Patents by Inventor Yong Han CHO

Yong Han CHO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Tablet-type epoxy resin composition for sealing semiconductor device, and semiconductor device sealed using the same
    Patent number: 11702537
    Abstract: A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, ? ? ? D × ? ? ? H ? ? ? D + ? ? ? H ? 1.0 , where ?D is a standard deviation of tablet diameters and ?H is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.
    Type: Grant
    Filed: December 20, 2019
    Date of Patent: July 18, 2023
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Sang Jin Kim, Sang Kyun Kim, Tae Shin Eom, Dong Hwan Lee, Young Joon Lee, Yong Han Cho
  • Tableted epoxy resin composition for encapsulation of semiconductor device and semiconductor device encapsulated using the same
    Patent number: 11655363
    Abstract: A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: May 23, 2023
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Sang Jin Kim, Sang Kyun Kim, Tae Shin Eom, Dong Hwan Lee, Young Joon Lee, Yong Han Cho
  • TABLETED EPOXY RESIN COMPOSITION FOR ENCAPSULATION OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE ENCAPSULATED USING THE SAME
    Publication number: 20200199351
    Abstract: A tableted epoxy resin composition for encapsulation of semiconductor devices and a semiconductor device encapsulated using the tableted epoxy resin composition, the tableted epoxy resin composition satisfying the following conditions (i) a proportion of tablets of the tableted epoxy resin composition having a diameter of greater than or equal to 0.1 mm and less than 2.8 mm and a height of greater than or equal to 0.1 mm and less than 2.8 mm is about 97 wt % or more, as measured by sieve analysis using ASTM standard sieves; (ii) the tablets have a packed density of greater than about 1.7 g/mL; and (iii) a ratio of packed density to cured density of the tablets is about 0.6 to about 0.87.
    Type: Application
    Filed: December 18, 2019
    Publication date: June 25, 2020
    Inventors: Sang Jin KIM, Sang Kyun KIM, Tae Shin EOM, Dong Hwan LEE, Young Joon LEE, Yong Han CHO
  • TABLET-TYPE EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEALED USING THE SAME
    Publication number: 20200140677
    Abstract: A tablet form of an epoxy resin composition for encapsulation of semiconductor elements, where the tablet form of the epoxy resin composition: (i) includes 97 wt % or more of tablets having a diameter of 0.1 mm to less than 2.8 mm and a height of 0.1 mm to less than 2.8 mm, as measured using an ASTM standard sieve; (ii) satisfies the following Equation 1, ? ? ? D × ? ? ? H ? ? ? D + ? ? ? H ? 1.0 , where ?D is a standard deviation of tablet diameters and ?H is a standard deviation of tablet heights, as measured with respect to 50 tablets arbitrarily selected from the tablets; and (iii) the tablets have a compression density of 1.2 g/mL to 1.7 g/mL.
    Type: Application
    Filed: December 20, 2019
    Publication date: May 7, 2020
    Inventors: Sang Jin KIM, Sang Kyun KIM, Tae Shin EOM, Dong Hwan LEE, Young Joon LEE, Yong Han CHO
  • Epoxy resin composition for encapsulating semiconductor device and semiconductor package encapsulated using the same
    Patent number: 9673120
    Abstract: An epoxy resin composition for encapsulating a semiconductor device and a semiconductor package, the composition including an epoxy resin; a polyorganosiloxane resin represented by Formula 3, below; a curing agent; a curing accelerator; and an inorganic filler:
    Type: Grant
    Filed: May 7, 2015
    Date of Patent: June 6, 2017
    Assignee: SAMSUNG SDI CO., LTD.
    Inventors: Sang Jin Kim, Eun Jung Lee, Yong Han Cho
  • EPOXY RESIN COMPOSITION FOR ENCAPSULATING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE ENCAPSULATED USING THE SAME
    Publication number: 20160093547
    Abstract: An epoxy resin composition for encapsulating a semiconductor device and a semiconductor package, the composition including an epoxy resin; a polyorganosiloxane resin represented by Formula 3, below; a curing agent; a curing accelerator; and an inorganic filler:
    Type: Application
    Filed: May 7, 2015
    Publication date: March 31, 2016
    Inventors: Sang Jin KIM, Eun Jung LEE, Yong Han CHO