Patents by Inventor Yong Ghen

Yong Ghen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Bonding apparatus and bonding method
    Patent number: 8091761
    Abstract: A bonding apparatus provided with a control unit capable of controlling the position of the central axis of a bonding tool in the X direction and the Y direction based on an image of a pad acquired with a camera and an offset amount, the apparatus including: an outline obtaining unit for obtaining each of the sides of the pad and an outline of a pressure-bonded ball by processing the image acquired with the camera; a gap length obtaining unit for obtaining gap lengths between the respective sides of the pad and the outline of the pressure-bonded ball; and an offset correcting unit for correcting the offset amount based on the gap lengths obtained by the gap obtaining unit.
    Type: Grant
    Filed: September 30, 2010
    Date of Patent: January 10, 2012
    Assignee: Shinkawa Ltd.
    Inventors: Kenji Sugawara, Yong Ghen