Abstract: An embodiment relates to a substrate and a semiconductor module. A substrate capable of manufacturing a substrate for packaging, which is an individual product, with excellent yield despite cracks that may occur at edges or side surfaces of a core is provided.

Abstract: A method for scanning an Access Point (AP) in a portable terminal includes determining whether a request to activate the portable terminal is detected; and upon detecting the request, immediately and additionally scanning an AP independently of a predetermined scan cycle.

Abstract: A method for scanning an Access Point (AP) in a portable terminal includes determining whether a request to activate the portable terminal is detected; and upon detecting the request, immediately and additionally scanning an AP independently of a predetermined scan cycle.

Abstract: A method for scanning an Access Point (AP) in a portable terminal includes determining whether a request to activate the portable terminal is detected; and upon detecting the request, immediately and additionally scanning an AP independently of a predetermined scan cycle.

Abstract: A method for scanning an Access Point (AP) in a portable terminal includes determining whether a request to activate the portable terminal is detected; and upon detecting the request, immediately and additionally scanning an AP independently of a predetermined scan cycle.

Abstract: A coreless package structure and a method for manufacturing same includes the steps of providing a supporting substrate comprising an etching resist layer and a copper foil. A groove is defined in the copper foil and a plurality of contact pads are formed on the surface of the copper foil. A chip including a plurality of electrode pads is received in the groove and a packaging layer is formed on a side of the copper foil. An insulating layer and a conductive pattern layer are formed on the packaging layer in that order, the conductive pattern layer being electrically connected to the contact pads and the electrode pads by a plurality of conductive bumps. Finally, the etching resist layer and the copper foil are removed to obtain a coreless package structure.

Abstract: A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts is larger than that of each of the first conductive posts. A manufacturing method thereof is also provided.

Abstract: A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts.

Abstract: A packaging substrate includes a base layer, a first wiring layer, a second wiring layer, a first solder mask layer, a second solder mask layer and copper portions. The first second wiring layers are arranged on opposite sides of the base layer. The first solder mask layer covers the first wiring layer, and defines plenty of first openings. The first wiring layer exposed through the first openings serves as first contact pads. The second solder mask layer covers the second wiring layer. The second solder mask layer defines plenty of second openings. The second wiring layer exposed through the second openings serves as second contact pads. The copper portions are formed on the second contact pads. The copper portions protrude beyond the second solder mask layer. This disclosure further relates to a method of manufacturing the packaging substrate and a chip packaging body.

Abstract: A roaming method and a data transmission system for a portable terminal in a Wireless Local Area Network (WLAN) are provided. The method includes transitioning to an active mode, by a control unit in a standby mode in response to a request from a WLAN module during roaming from a first Access Point (AP) to a second AP, and performing authentication in conjunction with a server, by the control unit in the active mode. As a result, when a portable terminal roams in a WLAN, the network connection is not disrupted.

Abstract: A coreless package structure and a method for manufacturing same includes the steps of providing a supporting substrate comprising an etching resist layer and a copper foil. A groove is defined in the copper foil and a plurality of contact pads are formed on the surface of the copper foil. A chip including a plurality of electrode pads is received in the groove and a packaging layer is formed on a side of the copper foil. An insulating layer and a conductive pattern layer are formed on the packaging layer in that order, the conductive pattern layer being electrically connected to the contact pads and the electrode pads by a plurality of conductive bumps. Finally, the etching resist layer and the copper foil are removed to obtain a coreless package structure.

Abstract: A packaging substrate includes a circuit board, a number of first conductive posts, and a number of second conductive posts. The circuit board includes a first base and a first conductive pattern layer formed on a first surface of the first base. The first conductive posts extend from and are electrically connected to the first conductive pattern layer. The second conductive posts extend from and are electrically connected to the first conductive pattern layer. The height of each of the second conductive posts are larger than that of each of the first conductive posts.

Abstract: A packaging substrate includes a base layer, a first wiring layer, a second wiring layer, a first solder mask layer, a second solder mask layer and copper portions. The first second wiring layers are arranged on opposite sides of the base layer. The first solder mask layer covers the first wiring layer, and defines plenty of first openings. The first wiring layer exposed through the first openings serves as first contact pads. The second solder mask layer covers the second wiring layer. The second solder mask layer defines plenty of second openings. The second wiring layer exposed through the second openings serves as second contact pads. The copper portions are formed on the second contact pads. The copper portions protrude beyond the second solder mask layer. This disclosure further relates to a method of manufacturing the packaging substrate and a chip packaging body.

Abstract: An Apparatus, method, and system for transmitting data in a Wireless Local Access Network (WLAN) in a power management state are provided. The method includes registering a standby state entrance to an Access Point (AP), switching to an active state at a period, determining whether transmission standby data exists in the AP, transmitting, if the transmission standby data exist in the AP, a standby state entrance frame notifying the entrance to the standby state to the AP, transmitting an active request signal requesting a switching to an active state to the CPU, transmitting a signal notifying standby state release to the AP if a signal notifying switch completion to an active state is received from the CPU after the active request signal is transmitted, and receiving transmission standby data from the AP.

Abstract: A roaming method and a data transmission system for a portable terminal in a Wireless Local Area Network (WLAN) are provided. The method includes transitioning to an active mode, by a control unit in a standby mode in response to a request from a WLAN module during roaming from a first Access Point (AP) to a second AP, and performing authentication in conjunction with a server, by the control unit in the active mode. As a result, when a portable terminal roams in a WLAN, the network connection is not disrupted.

Abstract: An Apparatus, method, and system for transmitting data in a Wireless Local Access Network (WLAN) in a power management state are provided. The method includes registering a standby state entrance to an Access Point (AP), switching to an active state at a period, determining whether transmission standby data exists in the AP, transmitting, if the transmission standby data exist in the AP, a standby state entrance frame notifying the entrance to the standby state to the AP, transmitting an active request signal requesting a switching to an active state to the CPU, transmitting a signal notifying standby state release to the AP if a signal notifying switch completion to an active state is received from the CPU after the active request signal is transmitted, and receiving transmission standby data from the AP.