Patents by Inventor Yong Gwan Ko

Yong Gwan Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140048320
    Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same, the printed circuit board including an adhesion promoter (AP) film for enhancing adhesive strength, interposed between a circuit pattern and an insulating layer above a substrate, the AP film containing any one of a first polymer, a second polymer, and an organic compound. According to the method for manufacturing the printed circuit board, there can be provided a printed circuit board having a fine circuit pattern by using the AP film having a low roughness value and having improved adhesive strength with respect to the circuit pattern.
    Type: Application
    Filed: December 7, 2012
    Publication date: February 20, 2014
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Yong Jin Park, Yong Gwan Ko, Hye Won Jung, Joon Sung Kim