park, Shimpei Yamaguchi, Tao Han, Yong Mo Yang, Jinping Liu, Hyuck Soo Yang
  • TASTE MASKING PRODUCT
    Publication number: 20190350850
    Abstract: This invention relates to a chocolate or chocolate substitute composition or product comprising (a) at least compound to be delivered to a subject; (b) a chocolate or chocolate substitute matrix and at least (i) a masking agent or (ii) a firming agent, wherein the composition or product is substantially stable.
    Type: Application
    Filed: November 17, 2017
    Publication date: November 21, 2019
    Inventors: Ngoc Minh Nguyen, Lee Yong Lim
  • ARRAY SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME, AND DIPSLAY DEVICE
    Publication number: 20190353964
    Abstract: The present disclosure provides an array substrate and a method for manufacturing the same, and a display device. The array substrate includes a plurality of pixel units arranged in a matrix, each the pixel unit includes a plurality of pixel regions, each pixel region is provided with a display electrode having a slit; a plurality of data lines, each of the data lines includes a plurality of data line segments, any two adjacent data line segments are electrically coupled to each other; in each of the pixel units, each of a part of the pixel regions has a display electrode whose slit is parallel to a data line segment adjacent to this display electrode in the data lines; each of another part of the pixel regions has a display electrode whose slit is non-parallel to a data line segment adjacent to this display electrode in the data lines.
    Type: Application
    Filed: October 18, 2018
    Publication date: November 21, 2019
    Inventors: Chunping LONG, Yong QIAO, Xinyin WU
  • MODULAR MULTILEVEL CONVERTER SYSTEM
    Publication number: 20190356217
    Abstract: The present invention relates to an MMC converter system which can quickly cut off fault current by installing a plurality of disconnecting switch units on a line connected between two MMC converter devices. The MMC converter system comprises: a first MMC converter device including a plurality of serially connected sub modules; a second MMC converter device including a plurality of serially connected sub modules; a first disconnecting switch unit installed on a line between the first and second MMC converter devices; and a second disconnecting switch unit connected in series to the first disconnecting switch unit on the line, wherein each of the first and second disconnecting switch units comprises a mechanical switch installed on the line so as to open and close the line and a diode connected in parallel to the mechanical switch, and the two diodes are installed in opposite directions to each other.
    Type: Application
    Filed: December 5, 2017
    Publication date: November 21, 2019
    Inventors: Hee Jin KIM, Kyeon HUR, Dong Su LEE, Jae Sik KANG, Ju Yong JUNG, Sang Min KIM, Jong Seo NA
  • LASER SCRIBING DEVICE
    Publication number: 20190351511
    Abstract: Provided is a laser scribing device including: a laser light source for outputting a laser beam; a splitter for dividing the laser beam into a first laser beam and a second laser beam; a beam expander telescope for adjusting a divergent angle on a path of the first laser beam or a path of the second laser beam; a beam combiner for combining the first laser beam and the second laser beam; and a light-collecting lens for light-collecting the first and second laser beams that are combined by the beam combiner, wherein the first laser beam and the second laser beam have different focal distances.
    Type: Application
    Filed: July 30, 2019
    Publication date: November 21, 2019
    Inventors: Beng So RYU, Hark Yong KIM, Gwan Yoo KIM, Dong Woo SHIN, Seong Ho SONG, Jang Hyun KIM
  • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190355744
    Abstract: A semiconductor device includes a plurality of channel structures on a substrate, each channel structure extending in a first direction perpendicular to the substrate, and having a gate insulating layer and a channel layer, a common source extension region including a first semiconductor layer having an n-type conductivity between the substrate and the channel structures, a plurality of gate electrodes on the common source extension region and spaced apart from each other on a sidewall of each of the channel structures in the first direction, and a common source region on the substrate in contact with the common source extension region and including a second semiconductor layer having an n-type conductivity, wherein the gate insulating layer of each of the channel structures extends to cover an upper surface and at least a portion of a bottom surface of the common source extension region.
    Type: Application
    Filed: July 30, 2019
    Publication date: November 21, 2019
    Inventors: Kwang-soo KIM, Yong-seok KIM, Tae-hun KIM, Min-kyung BAE, Jae-hoon JANG, Kohji KANAMORI
  • COMPARATOR OFFSET VOLTAGE SELF-CORRECTION CIRCUIT
    Publication number: 20190356325
    Abstract: A comparator offset voltage self-correction circuit is disclosed. A comparator offset voltage which is caused by the semiconductor process parameter randomness also has randomness. Due to the randomness of the comparator offset voltage, a reference voltage of a parallel comparator in a parallel-conversion-type analog-to-digital converter is uncertain. If the comparator offset voltage is large, the parallel-conversion-type analog-to-digital converter may even have a functional error. The comparator offset voltage self-correction circuit provided in the present invention can correct a random offset voltage of a comparator to meet requirements.
    Type: Application
    Filed: June 27, 2016
    Publication date: November 21, 2019
    Inventors: RONG-BIN HU, YONG-LU WANG, GANG-YI HU, HE-QUAN JIANG, ZHENG-PING ZHANG, GUANG-BING CHEN, DONG-BING FU, YU-XIN WANG, LEI ZHANG, RONG-KE YE, CAN ZHU, YU-HAN GAO
  • FRAME SYNCHRONOUS PACKET SWITCHING FOR HIGH-DEFINITION MULTIMEDIA INTERFACE (HDMI) VIDEO TRANSITIONS
    Publication number: 20190356881
    Abstract: An apparatus for use in a high-definition media interface (HDMI) source device includes an HDMI interface for transmitting video data and metadata to a sink device. The apparatus is configured to encode the metadata in an auxiliary video information (AVI) information frame (InfoFrame). The apparatus is further configured to transmit the AVI InfoFrame during a frame synchronous transmission window (FSTW) of the video data, wherein the FSTW begins during a video blanking interval (VBI) of the video data, on a first video blank pixel that immediately follows a last active video pixel of a preceding video frame or video field and ends a predetermined number of video lines after a start of the VBI.
    Type: Application
    Filed: May 17, 2018
    Publication date: November 21, 2019
    Inventors: Jiong Huang, Laurence A. Thompson, Le Yuan, Hua Long, Yong Su, Zhigui Wei, Feng Wang
  • METHOD TO REDUCE KINK EFFECT IN SEMICONDUCTOR DEVICES
    Publication number: 20190355731
    Abstract: In some embodiments, a method for forming a semiconductor device is provided. The method includes forming a pad stack over a semiconductor substrate, where the pad stack includes a lower pad layer and an upper pad layer. An isolation structure having a pair of isolation segments separated in a first direction by the pad stack is formed in the semiconductor substrate. The upper pad is removed to form an opening, where the isolation segments respectively have opposing sidewalls in the opening that slant at a first angle. A first etch is performed that partially removes the lower pad layer and isolation segments in the opening so the opposing sidewalls slant at a second angle greater than the first angle. A second etch is performed to round the opposing sidewalls and remove the lower pad layer from the opening. A floating gate is formed in the opening.
    Type: Application
    Filed: May 16, 2018
    Publication date: November 21, 2019
    Inventors: Hung-Ling Shih, Chieh-Fei Chiu, Po-Wei Liu, Wen-Tuo Huang, Yu-Ling Hsu, Yong-Shiuan Tsair, Shih Kuang Yang
  • USER APPARATUS AND METHOD OF OPERATING SAME
    Publication number: 20190350293
    Abstract: Disclosed is a user head mounted protection apparatus. The user head mounted protection apparatus includes a warning element management device that identifies a warning element by using sensing information generated by sensing a nearby object to generate location information of the warning element, a sensor that detects a rotation of the user head mounted protection apparatus to generate rotation angle information, a corrector that corrects the location information of the warning element by using the rotation angle information, a sound source processor that binaurally renders a sound source by using the location information of the warning element or the corrected location information, and an output device that outputs the binaurally rendered sound source.
    Type: Application
    Filed: August 2, 2019
    Publication date: November 21, 2019
    Inventor: Yong Joo KIM
  • ASSEMBLING METHOD OF CAMERA MODULE
    Publication number: 20190353986
    Abstract: An assembling method is provided for assembling a camera module with a substrate and a lens module includes the following steps. In a step (A), a sensing chip is installed on a surface of the substrate. In a step (B), a fixture is assembled with the substrate, wherein plural inner walls of the fixture are arranged around at least a lateral edge of the substrate. In a step (C), a glue is coated on a periphery of the surface of the substrate, wherein a movable range of the glue is limited by the plural inner walls of the fixture. In a step (D), a lens holder of the lens module is installed on the surface of the substrate, so that the lens holder and the substrate are combined together through the glue. In a step (E), the fixture is separated from the substrate.
    Type: Application
    Filed: August 23, 2018
    Publication date: November 21, 2019
    Inventors: Chin-Ding Lai, Han-Kai Wang, Yong-De Huang
  • METHOD AND APPARATUS FOR CODING/DECODING IMAGE
    Publication number: 20190356924
    Abstract: Disclosed are a method and an apparatus for coding/decoding an image. The method for decoding the image comprises the steps of: deriving a scale factor of a current block, depending on whether the current block is a conversion skip block; and scaling the current block on the basis of the scale factor, wherein the scale factor of the current block is derived on the basis of the position of a conversion coefficient inside the current block, and wherein the conversion skip block is the current block to which conversion is not applied and is specified on the basis of information indicating whether to apply reconversion to the current block.
    Type: Application
    Filed: August 2, 2019
    Publication date: November 21, 2019
    Applicants: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE, UNIVERSITY-INDUSTRY COOPERATION GROUP OF KYUNG HEE UNIVERSITY
    Inventors: Hui Yong Kim, Sung Chang Lim, Jin Ho Lee, Jin Soo Choi, Jin Woong Kim, Gwang Hoon Park, Kyung Yong Kim
  • BESPOKE PROGRAMMABLE CRYPTO TOKEN
    Publication number: 20190356473
    Abstract: An example operation may include one or more of receiving proof of performance of an activity from a receiver system, identifying a data block, among a hash-linked chain of data blocks, that includes a bespoke crypto token associated with the activity, reading one or more requirements of the activity based on programmable instructions embedded within the bespoke crypto-token, determining whether the one or more requirements of the activity have been satisfied based on content included within the proof of performance, and in response to the one or more requirements being satisfied, releasing the crypto token to the receiver system.
    Type: Application
    Filed: May 15, 2018
    Publication date: November 21, 2019
    Inventors: Jonathan M.C. Rosenoer, Stanley W.K. Yong
  • WIRELESS POWER DEVICE HAVING PLURALITY OF TRANSMISSION COILS AND DRIVING METHOD THEREFOR
    Publication number: 20190356175
    Abstract: A wireless power transmitter having a plurality of transmission coils is disclosed. The present transmitter comprises: first to Nth coils; and a control unit for transmitting, to a wireless power receiver, a first sensing signal through the first to Nth coils, and adjusting transmission orders of the first to Nth coils for transmitting a second sensing signal, on the basis of the signal strength of a received first signal strength indicator when the first signal strength indicator corresponding to the first sensing signal is received, wherein the control unit can transmit, to the receiver, the second sensing signal through the first to Nth coils on the basis of the adjusted transmission orders. Therefore, device efficiency and user convenience can be improved.
    Type: Application
    Filed: February 2, 2017
    Publication date: November 21, 2019
    Applicant: LG INNOTEK CO., LTD.
    Inventors: Min Young JO, Jong Heon LEE, Yong Suk CHAE
  • BULK ACOUSTIC WAVE RESONATOR AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20190356293
    Abstract: A bulk acoustic wave resonator includes a substrate; a lower electrode disposed on the substrate; a piezoelectric layer disposed to cover at least a portion of the lower electrode; an upper electrode disposed to cover at least a portion of the piezoelectric layer; and a passivation layer disposed to cover at least a portion of the upper electrode, wherein the passivation layer includes a non-trimming-processed portion disposed outside an active region of the bulk acoustic wave resonator in which portions of the lower electrode, the piezoelectric layer, and the upper electrode overlap, and having a thickness that is thicker than a thickness of a portion of the passivation layer disposed in the active region.
    Type: Application
    Filed: May 1, 2019
    Publication date: November 21, 2019
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong Suk KIM, Moon Chul LEE, Sung Jun LEE, Chang Hyun LIM, Jae Hyoung GIL, Sang Hyun YI
  • SEMICONDUCTOR STRUCTURE AND FABRICATION METHOD THEREOF
    Publication number: 20190355720
    Abstract: Semiconductor structure and method for fabricating a semiconductor structure are provided. A substrate including device regions and an isolation region located adjacent to and between the device regions is provided. A fin on the substrate, gate structures across the fin at the device regions, source/drain doped regions in the fin at two sides of each of the gate structures, and a sacrificial gate across the fin at the isolation region are provided. The sacrificial gate and a portion of the fin near a bottom of the sacrificial gate are removed, thus forming a first opening in the fin. An insulation structure in the first opening is formed. Two sides of the sacrificial gate are in contact with the source/drain doped regions at adjacent device regions. A top surface of the insulation structure is flush with or higher than top surfaces of the source/drain doped regions.
    Type: Application
    Filed: May 20, 2019
    Publication date: November 21, 2019
    Inventors: Wu Feng DENG, De Biao HE, Chang Yong XIAO
  • EMBEDDING MAGNETIC MATERIAL IN A CORED OR CORELESS SEMICONDUCTOR PACKAGE
    Publication number: 20190355675
    Abstract: Techniques for fabricating a semiconductor package having magnetic materials embedded therein are described. For one technique, fabrication of package includes: forming a pad and a conductive line on a build-up layer; forming a raised pad structure on the build-up layer, the raised pad comprising a pillar structure on the pad; encapsulating the conductive line and the raised pad structure in a magnetic film comprising one or more magnetic fillers; planarizing a top surface of the magnetic film until top surfaces of the raised pad structure and the magnetic film are co-planar; depositing a primer layer on the top surfaces; removing one or more portions of the primer layer above the raised pad structure to create an opening; and forming a via in the opening on the raised pad structure. The primer layer may comprise one or more of a build-up layer, a photoimageable dielectric layer, and a metal mask.
    Type: Application
    Filed: May 17, 2018
    Publication date: November 21, 2019
    Inventors: Kyu-Oh LEE, Sai VADLAMANI, Rahul JAIN, Junnan ZHAO, Ji Yong PARK, Cheng XU, Seo Young KIM
  • Air conditioning system for vehicle
    Patent number: 10479164
    Abstract: The present invention provides an air conditioning system for a vehicle, which includes an evaporator mounted in a cold air passageway and a condenser mounted in a warm air passageway inside an air-conditioning case to perform cooling and heating, and protecting means for surrounding a plurality of electronic units mounted on the outer surfaces of the air-conditioning case and blowers, thereby preventing breakdowns and malfunctions by preventing foreign matters or water from entering into the electronic units.
    Type: Grant
    Filed: April 14, 2016
    Date of Patent: November 19, 2019
    Assignee: HANON SYSTEMS
    Inventors: Jae Chun Ryu, Tae Yong Park, Yong Nam Ahn, Sung Je Lee, Se Min Lee