Patents by Inventor Yong Bai Son

Yong Bai Son has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6162512
    Abstract: A process for modifying a nitride surface includes irradiating energized ion particles onto the nitride surface while blowing a reactive gas directly on the nitride surface under a vacuum condition. An aluminum nitride for a direct bond copper (DBC) can be obtained by forming a thin copper film on the thusly modified nitride.
    Type: Grant
    Filed: April 18, 1997
    Date of Patent: December 19, 2000
    Assignee: Korea Institute of Science and Technology
    Inventors: Seok Keun Koh, Hyung Jin Jung, Won Kook Choi, Yong Bai Son
  • Patent number: 5846891
    Abstract: A thermal shock-resistant alumina-mullite composite material and a preparation method thereof which are capable of concurrently obtaining the compactness of the material and a mullite formation. The material is comprised of 4.about.30 weight % of one aluminum silicate selected from the group consisting of kaolinite, silimanite, and kyanite, 75.about.94 weight % of Al.sub.2 O.sub.3 based on the total amount of Al.sub.2 O.sub.3, and 0.5.about.6 weight % of an alkaline earth metal oxide, wherein the weight ratio of the alkaline earth metal oxide to SiO.sub.2 is 1:2.about.1:3. The composition is first sintered at a temperature of 1450.degree..about.1650.degree. C. for 1.about.5 hours, then cooled down to 1000.degree. C., and then crystallized at a temperature of 1200.degree..about.1500.degree. C. for 1.about.20 hours. This composition is usable to a maximum temperature 300.degree. C.
    Type: Grant
    Filed: June 10, 1997
    Date of Patent: December 8, 1998
    Assignee: Korea Institute of Science and Technology
    Inventors: Yong Bai Son, In-Jae Jung, Sang-Woo Kim