Abstract: Die-bonding equipment and a method for detecting adhesive dotting on a substrate are disclosed. A dotted adhesive pattern illustrating an actually dotted state of the adhesive on a substrate is overlap-photographed with a standard pattern illustrating proper dotting pattern. The overlap-photographed pattern is compared with a standard overlap pattern. According to the compared result, whether the adhesive is properly dotted on the substrate is decided. When the adhesive is not properly dotted, an alarm signal is generated.

Abstract: A lead frame transfer device includes a platform, and front and rear fingers for moving the lead frame from a transfer position to a feeding position, via the platform, with minimal impact and while producing minimal mechanical abrasion. Each of the fingers includes a plate-like support for the lead frame, a vertical cylinder for moving the support in a vertical direction, and a horizontal cylinder for moving the support in a horizontal direction. The device also has a sensor for detecting the presence of a lead frame on the platform, and which detection is used to control the movement of the plate-like supports. A wire bonding apparatus employs two of such transfer devices on either side of a wire bonding head. Transfer rails extend past the transfer devices.

Abstract: A method and appratus for transporting a lead frame on air rails, wherein the lead frame is moved by pressurized air, and an in-line package assembly system using the method and apparatus.

Abstract: An apparatus for serially transferring lead frames from a container containing a plurality of lead frames and buffering materials, which are stacked alternatively, to a die bonding process. The apparatus includes a guide bar provided with first pads for picking up a lead frame and second pads for picking up a sheet of buffering material, the first and second pads being moved concurrently downward and upward and vibrated.