Patents by Inventor Yong-Geun Park

Yong-Geun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100072536
    Abstract: In a non-volatile memory device and a method of manufacturing the non-volatile memory device, a tunnel insulating layer, a charge trapping layer, a dielectric layer and a conductive layer may be sequentially formed on a channel region of a substrate. The conductive layer may be patterned to form a gate electrode and spacers may be formed on sidewalls of the gate electrode. A dielectric layer pattern, a charge trapping layer pattern, and a tunnel insulating layer pattern may be formed on the channel region by an anisotropic etching process using the spacers as an etch mask. Sidewalls of the charge trapping layer pattern may be removed by an isotropic etching process to reduce the width thereof. Thus, the likelihood of lateral diffusion of electrons may be reduced or prevented in the charge trapping layer pattern and high temperature stress characteristics of the non-volatile memory device may be improved.
    Type: Application
    Filed: November 9, 2009
    Publication date: March 25, 2010
    Inventors: Se-Hoon Ho, Yong-Geun Park, Han-Mel Choi, Seung-Hwan Lee, Ki-Yeon Park, Sun-Jung Kim
  • Publication number: 20090153168
    Abstract: A hi-fix board, a test tray, a test handler, and a packaged chip manufacturing method are provided. The hi-fix board includes: test sockets to which packaged chips to be tested are connected; and a main frame in which the test sockets are disposed in at least one first area to form an a×b matrix (where a and b are integers greater than 0) and the test sockets are disposed in at least one second area to form a c×d matrix (where c is an integer greater than a and d is an integer greater than 0). By allowing the test tray to contain more packaged chips at a time and minimizing a difference in length between a horizontal direction and a vertical direction, it is possible to reduce the index time. By allowing all the packaged chips contained in a test tray to be subjected to a testing process at the same time, it is possible to reduce the time for the testing process and to enhance the stability.
    Type: Application
    Filed: December 4, 2008
    Publication date: June 18, 2009
    Inventors: Hee Rak Beom, Yong Geun Park
  • Publication number: 20080186047
    Abstract: Provided is a sorting system for handling packaged chips for testing and sorting the packaged chips by grade, capable of performing loading and unloading operations, independently of a testing operation. The sorting system includes a loading unit including a loading picker, an unloading unit provided adjacent to the loading unit, a rack in which to store at least one test tray containing the packaged chips intended for the tests and at least one test tray containing the tested packaged chips, an exchanging site where the test tray containing the packaged chips intended for the tests and the test tray containing the tested packaged chips are exchanged with the rack, and a transferring unit transferring the test tray between the loading position, the exchanging site, and the unloading position.
    Type: Application
    Filed: January 31, 2008
    Publication date: August 7, 2008
    Inventors: Hee Rak Beom, Dae Gon Yun, Yong Geun Park
  • Publication number: 20080145203
    Abstract: Provided is a method for transferring test trays in a handler including a second chamber having two test sites arranged in parallel, a first chamber having a plurality of passages along which a plurality of test trays are horizontally moved, provided over the second chamber, and a third chamber having a plurality of passages along which the plurality of test trays are horizontally moved, provided under the second chamber, the method including steps of (a) enabling two test trays to wait in parallel in a horizontal position at a waiting location provided to a forward section of the handler, (b) loading packaged chips onto the two test trays, (c) rotating the two test trays to be in the upright position, (d) moving upwards the two test trays into the first chamber, (e) heating or cooling the two test trays while moving horizontally the two test trays forward in the first chamber, (f) moving downward the two test trays from the first chamber into the second chamber, (g) moving horizontally the two test trays tow
    Type: Application
    Filed: November 21, 2007
    Publication date: June 19, 2008
    Inventors: Hyo-chul YUN, Hee-rak Beom, Jae-myeong Song, Yong-geun Park, Dae-gon Yun