Patents by Inventor Yong Chua Teo

Yong Chua Teo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame for an integrated circuit chip
    Patent number: 6621151
    Abstract: A lead-frame for connecting and supporting an integrated circuit having an apertured frame with dimensions smaller than the corresponding dimensions of the chip so that chip-pad shoulder can be eliminated and the chip attach fillet is made remote from the chip corner.
    Type: Grant
    Filed: February 7, 2000
    Date of Patent: September 16, 2003
    Assignee: Institute of Microelectronics
    Inventors: Tai Chong Chai, Thiam Beng Lim, Yong Chua Teo, James Tan, Raymundo Camenforte, Eric Neo, Daniel Yap
  • Lead frame for an integrated circuit chip (integrated circuit peripheral support)
    Patent number: 6583501
    Abstract: A lead-frame for connecting and supporting an integrated circuit chip with a chip accommodating zone with inwardly extending ears for supporting the chip including minimum shoulder area, and having open crack and delamination stopping regions.
    Type: Grant
    Filed: February 7, 2000
    Date of Patent: June 24, 2003
    Assignee: Institute of Microelectronics
    Inventors: Tai Chong Chai, Thiam Beng Lim, Yong Chua Teo, James Tan, Ray Camenforte, Eric Neo, Daniel Yap
  • Lead frame for an integrated circuit chip (integrated circuit peripheral support)
    Publication number: 20020163078
    Abstract: A lead-frame for connecting and supporting an integrated circuit chip with a chip accommodating zone with inwardly extending ears for supporting the chip including minimum shoulder area, and having open crack and delamination stopping regions.
    Type: Application
    Filed: February 7, 2000
    Publication date: November 7, 2002
    Inventors: Tai-Chong Chai, Thiam Beng Lim, Yong Chua Teo, James Tan, Raymundo Camenforte, Eric Neo, Daniel Yap