Abstract: A method for verifying a drone included in an industrial Internet of Things (IIoT) system, using a petri-net modeling is disclosed. In an embodiment, the method includes a step of modeling the IIoT system as a hierarchical petri-net (modeling step); and a step of verifying whether the drone has security vulnerability on the basis of the hierarchical petri-net model (verification step), wherein the verification step can determine that a drone has security vulnerability when at least one of a plurality of determination factors provided as places to the hierarchical petri-net model determines that the drone is operating abnormally.

Abstract: A method for verifying a drone included in an industrial Internet of Things (IIoT) system, using a petri-net modeling is disclosed. In an embodiment, the method includes a step of modeling the IIoT system as a hierarchical petri-net (modeling step); and a step of verifying whether the drone has security vulnerability on the basis of the hierarchical petri-net model (verification step), wherein the verification step can determine that a drone has security vulnerability when at least one of a plurality of determination factors provided as places to the hierarchical petri-net model determines that the drone is operating abnormally.

Abstract: The present invention relates to an airbag sensor module which detects the amount of deformation of a car body so as to detect a collision during a car collision and which is attached to the car body in an adhesive manner, and the car body which is integrated with the airbag sensor module. One embodiment of the present application discloses the airbag sensor module mounted in an adhesive manner, comprising: a main substrate which is attached to the car body in an adhesive manner; and a collision detection sensor section which is formed on the main substrate, and which detects whether the car body collides by including a strain sensor for measuring the amount of deformation by being deformed along with the deformation of the car body caused by a collision thereof.

Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.

Abstract: The present invention relates to an airbag sensor module which detects the amount of deformation of a car body so as to detect a collision during a car collision and which is attached to the car body in an adhesive manner, and the car body which is integrated with the airbag sensor module. One embodiment of the present application discloses the airbag sensor module mounted in an adhesive manner, comprising: a main substrate which is attached to the car body in an adhesive manner; and a collision detection sensor section which is formed on the main substrate, and which detects whether the car body collides by including a strain sensor for measuring the amount of deformation by being deformed along with the deformation of the car body caused by a collision thereof.

Abstract: Provided are a lead-free solder, a solder paste, and a semiconductor device, and more particularly, a lead-free solder that includes Cu in a range from about 0.1 wt % to about 0.8 wt %, Pd in a range from about 0.001 wt % to about 0.1 wt %, Al in a range from about 0.001 wt % to about 0.1 wt %, Si in a range from about 0.001 wt % to about 0.1 wt %, and Sn and inevitable impurities as remainder, a solder paste and a semiconductor device including the lead-free solder. The lead-free solder and the solder paste are environment-friendly and have a high high-temperature stability and high reliability.

Abstract: The present invention provides a method for quantifying a peptide compound having a phenylalanine residue at the N-terminal, comprising measuring the content of heat generated by mixing 1) a peptide compound having a phenylalanine residue at the N-terminal, 2) cucurbit[7]uril, and 3) a metal ion in a solution.

Abstract: A substrate includes a power plane and a ground plane that are placed apart from and are substantially parallel to each other, and at least one signal line that is placed between the power plane and the ground plane. The ground plane includes a first conductive layer having a first conductivity. The power plane includes a second conductive layer having the first conductivity, and the power plane or the ground plane includes a third conductive layer having a second conductivity lower than the first conductivity. The third conductive layer faces the at least one signal line across a dielectric substance.

Abstract: The present invention provides a method for determining in a pharmaceutical test formulation the presence or absence of a peptide compound PYY3-36 represented by the following amino acid sequence: H-Ile-Lys-Pro-Glu-Ala-Pro-Gly-Glu-Asp-Ala-Ser-Pro-Glu-Glu-Leu-Asn-Arg-Tyr-Tyr-Ala-Ser-Leu-Arg-His-Tyr-Leu-Asn-Leu-Val-Thr-Arg-Gln-Arg-Tyr-X (SEQ ID NO: 1), wherein X is OH or a carboxy acid-protecting group, the method comprising (1) preparing a solution by mixing the pharmaceutical test formulation with cucurbit[7]uril in a solvent; and (2) thermally analyzing the solution prepared in Step (1).

Abstract: The present invention provides a method for determining in a pharmaceutical test formulation the presence or absence of a peptide compound PYY3-36 represented by the following amino acid sequence: H-Ile-Lys-Pro-Glu-Ala-Pro-Gly-Glu-Asp-Ala-Ser-Pro-Glu-Glu-Leu-Asn-Arg-Tyr-Tyr-Ala-Ser-Leu-Arg-His-Tyr-Leu-Asn-Leu-Val-Thr-Arg-Gln-Arg-Tyr-X (SEQ ID NO: 1), wherein X is OH or a carboxy acid-protecting group, the method comprising (1) preparing a solution by mixing the pharmaceutical test formulation with cucurbit[7]uril in a solvent; and (2) thermally analyzing the solution prepared in Step (1).

Abstract: A memory module having a start-type topology and a method of fabricating the same are provided. The memory module includes a substrate. Memory devices are mounted on the substrate in at least two rows and at least two columns. A star-type topology is disposed to be electrically connected to the memory devices. One or more pairs of adjacent ones of the memory devices have a point-symmetric structure.

Abstract: The present invention provides a method for quantifying a peptide compound having a phenylalanine residue at the N-terminal, comprising measuring the content of heat generated by mixing 1) a peptide compound having a phenylalanine residue at the N-terminal, 2) cucurbit[7]uril, and 3) a metal ion in a solution.

Abstract: The present invention provides a method for determining in a pharmaceutical test formulation the presence or absence of a peptide compound PYY3-36 represented by the following amino acid sequence: H-Ile-Lys-Pro-Glu-Ala-Pro-Gly-Glu-Asp-Ala-Ser-Pro-Glu-Glu-Leu-Asn-Arg-Tyr-Tyr-Ala-Ser-Leu-Arg-His-Tyr-Leu-Asn-Leu-Val-Thr-Arg-Gln-Arg-Tyr-X (SEQ ID NO: 1), wherein X is OH or a carboxy acid-protecting group, the method comprising (1) preparing a solution by mixing the pharmaceutical test formulation with cucurbit[7]uril in a solvent; and (2) thermally analyzing the solution prepared in Step (1).

Abstract: A substrate includes a power plane and a ground plane that are placed apart from and are substantially parallel to each other, and at least one signal line that is placed between the power plane and the ground plane. The ground plane includes a first conductive layer having a first conductivity. The power plane includes a second conductive layer having the first conductivity, and the power plane or the ground plane includes a third conductive layer having a second conductivity lower than the first conductivity. The third conductive layer faces the at least one signal line across a dielectric substance.

Abstract: A memory module having a start-type topology and a method of fabricating the same are provided. The memory module includes a substrate. Memory devices are mounted on the substrate in at least two rows and at least two columns. A star-type topology is disposed to be electrically connected to the memory devices. One or more pairs of adjacent ones of the memory devices have a point-symmetric structure.

Abstract: Disclosed is a method of joining electronic package parts, comprising the steps of: reflowing lead-free solders containing alloy elements on top of each of the electronic package parts having a surface treated with copper or nickel; and mounting the surface treated electronic parts on the lead-free solders then reflowing the lead-free solders to generate intermetallic compound between the lead-free solders and the surface treated portion of each of the electronic parts.