Patents by Inventor Yong-chae NA

Yong-chae NA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD FOR FORMING THROUGH-VIA METAL WIRING
    Publication number: 20240080993
    Abstract: A method for forming through-via metal wiring is disclosed. According to the method, through-via metal wiring can be formed with excellent plating quality without an expensive sputtering process by bonding a metal foil to one side of a substrate having a through-via formed therein and using the foil as a metal seed layer.
    Type: Application
    Filed: August 28, 2023
    Publication date: March 7, 2024
    Applicant: EXTOLCO.,LTD.
    Inventors: Sung Woong KIM, Wook Hwan, Nam-jin Kim, Yong-chae NA