Abstract: Provided are a plasma generation apparatus and a plasma generation method. The plasma generation apparatus includes a chamber including a dielectric window and a toroidal discharge space, a magnetic core disposed to surround a portion of the chamber, an induction coil disposed to wind the magnetic core, and a waveguide radiating a microwave through the dielectric window. Alternating current flowing in the induction coil forms a magnetic flux at the magnetic core, and the magnetic flux generates inductively-coupled plasma. A microwave propagating along the waveguide generates microwave plasma inside the chamber.

Abstract: Provided are an RF power distribution device and an RF power distribution method. The RF power distribution device includes an impedance matching network for transferring power from an RF power source and a power distribution unit for distributing the output power from the impedance matching network to at least one electrode generating capacitively-coupled plasma. The power distribution unit includes a first reactive element connected in series to a first electrode, a variable capacitor having one end connected in parallel to the first reactive element and the first electrode and the other end grounded, and a second reactive element having one end connected to a first node where the one end of the variable capacitor and one end of the first reactance device are in contact with each other and the other end connected to a second node where a second electrode and an output terminal of the impedance matching network are connected.

Abstract: Provided is an impedance matching apparatus for matching impedance to a plasma load. The impedance matching apparatus includes a first frequency impedance matching circuit unit that transfers an output of a first frequency RF power source unit, operating at a first frequency, to the plasma load; and a second frequency impedance matching circuit unit that transfers an output of a second frequency RF power source unit, operating at a second frequency higher than the first frequency, to the plasma load. The first frequency impedance matching circuit unit includes a T-type matching circuit, and the second frequency impedance matching circuit unit includes a standard L-type matching circuit or ?-type matching circuit.

Abstract: Provided are a plasma generation apparatus and a plasma generation method. The plasma generation apparatus includes a chamber including a dielectric window and a toroidal discharge space, a magnetic core disposed to surround a portion of the chamber, an induction coil disposed to wind the magnetic core, and a waveguide radiating a microwave through the dielectric window. Alternating current flowing in the induction coil forms a magnetic flux at the magnetic core, and the magnetic flux generates inductively-coupled plasma. A microwave propagating along the waveguide generates microwave plasma inside the chamber.

Abstract: Provided are an impedance matching method and a matching system performing the same. The method includes: measuring an electrical characteristic of the power transmission line including the matching system and the load; extracting a control parameter for impedance matching from the electrical characteristic of the power transmission line; and controlling the matching system by using the control parameter. The extracting of the control parameter comprises utilizing an analytic coordinate system that quantitatively relates the electrical characteristic of the matching system to the electrical characteristic of the power transmission line.

Abstract: Provided is an impedance matching apparatus for matching impedance to a plasma load. The impedance matching apparatus includes a first frequency impedance matching circuit unit that transfers an output of a first frequency RF power source unit, operating at a first frequency, to the plasma load; and a second frequency impedance matching circuit unit that transfers an output of a second frequency RF power source unit, operating at a second frequency higher than the first frequency, to the plasma load. The first frequency impedance matching circuit unit includes a T-type matching circuit, and the second frequency impedance matching circuit unit includes a standard L-type matching circuit or ?-type matching circuit.

Abstract: Provided are an impedance matching method and a matching system performing the same. The method includes: measuring an electrical characteristic of the power transmission line; determining a pulse mode of the power source; extracting a control parameter for impedance matching from the electrical characteristic of the power transmission line; and controlling the matching system through the control parameter, wherein the matching system is controlled differently according to the pulse mode.

Abstract: Provided are an impedance matching method and a matching system performing the same. The method includes: measuring an electrical characteristic of the power transmission line including the matching system and the load; extracting a control parameter for impedance matching from the electrical characteristic of the power transmission line; and controlling the matching system by using the control parameter. The extracting of the control parameter comprises utilizing an analytic coordinate system that quantitatively relates the electrical characteristic of the matching system to the electrical characteristic of the power transmission line.

Abstract: Provided are an impedance matching method and a matching system performing the same. The method includes: measuring an electrical characteristic of the power transmission line including the matching system and the load; extracting a control parameter for impedance matching from the electrical characteristic of the power transmission line; and controlling the matching system by using the control parameter. The extracting of the control parameter comprises utilizing an analytic coordinate system that quantitatively relates the electrical characteristic of the matching system to the electrical characteristic of the power transmission line.

Abstract: Provided are an impedance matching method and a matching system performing the same. The method includes: measuring an electrical characteristic of the power transmission line; determining a pulse mode of the power source; extracting a control parameter for impedance matching from the electrical characteristic of the power transmission line; and controlling the matching system through the control parameter, wherein the matching system is controlled differently according to the pulse mode.

Abstract: Provided are an impedance matching method and a matching system performing the same. The method includes: measuring an electrical characteristic of the power transmission line including the matching system and the load; extracting a control parameter for impedance matching from the electrical characteristic of the power transmission line; and controlling the matching system by using the control parameter. The extracting of the control parameter comprises utilizing an analytic coordinate system that quantitatively relates the electrical characteristic of the matching system to the electrical characteristic of the power transmission line.