Abstract: An LED lamp includes a post (10), a heat sink (20) enclosing the post, an LED module (30) mounted in the post, a holder (40) secured on the LED module, and a lens (50) covering the holder. The heat sink is formed by a plurality of fins (22), each having an annular and planar configuration to contact and surround the post. The fins are parallel to each other and mounted on the post along a length direction of the post. An LED (32) of the LED module is received in the holder, whereby light generated by the LED is reflected by the holder.

Abstract: An LED recessed lamp for being received in a wall, including a housing (10), a plurality of LEDs (20) embedded into the housing, a heat sink (30) secured below the housing, a casing (40) enclosing the housing, and a pair of arms (50) resiliently and pivotably attached on the casing. The casing is fixed to the housing by using a screwdriver to screw screws (60) through the casing and into the housing, which provides a convenient assembling of the LED recessed lamp. The screwed connection between the housing and the casing enables a user to easily disassemble the housing from the casing if a flawed component is needed to be replaced or mended.

Abstract: An LED lamp includes a post (10), a heat sink (20) enclosing the post, an LED module (30) mounted on the post, a holder (40) secured on the LED module, and a lens (50) covering the holder. The heat sink is formed by a plurality of separated fins assembled together. Each fin comprises an outer portion (22) and an inner portion (24). An inner edge of the outer portion abuts interferingly against a periphery of the post, and a bottom of the inner portion contacts a top surface of the post. Heat generated by the LED module is conducted through the post to the plurality of fins, which dissipate the heat to the ambient air.

Abstract: The present invention relates to processes and intermediates for the preparation of compounds useful as inhibitors of bacterial gyrase and Topoisomerase IV (Topo IV).

Abstract: This invention relates to novel substituted pyridinones, their derivatives, pharmaceutically acceptable salts, solvates, and hydrates thereof. This invention also provides compositions comprising a compound of this invention and the use of such compositions in methods of treating diseases and conditions that are beneficially treated by administering a TNF (tumor necrosis factor)-alpha production inhibitor/TGF (transforming growth factor)-beta inhibitor.

Abstract: An LED lamp includes a lamp base, a heat sink mounted on the lamp base and a plurality of LED modules thermally contacting with the heat sink. The lamp base defines a plurality of vents therein. The heat sink includes a central cylinder and a plurality of fins spaced from and surrounding the cylinder. The cylinder defines a through hole therein, which communicates with the vents of the lamp base and cooperates with the vents to form an air passage communicating with ambient air. An included angle is defined between each of the fins and a central axis of the cylinder. The LED modules are mounted on outmost ones of the fins of the heat sink, respectively.

Abstract: The present application discloses a casing and a corresponding mounting device, for protecting pins of an element from melting during a process flow in which the element is soldered on a circuit board, while saving an area required for soldering the element on the circuit board. The casing comprises a hollow body provided with at least one opening.

Abstract: A separator for a communication cable includes a plurality of barriers formed in a radial direction so that at least two pair units, in each of which at least two insulation-coated wires are spirally twisted, are received in spaces formed by the barriers one by one so as to separate the pair units from each other. At least one of the barriers has a relatively greater thickness than the other barriers. Thus, a communication cable having the separator may prevent PSNEXT (Power Sum Near and Crosstalk) caused by interference between adjacent wires when a high frequency signal is transmitted through the wires.

Abstract: A heat dissipation device is used for dissipating heat from a CPU and electronic components. The heat dissipation device includes a heat absorbing portion for absorbing heat from the CPU, and a heat sink located on the heat absorbing portion. The heat sink includes a plurality of curved fins defining a plurality of curved passages therebetween. An airflow source is located adjacent to the heat sink for providing forced airflow to the heat sink. A direction of the airflow from the airflow source is changed when it passes through the passages. A direction of the airflow out of the passages is perpendicular to a direction of the airflow into the passages. The airflow out of the heat sink further flows to the electronic components located adjacent to the CPU.

Abstract: A heat dissipation system is used for dissipating heat generated by an electronic device mounted on a printed circuit board. The heat dissipation system includes an enclosure adapted to receive the electronic device therein, the enclosure having a base plate on which the printed circuit board is mounted. A spreader adapted for contacting the electronic device in the enclosure. A plurality of fins disposed between the printed circuit board and the base plate, the fins thermally engaging with the base plate. A heat pipe is used to thermally connect the spreader and the fins together, which are positioned at opposite sides of the printed circuit board, respectively. Accordingly, the enclosure can help to dissipate the heat generated by the electronic device.

Abstract: A heat dissipation device includes a heat sink (10) and a first heat pipe (20) enclosing a bottom edge of the heat sink. The heat sink includes a base (12) defining a first passage (120) extending therethrough. The first heat pipe includes a first transferring section (22) extending in the first passage and totally embedded in the base and a pair of first dissipating sections (24) extending from the first transferring section. The first dissipating sections of the first heat pipe are attached on an outer periphery of the base. The first transferring section of the first heat pipe absorbs heat in the middle of the base and transfers it to the first dissipating sections to evenly distribute the heat throughout the whole base.

Abstract: A heat dissipation device includes a base and a fin set arranged on the base. The fin set includes a plurality of fins each having an undulating body and two flanges extending from the body. The body includes a plurality of peak faces, a plurality of trough faces alternating with the peak faces and a plurality of slanted faces each connecting adjacent peak face and trough face. The peak faces of each fin conform to the peak faces of an adjacent fin, while the trough faces of each fin conform to the trough faces of the adjacent fin. Pluralities of undulating passages are defined between two adjacent fins. Each heat pipe has a first section contacting the base and a second section extending through the fin set. A fan is located corresponding to the passages of the fin set for providing forced airflow to the fin set.

Abstract: A heat dissipation apparatus adapted for removing heat from a heat-generating electronic component, includes a conducting core, a plurality of conducting arms, a plurality of fins and a heat pipe assembly. The conducting core comprises a heat-absorbing portion contacting with the heat-generating electronic component. The conducting arms extend radially and outwardly from the conducting core. The fins extend outwardly from the respective conducting arms. Each of the heat pipes comprises an evaporating section thermally attached to the heat-absorbing portion of the conducting core and at least one condensing section thermally coupled to the respective conducting arm.

Abstract: A communication cable includes at least one twisted wire pair formed by twisting a plurality of insulation-coated wires; a sheath surrounding the twisted wire pair; and a protrusion formed on an outer surface of the sheath. This communication cable may prevent alien crosstalk particularly at high-speed transmission so that transmission characteristics of the communication cable may be stably kept.

Abstract: A heat dissipation device is used for dissipating heat from a CPU and electronic components. The heat dissipation device includes a heat absorbing portion for absorbing heat from the CPU, and a heat sink located on the heat absorbing portion. The heat sink includes a plurality of curved fins defining a plurality of curved passages therebetween. An airflow source is located adjacent to the heat sink for providing forced airflow to the heat sink. A direction of the airflow from the airflow source is changed when it passes through the passages. A direction of the airflow out of the passages is perpendicular to a direction of the airflow into the passages. The airflow out of the heat sink further flows to the electronic components located adjacent to the CPU.

Abstract: A heat dissipation device includes a base (40) and fins (30) attached to the base (40) and two heat pipes (20). The fins (30) include a first portion (325) and a second portion (326) connecting with one side of the first portion (325), and the second portion (326) is higher than the first portion (325). Each of the heat pipes (20) includes an evaporating portion (22) sandwiched between the base (40) and the first portion (325) of the fins (30), a condensing portion (24) inserted into the second portion (326) of the fins (30).

Abstract: A heat dissipation device includes a base and a fin set arranged on the base. The fin set includes a plurality of fins each having an undulating body and two flanges extending from the body. The body includes a plurality of peak faces, a plurality of trough faces alternating with the peak faces and a plurality of slanted faces each connecting adjacent peak face and trough face. The peak faces of each fin conform to the peak faces of an adjacent fin, while the trough faces of each fin conform to the trough faces of the adjacent fin. Pluralities of undulating passages are defined between two adjacent fins. Each heat pipe has a first section contacting the base and a second section extending through the fin set. A fan is located corresponding to the passages of the fin set for providing forced airflow to the fin set.