Patents by Inventor Yong Hee Oh

Yong Hee Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250054477
    Abstract: Provided are a sound amplifying block formed of a permeable material and an air adsorbing material and having a layered structure and a method of manufacturing the same. The sound amplifying block formed of a permeable material and an air adsorbing material and having a layered structure includes a porous grain formed by a first porous material that is an air adsorbing material that serves to amplify sound, a second porous material that is a permeable material and has a pore size and porosity greater than those of the first porous material, and a binder and a structural gap formed in a process of freezing the porous grain and formed between porous grains.
    Type: Application
    Filed: December 16, 2022
    Publication date: February 13, 2025
    Inventors: Yong-Hee Oh, Jae-Hwa Lim
  • Patent number: 12207046
    Abstract: The present disclosure provides a microspeaker enclosure including a block formed of a porous material. The microspeaker enclosure including a block formed of a porous material includes a microspeaker, an enclosure case in which the microspeaker is mounted, the enclosure case including a back volume communicating with the microspeaker, a porous block installed in the back volume, having 3-nm pores having air adsorption performance and 6-nm pores serving as a passage for air circulation in a predetermined ratio, and including porous particles combined as a block, and a film attached to one surface of the porous block.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: January 21, 2025
    Assignee: EM-TECH Co., Ltd.
    Inventors: Yong Hee Oh, Jae Hwa Lim
  • Publication number: 20240022851
    Abstract: Provided is a block formed of a porous material. In the block formed of a porous material, which is mounted together with a microspeaker in an enclosure case to adsorb air to serve as a virtual back volume, the block is manufactured by blocking porous particles including silicon and aluminum, and in a pore diameter of the porous block, dV/dlog(D) pore volume at 20 nm is 0.1 cm3/g or more.
    Type: Application
    Filed: July 10, 2023
    Publication date: January 18, 2024
    Inventors: Yong Hee Oh, Young Uk Jo, Dong Hyun Yun
  • Publication number: 20230156405
    Abstract: A microspeaker in which a diaphragm and a voice coil are replaced with a flexible printed circuit board (FPCB) is provided. The microspeaker includes: a magnetic circuit having a yoke and a magnet; and an FPCB diaphragm installed on the magnetic circuit and having a conductive coil pattern formed on a non-conductive film. When an electric signal is applied to the conductive coil pattern of the FPCB diaphragm, the FPCB diaphragm vibrates by mutual electromagnetic force with the magnetic circuit to generate sound.
    Type: Application
    Filed: November 14, 2022
    Publication date: May 18, 2023
    Inventors: Byung Min Yu, Jae Hwa Lim, Young Uk Jo, Yong Hee Oh, Yong Dae So
  • Publication number: 20230022009
    Abstract: The present disclosure provides a microspeaker enclosure including a block formed of a porous material. The microspeaker enclosure includes a microspeaker, an enclosure case in which the microspeaker is mounted, the enclosure case including a back volume communicating with the microspeaker, and a porous block installed in the back volume and prepared by mixing first porous particles having excellent adsorption capacity of nitrogen or oxygen and second porous particles having a porosity of 50% or more.
    Type: Application
    Filed: July 20, 2022
    Publication date: January 26, 2023
    Inventors: Yong Hee Oh, Jae Hwa Lim
  • Publication number: 20230023601
    Abstract: The present disclosure provides a microspeaker enclosure including a block formed of a porous material. The microspeaker enclosure including a block formed of a porous material includes a microspeaker, an enclosure case in which the microspeaker is mounted, the enclosure case including a back volume communicating with the microspeaker, a porous block installed in the back volume, having 3-nm pores having air adsorption performance and 6-nm pores serving as a passage for air circulation in a predetermined ratio, and including porous particles combined as a block, and a film attached to one surface of the porous block.
    Type: Application
    Filed: July 20, 2022
    Publication date: January 26, 2023
    Inventors: Yong Hee Oh, Jae Hwa Lim