Patents by Inventor Yong-Durk KIM

Yong-Durk KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210183768
    Abstract: An integrated circuit (IC) includes a via stack, and the via stack includes via arrays including a plurality of vias at the same level. A plurality of vias of a via array are arranged at intersections between tracks of adjacent conductive layers and arranged along a central line between the tracks. Also, a via overlap extends parallel to tracks of a conductive layer. Thus, the number of tracks sacrificed by the via array may be reduced, and the IC may have enhanced performance and a reduced area due to improved routability.
    Type: Application
    Filed: March 1, 2021
    Publication date: June 17, 2021
    Inventor: Yong-durk Kim
  • Patent number: 10964639
    Abstract: An integrated circuit (IC) includes a via stack, and the via stack includes via arrays including a plurality of vias at the same level. A plurality of vias of a via array are arranged at intersections between tracks of adjacent conductive layers and arranged along a central line between the tracks. Also, a via overlap extends parallel to tracks of a conductive layer. Thus, the number of tracks sacrificed by the via array may be reduced, and the IC may have enhanced performance and a reduced area due to improved routability.
    Type: Grant
    Filed: October 5, 2018
    Date of Patent: March 30, 2021
    Inventor: Yong-durk Kim
  • Patent number: 10817640
    Abstract: A method of generating an integrated circuit design includes receiving input data defining input cells of the integrated circuit design, selecting first standard cells from a first standard cell library to represent the input cells having a first characteristic, selecting second standard cells from a second standard cell library to represent the input cells having a second characteristic different from the first characteristic, and generating output data representing the integrated circuit design by performing placement and routing on the selected first standard cells and the selected second standard cells. The first standard cell library includes a first type of standard cells manufactured using a first diffusion break scheme. The second standard cell library includes a second type of standard cells manufactured using a second diffusion break scheme. Each of the second type of standard cells has a same function as a respective one of the first type of standard cells.
    Type: Grant
    Filed: May 23, 2019
    Date of Patent: October 27, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-Hoon Kim, Yong-Durk Kim, Woo-Tae Kim, Hyung-Ock Kim, Joon-Young Shin
  • Patent number: 10817637
    Abstract: A system and method of designing an integrated circuit (IC) by considering a local layout effect are provided. The method of designing an IC may place instances of pre-placement cells so as to decrease occurrence of a local layout effect (LLE) causing structure. The method may extract a context of an instance from a peripheral layout of each of the placed instances to estimate an LLE of the instance, thereby analyzing a performance of the IC.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: October 27, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Naya Ha, Yong-Durk Kim, Bong-hyun Lee, Hyung-ock Kim, Kwang-ok Jeong, Jae-hoon Kim
  • Publication number: 20200151298
    Abstract: A method of generating an integrated circuit design includes receiving input data defining input cells of the integrated circuit design, selecting first standard cells from a first standard cell library to represent the input cells having a first characteristic, selecting second standard cells from a second standard cell library to represent the input cells having a second characteristic different from the first characteristic, and generating output data representing the integrated circuit design by performing placement and routing on the selected first standard cells and the selected second standard cells. The first standard cell library includes a first type of standard cells manufactured using a first diffusion break scheme. The second standard cell library includes a second type of standard cells manufactured using a second diffusion break scheme. Each of the second type of standard cells has a same function as a respective one of the first type of standard cells.
    Type: Application
    Filed: May 23, 2019
    Publication date: May 14, 2020
    Inventors: JAE-HOON KIM, YONG-DURK KIM, WOO-TAE KIM, HYUNG-OCK KIM, JOON-YOUNG SHIN
  • Publication number: 20190122984
    Abstract: An integrated circuit (IC) includes a via stack, and the via stack includes via arrays including a plurality of vias at the same level. A plurality of vias of a via array are arranged at intersections between tracks of adjacent conductive layers and arranged along a central line between the tracks. Also, a via overlap extends parallel to tracks of a conductive layer. Thus, the number of tracks sacrificed by the via array may be reduced, and the IC may have enhanced performance and a reduced area due to improved routability.
    Type: Application
    Filed: October 5, 2018
    Publication date: April 25, 2019
    Inventor: Yong-durk Kim
  • Publication number: 20180032658
    Abstract: A system and method of designing an integrated circuit (IC) by considering a local layout effect are provided. The method of designing an IC may place instances of pre-placement cells so as to decrease occurrence of a local layout effect (LLE) causing structure. The method may extract a context of an instance from a peripheral layout of each of the placed instances to estimate an LLE of the instance, thereby analyzing a performance of the IC.
    Type: Application
    Filed: July 7, 2017
    Publication date: February 1, 2018
    Inventors: Naya HA, Yong-Durk KIM, Bong-hyun LEE, Hyung-ock KIM, Kwang-ok JEONG, Jae-hoon KIM