Abstract: A lamp hinge includes a first connector and a second connector pivotally connecting with the first connector. The first connector defines a circular groove therein. The second connector has a pivotal portion pivotally engaging the first connector, and a mounting portion connecting with a lamp head of the lamp. The pivotal portion defines a curved groove therein. The mounting portion defines a central hole therein. A plurality of ball bearings are movably sandwiched between the pivotal portion and the first connector and received in the circular groove and the curved groove. The ball bearings separate the first connector from the second connector a space. Two neighboring ball bearings define a gap therebetween, for providing passage of the electric wires of the lamp therethrough. The gap communicates with the central hole of the mounting portion of the second connector.

Abstract: An LED lamp includes a post (10), a heat sink (20) enclosing the post, an LED module (30) mounted in the post, a holder (40) secured on the LED module, and a lens (50) covering the holder. The heat sink is formed by a plurality of fins (22), each having an annular and planar configuration to contact and surround the post. The fins are parallel to each other and mounted on the post along a length direction of the post. An LED (32) of the LED module is received in the holder, whereby light generated by the LED is reflected by the holder.

Abstract: A lamp hinge includes a first connector and a second connector pivotally connecting with the first connector. The first connector is formed on an upper end of a lamp pole and defines a circular chamber therein. The second connector is for connecting with a lamp head. Two arced engaging portions are formed on the second connector and are pivotally received in the chamber. The arced engaging portions are distributed in a same annulus and define a first arced gap and a second arced gap therebetween, adapted for providing passage of electric wires of the lamp. The first arced gap is communicated with a central hole of a mounting portion of the second connector. The second arced gap is communicated with a recessed portion of the lamp pole. The second arced gap is longer than five twelfths of a perimeter of the annulus where the arced engaging portions are distributed.

Abstract: A recessed LED lamp for being mounted in a wall or a ceiling, includes a housing (10), a printed circuit board (20) received in the housing, a plurality of LEDs (22) mounted on the printed circuit board, a casing (40) surrounding the housing, a pair of arms (50) resiliently and pivotably attached on the casing, and a heat sink (30) secured below the housing. The heat sink includes a base (32) contacting the printed circuit board and thermally connecting therewith, a plate (34) extending outwardly from the base and a plurality of fins (36) extending downwardly from the plate (34).

Abstract: An LED recessed lamp for being received in a wall, including a housing (10), a plurality of LEDs (20) embedded into the housing, a heat sink (30) secured below the housing, a casing (40) enclosing the housing, and a pair of arms (50) resiliently and pivotably attached on the casing. The casing is fixed to the housing by using a screwdriver to screw screws (60) through the casing and into the housing, which provides a convenient assembling of the LED recessed lamp. The screwed connection between the housing and the casing enables a user to easily disassemble the housing from the casing if a flawed component is needed to be replaced or mended.

Abstract: An LED lamp includes a post (10), a heat sink (20) enclosing the post, an LED module (30) mounted on the post, a holder (40) secured on the LED module, and a lens (50) covering the holder. The heat sink is formed by a plurality of separated fins assembled together. Each fin comprises an outer portion (22) and an inner portion (24). An inner edge of the outer portion abuts interferingly against a periphery of the post, and a bottom of the inner portion contacts a top surface of the post. Heat generated by the LED module is conducted through the post to the plurality of fins, which dissipate the heat to the ambient air.

Abstract: An LED lamp includes a lamp base, a heat sink mounted on the lamp base and a plurality of LED modules thermally contacting with the heat sink. The lamp base defines a plurality of vents therein. The heat sink includes a central cylinder and a plurality of fins spaced from and surrounding the cylinder. The cylinder defines a through hole therein, which communicates with the vents of the lamp base and cooperates with the vents to form an air passage communicating with ambient air. An included angle is defined between each of the fins and a central axis of the cylinder. The LED modules are mounted on outmost ones of the fins of the heat sink, respectively.

Abstract: A heat dissipation system is used for dissipating heat generated by an electronic device mounted on a printed circuit board. The heat dissipation system includes an enclosure adapted to receive the electronic device therein, the enclosure having a base plate on which the printed circuit board is mounted. A spreader adapted for contacting the electronic device in the enclosure. A plurality of fins disposed between the printed circuit board and the base plate, the fins thermally engaging with the base plate. A heat pipe is used to thermally connect the spreader and the fins together, which are positioned at opposite sides of the printed circuit board, respectively. Accordingly, the enclosure can help to dissipate the heat generated by the electronic device.

Abstract: A heat dissipation device is used for dissipating heat from a CPU and electronic components. The heat dissipation device includes a heat absorbing portion for absorbing heat from the CPU, and a heat sink located on the heat absorbing portion. The heat sink includes a plurality of curved fins defining a plurality of curved passages therebetween. An airflow source is located adjacent to the heat sink for providing forced airflow to the heat sink. A direction of the airflow from the airflow source is changed when it passes through the passages. A direction of the airflow out of the passages is perpendicular to a direction of the airflow into the passages. The airflow out of the heat sink further flows to the electronic components located adjacent to the CPU.

Abstract: A heat dissipation device includes a heat sink (10) and a first heat pipe (20) enclosing a bottom edge of the heat sink. The heat sink includes a base (12) defining a first passage (120) extending therethrough. The first heat pipe includes a first transferring section (22) extending in the first passage and totally embedded in the base and a pair of first dissipating sections (24) extending from the first transferring section. The first dissipating sections of the first heat pipe are attached on an outer periphery of the base. The first transferring section of the first heat pipe absorbs heat in the middle of the base and transfers it to the first dissipating sections to evenly distribute the heat throughout the whole base.

Abstract: A heat dissipation device includes a base and a fin set arranged on the base. The fin set includes a plurality of fins each having an undulating body and two flanges extending from the body. The body includes a plurality of peak faces, a plurality of trough faces alternating with the peak faces and a plurality of slanted faces each connecting adjacent peak face and trough face. The peak faces of each fin conform to the peak faces of an adjacent fin, while the trough faces of each fin conform to the trough faces of the adjacent fin. Pluralities of undulating passages are defined between two adjacent fins. Each heat pipe has a first section contacting the base and a second section extending through the fin set. A fan is located corresponding to the passages of the fin set for providing forced airflow to the fin set.

Abstract: A heat dissipation apparatus adapted for removing heat from a heat-generating electronic component, includes a conducting core, a plurality of conducting arms, a plurality of fins and a heat pipe assembly. The conducting core comprises a heat-absorbing portion contacting with the heat-generating electronic component. The conducting arms extend radially and outwardly from the conducting core. The fins extend outwardly from the respective conducting arms. Each of the heat pipes comprises an evaporating section thermally attached to the heat-absorbing portion of the conducting core and at least one condensing section thermally coupled to the respective conducting arm.

Abstract: A heat dissipation device is used for dissipating heat from a CPU and electronic components. The heat dissipation device includes a heat absorbing portion for absorbing heat from the CPU, and a heat sink located on the heat absorbing portion. The heat sink includes a plurality of curved fins defining a plurality of curved passages therebetween. An airflow source is located adjacent to the heat sink for providing forced airflow to the heat sink. A direction of the airflow from the airflow source is changed when it passes through the passages. A direction of the airflow out of the passages is perpendicular to a direction of the airflow into the passages. The airflow out of the heat sink further flows to the electronic components located adjacent to the CPU.