Patents by Inventor Yong Bin HUANG

Yong Bin HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Fan-out structure and manufacture thereof
    Patent number: 10446511
    Abstract: A fan-out structure and its manufacturing method are presented, relating to semiconductor techniques. The fan-out structure includes a welding pad; a welding pad extension member contacting the welding pad; and a fan-out line contacting the welding pad extension member, with an elicitation direction of the fan-out line perpendicular to an extension direction of the welding pad. This fan-out structure allows the fan-out line to be horizontally or vertically elicited from the welding pad, and thus remedies the drawbacks associated with an aslant-elicited fan-out line in conventional fan-out structures.
    Type: Grant
    Filed: May 16, 2018
    Date of Patent: October 15, 2019
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventors: Hong Zhang, Hae Wan Yang, Yong Bin Huang, Qian Zhou, Chao Feng Zhou
  • FAN-OUT STRUCTURE AND MANUFACTURE THEREOF
    Publication number: 20180337152
    Abstract: A fan-out structure and its manufacturing method are presented, relating to semiconductor techniques. The fan-out structure includes a welding pad; a welding pad extension member contacting the welding pad; and a fan-out line contacting the welding pad extension member, with an elicitation direction of the fan-out line perpendicular to an extension direction of the welding pad. This fan-out structure allows the fan-out line to be horizontally or vertically elicited from the welding pad, and thus remedies the drawbacks associated with an aslant-elicited fan-out line in conventional fan-out structures.
    Type: Application
    Filed: May 16, 2018
    Publication date: November 22, 2018
    Inventors: Hong ZHANG, Hae Wan YANG, Yong Bin HUANG, Qian ZHOU, Chao Feng ZHOU