Abstract: A device for locating an object. The device includes a housing including a first hole. The device also includes a sensor carried by the housing and comprising two or more electrodes that are positioned next to each other to form a substantially circular configuration. The sensor includes a second hole formed in the center of the circular configuration, and the second hole is axially aligned with the first hole.

Abstract: A device for locating an object. The device includes a housing including a first hole. The device also includes a sensor carried by the housing and comprising two or more electrodes that are positioned next to each other to form a substantially circular configuration. The sensor includes a second hole formed in the center of the circular configuration, and the second hole is axially aligned with the first hole.

Abstract: A device for locating an object. The device includes a housing including a first hole. The device also includes a sensor carried by the housing and comprising two or more electrodes that are positioned next to each other to form a substantially circular configuration. The sensor includes a second hole formed in the center of the circular configuration, and the second hole is axially aligned with the first hole.

Abstract: A device for locating an object. The device includes a housing including a first hole. The device also includes a sensor carried by the housing and comprising two or more electrodes that are positioned next to each other to form a substantially circular configuration. The sensor includes a second hole formed in the center of the circular configuration, and the second hole is axially aligned with the first hole.

Abstract: A hidden object sensor which detects objects behind a surface. The hidden object sensor includes a housing. A capacitive sensor is carried by the housing. The capacitive sensor includes two or more electrodes. The hidden object sensor also includes an inductive sensor disposed in the housing. The inductive sensor surrounds the capacitive sensor in a radial direction such that there is a gap between the inductive sensor and the capacitive sensor.

Abstract: This disclosure describes a stud sensor configured to locate a stud. The stud sensor includes a housing and a sensor carried by the housing. The sensor includes two or more electrodes. The two or more electrodes are configured to form a substantially circular configuration. The stud sensor further comprises one or more processors carried by the housing. The one or more processors are communicatively coupled with the sensor. The one or more processors are configured by machine-readable instructions to calculate a stud location by measuring a change in capacitance from a fixed capacitance of a wall structure as the stud sensor is moved along a surface of the wall structure; and generate one or more signals to report a result relating to a location of a stud.

Abstract: A device for locating an object. The device includes a housing including a first hole. The device also includes a sensor carried by the housing and comprising two or more electrodes that are positioned next to each other to form a substantially circular configuration. The sensor includes a second hole formed in the center of the circular configuration, and the second hole is axially aligned with the first hole.

Abstract: A hidden object sensor which detects objects behind a surface. The hidden object sensor includes a housing. A capacitive sensor is carried by the housing. The capacitive sensor includes two or more electrodes. The hidden object sensor also includes an inductive sensor disposed in the housing. The inductive sensor surrounds the capacitive sensor in a radial direction such that there is a gap between the inductive sensor and the capacitive sensor.

Abstract: This disclosure describes a stud sensor configured to locate a stud. The stud sensor includes a housing and a sensor carried by the housing. The sensor includes two or more electrodes. The two or more electrodes are configured to form a substantially circular configuration. The stud sensor further comprises one or more processors carried by the housing. The one or more processors are communicatively coupled with the sensor. The one or more processors are configured by machine-readable instructions to calculate a stud location by measuring a change in capacitance from a fixed capacitance of a wall structure as the stud sensor is moved along a surface of the wall structure; and generate one or more signals to report a result relating to a location of a stud.