Patents by Inventor Yong Chuan Koh

Yong Chuan Koh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process
    Patent number: 8247272
    Abstract: A semiconductor package and a method for constructing the package are disclosed. The package includes a substrate and a die attached thereto. A first contact region is disposed on the substrate and a second contact region is disposed on the die. The first contact region, for example, comprises copper coated with an OSP material. A copper wire bond electrically couples the first and second contact regions. Wire bonding includes forming a ball bump on the first contact region having a flat top surface. Providing the flat top surface is achieved with a smoothing process. A ball bond is formed on the second contact region, followed by stitching the wire onto the flat top surface of the ball bump on the first contact region.
    Type: Grant
    Filed: June 22, 2009
    Date of Patent: August 21, 2012
    Assignee: United Test and Assembly Center Ltd.
    Inventors: Yong Chuan Koh, Jimmy Siat, Jeffrey Nantes Salamat, Lope Vallespin Pepito, Jr., Ronaldo Cayetano Calderon, Rodel Manalac, Pang Hup Ong, Kian Teng Eng
  • COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT AND ENHANCED WIRE BONDING PROCESS
    Publication number: 20100025849
    Abstract: A semiconductor package and a method for constructing the package are disclosed. The package includes a substrate and a die attached thereto. A first contact region is disposed on the substrate and a second contact region is disposed on the die. The first contact region, for example, comprises copper coated with an OSP material. A copper wire bond electrically couples the first and second contact regions. Wire bonding includes forming a ball bump on the first contact region having a flat top surface. Providing the flat top surface is achieved with a smoothing process. A ball bond is formed on the second contact region, followed by stitching the wire onto the flat top surface of the ball bump on the first contact region.
    Type: Application
    Filed: June 22, 2009
    Publication date: February 4, 2010
    Applicant: UNITED TEST AND ASSEMBLY CENTER LTD.
    Inventors: Yong Chuan KOH, Jimmy SIAT, Jeffrey Nantes SALAMAT, Lope Vallespin PEPITO, JR., Ronaldo Cayetano CALDERON, Rodel MANALAC, Pang Hup ONG, Kian Teng ENG
  • COPPER ON ORGANIC SOLDERABILITY PRESERVATIVE (OSP) INTERCONNECT
    Publication number: 20090008796
    Abstract: Provided is a semiconductor package, and a method for constructing the same, including a first substrate, a first semiconductor chip attached to the first substrate, and a first copper wire. At least one of the first substrate and the first semiconductor chip has an Organic Solderability Preservative (OSP) material coated on at least a portion of one surface, and the first copper wire is wire bonded through the OSP material to the first substrate and the first semiconductor chip.
    Type: Application
    Filed: December 27, 2007
    Publication date: January 8, 2009
    Applicants: United Test and Assembly Center Ltd.
    Inventors: Kian Teng Eng, Wolfgang Johannes HETZEL, Werner Josef REISS, Florian AMMER, Yong Chuan KOH, Jimmy SIAT