Patents by Inventor Yong-Ho Ko
Yong-Ho Ko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240118182Abstract: A glass stress test method includes breaking a glass, analyzing a shape of a crack of a broken portion of the glass in a plan view, finding a breakage origin of the glass based on the shape of the crack in the plan view, analyzing a cross-section of the breakage origin, and calculating a stress of the glass based on a cross-sectional analysis result of the breakage origin. The stress of the glass is calculated as a value proportional to a floor constant defined by a condition of a floor surface disposed when the glass is broken.Type: ApplicationFiled: September 6, 2023Publication date: April 11, 2024Inventors: Min Ki KIM, Ji Hyun KO, Yong Kyu KANG, Jinsu NAM, Hyun Seung SEO, JUN HO LEE
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Patent number: 11940501Abstract: The present invention relates to a method and an apparatus for diagnosing low voltage of a secondary battery cell. The method for diagnosing low voltage of a secondary battery cell according to an embodiment of the present invention includes pre-aging a battery cell, charging the battery cell according to a preset charging condition, measuring a parameter for determining low voltage failure of the battery cell, comparing the measured parameter with a reference parameter, and performing formation when the battery cell is determined to be normal.Type: GrantFiled: October 4, 2019Date of Patent: March 26, 2024Assignee: LG ENERGY SOLUTION, LTD.Inventors: Yong Tae Lee, Myung Hoon Ko, Jee Ho Kim, Gyung Soo Kang
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Publication number: 20240097580Abstract: An inverter driving apparatus includes an inverter having a plurality of legs respectively corresponding to each of a plurality of phases and the control unit generating space vector modulation signals based on a phase voltage command, each of the space vector modulation signals corresponding to each of the plurality of phases, respectively, determining whether an output voltage of the inverter corresponding to at least one space vector modulation signal of the space vector modulation is in a non-linear region by determining whether each voltage of the space vector modulation signals is included in a predetermined range, generating a terminal voltage command by determining whether or not to apply an offset voltage to each of the space vector modulation signals based on the determination of the non-linear region, and controlling a turn-on state of at least one switch included in each of the plurality of legs by modulating the terminal voltage command based on pulse width modulation.Type: ApplicationFiled: November 11, 2022Publication date: March 21, 2024Applicants: Hyundai Motor Company, Kia CorporationInventors: Hyun Jae LIM, Yong Jae LEE, Young Ho CHAE, Young Kwan KO, Young Gi LEE
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Patent number: 11916258Abstract: A secondary battery comprises an electrode assembly, a can, and an insulator. The electrode assembly includes a first electrode, a separator, and a second electrode alternately stacked and wound. The can has an accommodation part accommodating the electrode assembly therein, and the can comprises a first can and a second can having cylindrical shapes open in a direction facing each other. The insulator insulates an overlapping portion between the first can and the second can. The first can is electrically connected to the first electrode, and the second can is electrically connected to the second electrode. The insulator has a short-circuit induction through-part defined by a through-hole or a cutoff line, such that a short circuit occurs between the first can and the second can through the short-circuit induction through-part when it is deformed in shape as heat or a pressure is applied to contract or expand the insulator.Type: GrantFiled: October 4, 2019Date of Patent: February 27, 2024Assignee: LG Energy Solution, Ltd.Inventors: Gyung Soo Kang, Jee Ho Kim, Yong Tae Lee, Myung Hoon Ko, Jung Il Park, Ki Youn Kim
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Patent number: 11914720Abstract: A method for verifying a drone included in an industrial Internet of Things (IIoT) system, using a petri-net modeling is disclosed. In an embodiment, the method includes a step of modeling the IIoT system as a hierarchical petri-net (modeling step); and a step of verifying whether the drone has security vulnerability on the basis of the hierarchical petri-net model (verification step), wherein the verification step can determine that a drone has security vulnerability when at least one of a plurality of determination factors provided as places to the hierarchical petri-net model determines that the drone is operating abnormally.Type: GrantFiled: May 9, 2019Date of Patent: February 27, 2024Assignee: SOONCHUNHYANG UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATIONInventors: Il Sun You, Vishal Sharma, Gaurav Choudhary, Yong Ho Ko
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Publication number: 20210279339Abstract: A method for verifying a drone included in an industrial Internet of Things (IIoT) system, using a petri-net modeling is disclosed. In an embodiment, the method includes a step of modeling the IIoT system as a hierarchical petri-net (modeling step); and a step of verifying whether the drone has security vulnerability on the basis of the hierarchical petri-net model (verification step), wherein the verification step can determine that a drone has security vulnerability when at least one of a plurality of determination factors provided as places to the hierarchical petri-net model determines that the drone is operating abnormally.Type: ApplicationFiled: May 9, 2019Publication date: September 9, 2021Applicant: SOONCHUNHYANG UNIVERSITY INDUSTRY ACADEMY COOPERATION FOUNDATIONInventors: Il Sun YOU, Vishal SHARMA, Gaurav CHOUDHARY, Yong Ho KO
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Patent number: 9539970Abstract: The present invention relates to an airbag sensor module which detects the amount of deformation of a car body so as to detect a collision during a car collision and which is attached to the car body in an adhesive manner, and the car body which is integrated with the airbag sensor module. One embodiment of the present application discloses the airbag sensor module mounted in an adhesive manner, comprising: a main substrate which is attached to the car body in an adhesive manner; and a collision detection sensor section which is formed on the main substrate, and which detects whether the car body collides by including a strain sensor for measuring the amount of deformation by being deformed along with the deformation of the car body caused by a collision thereof.Type: GrantFiled: September 23, 2013Date of Patent: January 10, 2017Assignees: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY, SIN YEONG CO., LTD.Inventors: Jun Ki Kim, Chang Woo Lee, Se Hoon Yoo, Jung Hwan Bang, Yong Ho Ko, Jeong Han Kim, Jong Dock Seo, Dea Keun Kim, Kwang Woo Won
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Patent number: 9156111Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.Type: GrantFiled: December 2, 2014Date of Patent: October 13, 2015Assignees: MK ELECTRON CO., LTD., HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY, KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY, KOREA ELECTRONICS TECHNOLOGY INSTITUTEInventors: Sung Jae Hong, Keun Soo Kim, Chang Woo Lee, Jung Hwan Bang, Yong Ho Ko, Hyuck Mo Lee, Jae Won Chang, Ja Hyun Koo, Jeong Tak Moon, Young Woo Lee, Won Sik Hong, Hui Joong Kim, Jae Hong Lee
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Publication number: 20150232051Abstract: The present invention relates to an airbag sensor module which detects the amount of deformation of a car body so as to detect a collision during a car collision and which is attached to the car body in an adhesive manner, and the car body which is integrated with the airbag sensor module. One embodiment of the present application discloses the airbag sensor module mounted in an adhesive manner, comprising: a main substrate which is attached to the car body in an adhesive manner; and a collision detection sensor section which is formed on the main substrate, and which detects whether the car body collides by including a strain sensor for measuring the amount of deformation by being deformed along with the deformation of the car body caused by a collision thereof.Type: ApplicationFiled: September 23, 2013Publication date: August 20, 2015Inventors: Jun Ki Kim, Chang Woo Lee, Se Hoon Yoo, Jung Hwan Bang, Yong Ho Ko, Jeong Han Kim, Jong Dock Seo, Dea Keun Kim, Kwang Woo Woo
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Publication number: 20150151386Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.Type: ApplicationFiled: December 2, 2014Publication date: June 4, 2015Applicants: MK ELECTRON CO., LTD., HOSEO UNIVERSITY ACADEMIC COOPERATION FOUNDATION, KOREA ELECTRONICS TECHNOLOGY INSTITUTE, KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY, KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGYInventors: Sung Jae HONG, Keun Soo KIM, Chang Woo LEE, Jung Hwan BANG, Yong Ho KO, Hyuck Mo LEE, Jae Won CHANG, Ja Hyun KOO, Jeong Tak MOON, Young Woo LEE, Won Sik HONG, Hui Joong KIM, Jae Hong LEE
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Patent number: 8168436Abstract: The present invention provides a method for quantifying a peptide compound having a phenylalanine residue at the N-terminal, comprising measuring the content of heat generated by mixing 1) a peptide compound having a phenylalanine residue at the N-terminal, 2) cucurbit[7]uril, and 3) a metal ion in a solution.Type: GrantFiled: October 23, 2007Date of Patent: May 1, 2012Assignee: Japan Science and Technology AgencyInventors: Yoshihisa Inoue, Mikhail Rekharsky, Kimoon Kim, Yong Ho Ko, Narayanan Selvapalam
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Patent number: 8040201Abstract: A substrate includes a power plane and a ground plane that are placed apart from and are substantially parallel to each other, and at least one signal line that is placed between the power plane and the ground plane. The ground plane includes a first conductive layer having a first conductivity. The power plane includes a second conductive layer having the first conductivity, and the power plane or the ground plane includes a third conductive layer having a second conductivity lower than the first conductivity. The third conductive layer faces the at least one signal line across a dielectric substance.Type: GrantFiled: January 15, 2009Date of Patent: October 18, 2011Assignee: Samsung Electronics Co., Ltd.Inventors: Kwang-Soo Park, Byoung-Ha Oh, Yong-Ho Ko
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Patent number: 7993929Abstract: The present invention provides a method for determining in a pharmaceutical test formulation the presence or absence of a peptide compound PYY3-36 represented by the following amino acid sequence: H-Ile-Lys-Pro-Glu-Ala-Pro-Gly-Glu-Asp-Ala-Ser-Pro-Glu-Glu-Leu-Asn-Arg-Tyr-Tyr-Ala-Ser-Leu-Arg-His-Tyr-Leu-Asn-Leu-Val-Thr-Arg-Gln-Arg-Tyr-X (SEQ ID NO: 1), wherein X is OH or a carboxy acid-protecting group, the method comprising (1) preparing a solution by mixing the pharmaceutical test formulation with cucurbit[7]uril in a solvent; and (2) thermally analyzing the solution prepared in Step (1).Type: GrantFiled: May 11, 2009Date of Patent: August 9, 2011Assignee: Japan Science and Technology AgencyInventors: Yoshihisa Inoue, Mikhail Rekharsky, Kimoon Kim, Yong Ho Ko, Narayanan Selvapalam
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Publication number: 20100281957Abstract: The present invention provides a method for determining in a pharmaceutical test formulation the presence or absence of a peptide compound PYY3-36 represented by the following amino acid sequence: H-Ile-Lys-Pro-Glu-Ala-Pro-Gly-Glu-Asp-Ala-Ser-Pro-Glu-Glu-Leu-Asn-Arg-Tyr-Tyr-Ala-Ser-Leu-Arg-His-Tyr-Leu-Asn-Leu-Val-Thr-Arg-Gln-Arg-Tyr-X (SEQ ID NO: 1), wherein X is OH or a carboxy acid-protecting group, the method comprising (1) preparing a solution by mixing the pharmaceutical test formulation with cucurbit[7]uril in a solvent; and (2) thermally analyzing the solution prepared in Step (1).Type: ApplicationFiled: October 25, 2007Publication date: November 11, 2010Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCYInventors: Yoshihisa Inoue, Mikhail Rekharsky, Kimoon Kim, Yong Ho Ko, Narayanan Selvapalam
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Patent number: 7821803Abstract: A memory module having a start-type topology and a method of fabricating the same are provided. The memory module includes a substrate. Memory devices are mounted on the substrate in at least two rows and at least two columns. A star-type topology is disposed to be electrically connected to the memory devices. One or more pairs of adjacent ones of the memory devices have a point-symmetric structure.Type: GrantFiled: August 6, 2008Date of Patent: October 26, 2010Assignee: Samsung Electronics, Co., Ltd.Inventors: Do-Hyung Kim, Byoung-Ha Oh, Young-Jun Park, Yong-Ho Ko
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Publication number: 20100238969Abstract: The present invention provides a method for quantifying a peptide compound having a phenylalanine residue at the N-terminal, comprising measuring the content of heat generated by mixing 1) a peptide compound having a phenylalanine residue at the N-terminal, 2) cucurbit[7]uril, and 3) a metal ion in a solution.Type: ApplicationFiled: October 23, 2007Publication date: September 23, 2010Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCYInventors: Yoshihisa Inoue, Mikhail Rekharsky, Kimoon Kim, Yong Ho Ko, Narayanan Selvapalam
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Publication number: 20100009453Abstract: The present invention provides a method for determining in a pharmaceutical test formulation the presence or absence of a peptide compound PYY3-36 represented by the following amino acid sequence: H-Ile-Lys-Pro-Glu-Ala-Pro-Gly-Glu-Asp-Ala-Ser-Pro-Glu-Glu-Leu-Asn-Arg-Tyr-Tyr-Ala-Ser-Leu-Arg-His-Tyr-Leu-Asn-Leu-Val-Thr-Arg-Gln-Arg-Tyr-X (SEQ ID NO: 1), wherein X is OH or a carboxy acid-protecting group, the method comprising (1) preparing a solution by mixing the pharmaceutical test formulation with cucurbit[7]uril in a solvent; and (2) thermally analyzing the solution prepared in Step (1).Type: ApplicationFiled: May 11, 2009Publication date: January 14, 2010Applicant: JAPAN SCIENCE AND TECHNOLOGY AGENCYInventors: Yoshihisa INOUE, Mikhail REKHARSKY, Kimoon KIM, Yong Ho KO, Narayanan SELVAPALAM
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Publication number: 20090184778Abstract: A substrate includes a power plane and a ground plane that are placed apart from and are substantially parallel to each other, and at least one signal line that is placed between the power plane and the ground plane. The ground plane includes a first conductive layer having a first conductivity. The power plane includes a second conductive layer having the first conductivity, and the power plane or the ground plane includes a third conductive layer having a second conductivity lower than the first conductivity. The third conductive layer faces the at least one signal line across a dielectric substance.Type: ApplicationFiled: January 15, 2009Publication date: July 23, 2009Inventors: Kwang-Soo Park, Byoung-Ha Oh, Yong-Ho Ko
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Publication number: 20090097297Abstract: A memory module having a start-type topology and a method of fabricating the same are provided. The memory module includes a substrate. Memory devices are mounted on the substrate in at least two rows and at least two columns. A star-type topology is disposed to be electrically connected to the memory devices. One or more pairs of adjacent ones of the memory devices have a point-symmetric structure.Type: ApplicationFiled: August 6, 2008Publication date: April 16, 2009Applicant: Samsung Electronics Co., Ltd.Inventors: Do-Hyung Kim, Byoung-Ha Oh, Young-Jun Park, Yong-Ho Ko
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Publication number: 20080237314Abstract: Disclosed is a method of joining electronic package parts, comprising the steps of: reflowing lead-free solders containing alloy elements on top of each of the electronic package parts having a surface treated with copper or nickel; and mounting the surface treated electronic parts on the lead-free solders then reflowing the lead-free solders to generate intermetallic compound between the lead-free solders and the surface treated portion of each of the electronic parts.Type: ApplicationFiled: October 12, 2007Publication date: October 2, 2008Inventors: Jin Yu, Young-Kun Jee, Yong-Ho Ko