Abstract: A semiconductor memory device includes: a memory cell array including a plurality of memory cells; an error correction code (ECC) engine configured to detect and/or correct at least one error bit in read data and configured to generate a decoding status flag indicative of whether the at least one error bit is detected and/or corrected, wherein the read data is read from the memory cell array; a channel interface circuit configured to receive the read data and the decoding status flag from the ECC engine and configured to transmit the read data and the decoding status flag to a memory controller, wherein the channel interface circuit is configured to transmit the decoding status flag to the memory controller through a pin; and a control logic circuit configured to control the ECC engine and the channel interface circuit in response to an address and a command from the memory controller.

Abstract: Disclosed are a semiconductor memory device, a controller, a memory system, and an operation method thereof. The semiconductor memory device includes a memory cell array including a plurality of memory cells, and an error correcting code (ECC) decoder configured to receive first data and a parity output from selected memory cells of the memory cell array. The ECC decoder generates a syndrome based on the first data and the parity, generates a decoding status flag (DSF) indicating a type of an error of the first data by the syndrome, and outputs the second data and the DSF to an external device outside of the semiconductor memory device when a read operation of the semiconductor memory device is performed.

Abstract: A semiconductor memory device includes: a memory cell array including a plurality of memory cells; an error correction code (ECC) engine configured to detect and/or correct at least one error bit in read data and configured to generate a decoding status flag indicative of whether the at least one error bit is detected and/or corrected, wherein the read data is read from the memory cell array; a channel interface circuit configured to receive the read data and the decoding status flag from the ECC engine and configured to transmit the read data and the decoding status flag to a memory controller, wherein the channel interface circuit is configured to transmit the decoding status flag to the memory controller through a pin; and a control logic circuit configured to control the ECC engine and the channel interface circuit in response to an address and a command from the memory controller.

Abstract: A semiconductor memory device includes: a memory cell array including a plurality of memory cells; an error correction code (ECC) engine configured to detect and/or correct at least one error bit in read data and configured to generate a decoding status flag indicative of whether the at least one error bit is detected and/or corrected, wherein the read data is read from the memory cell array; a channel interface circuit configured to receive the read data and the decoding status flag from the ECC engine and configured to transmit the read data and the decoding status flag to a memory controller, wherein the channel interface circuit is configured to transmit the decoding status flag to the memory controller through a pin; and a control logic circuit configured to control the ECC engine and the channel interface circuit in response to an address and a command from the memory controller.

Abstract: Disclosed are a semiconductor memory device, a controller, a memory system, and an operation method thereof. The semiconductor memory device includes a memory cell array including a plurality of memory cells, and an error correcting code (ECC) decoder configured to receive first data and a parity output from selected memory cells of the memory cell array. The ECC decoder generates a syndrome based on the first data and the parity, generates a decoding status flag (DSF) indicating a type of an error of the first data by the syndrome, and outputs the second data and the DSF to an external device outside of the semiconductor memory device when a read operation of the semiconductor memory device is performed.

Abstract: Disclosed are a semiconductor memory device, a controller, and a memory system. The semiconductor memory device includes a memory cell array including a plurality of memory cells, and an error correcting code (ECC) decoder configured to receive first data and a parity output from selected memory cells of the memory cell array. The ECC decoder generates a syndrome based on the first data and the parity, generates a decoding status flag (DSF) indicating a type of an error of the first data by the syndrome, and outputs the second data and the DSF to an external device outside of the semiconductor memory device when a read operation of the semiconductor memory device is performed.

Abstract: Disclosed are a semiconductor memory device, a controller, and a memory system. The semiconductor memory device includes a memory cell array including a plurality of memory cells, and an error correcting code (ECC) decoder configured to receive first data and a parity output from selected memory cells of the memory cell array. The ECC decoder generates a syndrome based on the first data and the parity, generates a decoding status flag (DSF) indicating a type of an error of the first data by the syndrome, and outputs the second data and the DSF to an external device outside of the semiconductor memory device when a read operation of the semiconductor memory device is performed.

Abstract: A semiconductor memory device includes: a memory cell array including a plurality of memory cells; an error correction code (ECC) engine configured to detect and/or correct at least one error bit in read data and configured to generate a decoding status flag indicative of whether the at least one error bit is detected and/or corrected, wherein the read data is read from the memory cell array; a channel interface circuit configured to receive the read data and the decoding status flag from the ECC engine and configured to transmit the read data and the decoding status flag to a memory controller, wherein the channel interface circuit is configured to transmit the decoding status flag to the memory controller through a pin; and a control logic circuit configured to control the ECC engine and the channel interface circuit in response to an address and a command from the memory controller.

Abstract: A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.

Abstract: A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.

Abstract: A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.

Abstract: A semiconductor device includes a memory cell array, pad groups, a first option pad, a second option pad and a data input multiplexer block configured to transmit data, input through all or part of the pad groups, to the memory cell array based on whether the first option pad and a ground are connected to each other, wherein the data input multiplexer block is configured to select first pad groups among the pad groups or second pad groups among the pad groups as the part of the pad groups based on whether the second option pad and the ground are connected to each other.

Abstract: A precharge method of a semiconductor memory device that controls a precharge start time of each bank during a bank precharge operation, and a semiconductor memory device using the method, are provided. The device may latch an active or write order of respective banks and differently control precharge start times of the respective banks according to the latched active or write order during a plural-bank precharge operation to allow a plurality of banks to start precharge operations at different times.

Abstract: A method and semiconductor memory device for precharging a local input/output line. The semiconductor memory device, which may have an open bit line structure, transmits data through local input/output lines that are coupled to bit lines of first to n-th memory cell array blocks (n being a natural number). The semiconductor memory device may include a precharge unit configured to generate a plurality of precharge signals and a controller configured to control precharging of the at least one local input/output line responsive to block information corresponding to activation of at least one of the memory cell array blocks and responsive to at least one of the precharge signals.

Abstract: A precharge method of a semiconductor memory device that controls a precharge start time of each bank during a bank precharge operation, and a semiconductor memory device using the method, are provided. The device may latch an active or write order of respective banks and differently control precharge start times of the respective banks according to the latched active or write order during a plural-bank precharge operation to allow a plurality of banks to start precharge operations at different times.

Abstract: A semiconductor memory device includes a first row of pads including a first plurality of data input/output (I/O) pads; a second row of pads including a second plurality of data I/O pads; and a first I/O multiplexer associated with the first row of pads and providing first output data only to at least one data I/O pad of the first row of pads, even after a data I/O mode of the semiconductor memory device has changed. The semiconductor memory device also includes a second I/O multiplexer associated with the second row of pads and providing second output data only to at least one data I/O pad of the second row of pads, even after the data I/O mode has changed.

Abstract: A method and semiconductor memory device for precharging a local input/output line. The semiconductor memory device, which may have an open bit line structure, transmits data through local input/output lines that are coupled to bit lines of first to n-th memory cell array blocks (n being a natural number). The semiconductor memory device may include a precharge unit configured to generate a plurality of precharge signals and a controller configured to control precharging of the at least one local input/output line responsive to block information corresponding to activation of at least one of the memory cell array blocks and responsive to at least one of the precharge signals.

Abstract: A semiconductor memory device to which information of different data bits can be written, and a method of electrically testing the semiconductor memory device are provided. In a mode for testing a memory cell array of the semiconductor memory device, the semiconductor memory comprises a control signal generation pad capable of writing non-identical data to data input/output pads of each group when data is written to the memory cell array.

Abstract: A semiconductor memory device to which information of different data bits can be written, and a method of electrically testing the semiconductor memory device are provided. In a mode for testing a memory cell array of the semiconductor memory device, the semiconductor memory comprises a control signal generation pad capable of writing non-identical data to data input/output pads of each group when data is written to the memory cell array.

Abstract: Provided is a synchronous semiconductor memory device with improved latency control. In one embodiment, the synchronous semiconductor memory device may include a clock synchronizing circuit, a latency circuit, and a latency control circuit. The clock synchronizing circuit may receive an external clock signal and output a data output clock signal. The latency circuit may store a read signal in response to at least one sampling clock signal, generate a plurality of clock control signals in a sequential manner, generate a plurality of transfer clock signals synchronized with the plurality of clock control signals, and supply a latency signal in response to the transfer clock signals. The latency control circuit may delay the plurality of clock control signals by the sum of output delay time and the read command delay time so as to generate a plurality of sampling clock signals synchronized with the plurality of delayed clock control signals.