Patents by Inventor Yong Ho

Yong Ho has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11600596
    Abstract: A semiconductor package includes a redistribution layer including, a first insulating layer including a first trench, a first conductive layer including a first conductive region extending along a top surface of the first insulating layer and a second conductive region disposed inside the first trench, a second insulating layer on the first conductive layer and the first insulating layer, the second insulating layer including a second trench at least partially overlapping the first trench, the second trench exposing a part of the first conductive region and a second conductive layer including a third conductive region extending along a top surface of the second insulating layer and a fourth conductive region disposed on the second conductive region inside a via trench including sidewalls of the first trench and the second trench, and wherein the second and fourth conductive regions have a width in a range of 20 ?m to 600 ?m.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: March 7, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventor: Yong Ho Kim
  • Publication number: 20230063858
    Abstract: An electronic device includes a flexible display and a device housing that defines a translation surface for the flexible display. A support layer is positioned between a portion of the flexible display and the translation surface. A rotor positioned within a curvilinear section of the flexible display causes a linear translation of the support layer across the translation surface by drawing the flexible substrate around the rotor. A flexible support structure can be positioned between the support layer and the flexible display, with the flexible support structure defining a plurality of engagement teeth with ends extending under one or more housing rails to prevent pillowing of the flexible display.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Inventors: Alberto R. Cavallaro, Yong-Ho Lim, Daniel P. Groebe
  • Publication number: 20230056635
    Abstract: A display device including a display panel having a first side including a display area configured to emit light and a second side opposite to the first side, a sensor having a first surface facing the display panel, a first adhesive layer disposed between the first surface of the sensor and the display panel, and a second adhesive layer disposed on a side surface of the sensor, in which the second adhesive layer and the first adhesive layer contact each other.
    Type: Application
    Filed: November 4, 2022
    Publication date: February 23, 2023
    Inventors: Seong Min WANG, Beohm Rock CHOI, Yong Ho YANG
  • Publication number: 20230040910
    Abstract: A method and an apparatus for STR in a wireless LAN that supports multi-links are disclosed. An operating method of a first communication node comprises the steps of: transmitting a first frame to a second communication node through a first link from among multi-links; receiving, from the second communication node, a response frame for the first frame through the first link; checking a channel occupancy time in a second link from among the multi-links on the basis of first information included in the response frame; and performing a sensing operation in a preset section after the end of the channel occupancy time in the second link.
    Type: Application
    Filed: January 6, 2021
    Publication date: February 9, 2023
    Applicants: ELECTRONICS AND TELECOMMUNICATICATIONS RESEARCH INSTITUTE, KOREA NATIONAL UNIVERSITY OF TRANSPORTATION INDUSTRY ACADEMIC COOPERATION FOUNDATION
    Inventors: Sung Hyun HWANG, Kyu Min KANG, Jae Cheol PARK, Jin Hyung OH, Dong Woo LIM, Su Na CHOI, Yong Ho KIM, Han Seul HONG
  • Publication number: 20230038043
    Abstract: Disclosed is a plasma surface treatment apparatus for conductive powder. The plasma surface treatment apparatus for conductive powder comprises: a reaction chamber including a linear gas inlet at the lower end thereof and a gas outlet at the upper end thereof, and having a vertical cross section that is funnel-shaped; and a plasma jet generation device that is located below the linear gas inlet and is configured to discharge a plasma jet into the reaction chamber from below in an upward direction through the linear gas inlet, wherein powder is accommodated in the reaction chamber and is treated by plasma while buoyed by the plasma jet.
    Type: Application
    Filed: January 22, 2021
    Publication date: February 9, 2023
    Applicant: KOREA INSTITUTE OF FUSION ENERGY
    Inventors: Seung Ryul YOO, Yong Sup CHOI, Yong Ho JUNG, Dong Chan SEOK, Kang Il LEE
  • Patent number: 11576207
    Abstract: A wireless device generating a High-Efficiency (HE) PHY Protocol Data Unit (PPDU) for transmission sets a Packet Extension Disambiguity bit of an HE Signal-A (HE-SIG-A) field of the HE PPDU based on respective durations of a packet extension of the HE PPDU and a signal extension of the HE PPDU. The wireless device may determine whether a relationship T P ? E + ( 4 × ? TXTIME - T S ? E - 2 ? 0 4 ? - ( TXTIME - T S ? E - 2 ? 0 ) ) ? T SYM ? is satisfied, where TPE is the duration of the packet extension, TXTIME is a transmission time of the HE PPDU, TSE is the duration of the signal extension, and TSYM is a duration of symbols in a data field of the HE PPDU. The wireless device may set the Packet Extension Disambiguity bit to one when the relationship is satisfied; and to zero when the relationship is not satisfied.
    Type: Grant
    Filed: September 14, 2020
    Date of Patent: February 7, 2023
    Assignee: ATLAS GLOBAL TECHNOLOGIES LLC
    Inventors: Dae Won Lee, Yong Ho Seok, Yujin Noh
  • Patent number: 11573196
    Abstract: Disclosed is a gas sensor. The gas sensor comprises: a substrate; a thermoelectric layer which is disposed on the substrate and has a metal nanowire; a first electrode and a second electrode disposed to be spaced apart from each other on the thermoelectric layer; and a catalyst layer which is disposed on the first electrode and has a composite structure in which a metal particle is bonded to a carbon structure.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: February 7, 2023
    Assignee: INDUSTRY-UNIVERSITY COOPERATION FOUNDATION HANYANG UNIVERSITY ERICA CAMPUS
    Inventors: Yong Ho Choa, Tae-Yeon Hwang, Yo Seb Song, Se Il Kim, Gwang Myeong Go
  • Publication number: 20230034654
    Abstract: A semiconductor package is provided. The semiconductor package includes: a first stack including a first semiconductor substrate; a through via that penetrates the first semiconductor substrate in a first direction; a second stack that includes a second face facing a first face of the first stack, on the first stack; a first pad that is in contact with the through via, on the first face of the first stack; a second pad including a concave inner side face that defines an insertion recess, the second pad located on the second face of the second stack; and a bump that connects the first pad and the second pad, wherein the bump includes a first upper bump on the first pad, and a first lower bump between the first upper bump and the first pad.
    Type: Application
    Filed: March 23, 2022
    Publication date: February 2, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yong Ho KIM, Bo In NOH, Jeong Hoon AHN
  • Publication number: 20230034210
    Abstract: A rotor assembly includes: a shaft; a rotor core having a through-hole which is formed in an axial direction (A) and into which the shaft is inserted; a magnet inserted into an inner space of the rotor core; and a plate provided in close contact with one side of the rotor core in the axial direction (A). The plate includes a protrusion formed in a region, which faces a region between the magnet and the circumference of the rotor core, and protruding toward the rotor core.
    Type: Application
    Filed: August 2, 2022
    Publication date: February 2, 2023
    Applicant: HYUNDAI MOBIS Co., Ltd.
    Inventors: Yong Ho KIM, Bit Na LEE
  • Patent number: 11558869
    Abstract: A method and device for transmitting a plurality of data units in a wireless local area network (WLAN) are discussed. The method includes obtaining by a station (STA) a transmission opportunity (TXOP), wherein the STA has a right to initiate frame exchange sequences during the TXOP; transmitting during the TXOP, a first data unit of the plurality of data units, wherein the first data unit comprises a signal field including information related to a bandwidth of the first data unit; selecting a bandwidth of a second data unit of the plurality of data units to be narrower than the bandwidth of the first data unit; and transmitting during the TXOP, the second data unit, wherein the second data unit comprises a signal field including information related to the bandwidth of the second data unit, wherein the first data unit is transmitted immediately before the second data unit.
    Type: Grant
    Filed: July 30, 2021
    Date of Patent: January 17, 2023
    Assignee: LG ELECTRONICS INC.
    Inventors: Yu Jin Noh, Byeong Woo Kang, Dae Won Lee, Yong Ho Seok
  • Patent number: 11558319
    Abstract: Disclosed is a method of transmitting an instant message. The method includes collecting previous round responses to an instant message transmitted to previous round transmission targets determined from a user group, identifying users who react to the instant message using a chat room by which the instant message is received based on the previous round responses, training a machine learning model that predicts a response of a user as to whether the user is to react to the instant message based on the previous round responses and characteristics of the identified users, determining a current round transmission target from the user group based on the trained machine learning model, and transmitting the instant message to the determined current round transmission target.
    Type: Grant
    Filed: April 29, 2021
    Date of Patent: January 17, 2023
    Assignee: KAKAO CORP.
    Inventors: Yong Ho Ha, Se Hwan Bae
  • Patent number: 11553426
    Abstract: Disclosed is a method for operating a communication node supporting a low power mode in a wireless LAN. A method for operating a station, which includes a PCR and a WURx, comprises the steps of: allowing the WURx, which operates in a wake-up state, to receive a wake-up packet from an access point; transitioning an operating state of the PCR from a sleep state to the wake-up state when the wake-up packet is received; allowing the PCR, which operates in the wake-up state, to receive a data frame from an access point; and allowing the PCR to transmit, to the access point, a response to the data frame.
    Type: Grant
    Filed: December 8, 2020
    Date of Patent: January 10, 2023
    Assignees: Electronics and Telecommunications Research Institute, Korea National University of Transportation Industry-Academic Cooperation Foundation
    Inventors: Yong Ho Kim, Sung Hyun Hwang, Igor Kim, Seung Keun Park
  • Publication number: 20230005434
    Abstract: A display device may include a first pixel coupled to an emission control line, and an emission control stage for selectively coupling the emission control line to a first or second supply voltage line. The emission control stage may include: a first emission control transistor including a first electrode coupled to the first supply voltage line, a second electrode coupled to the emission control line, and a main gate electrode coupled to a first node; a second emission control transistor including a first electrode coupled to the emission control line, a second electrode coupled to the second supply voltage line, and a main gate electrode coupled to a second node; and a third emission control transistor including a first electrode coupled to the first supply voltage line, a second electrode coupled to the first node, a main gate electrode coupled to the second node, and a sub-gate electrode.
    Type: Application
    Filed: September 8, 2022
    Publication date: January 5, 2023
    Inventors: Seong Min WANG, Young In HWANG, Jin Woo PARK, Yong Ho YANG
  • Publication number: 20220407622
    Abstract: A method and apparatus for transmitting and receiving a block ACK in a wireless LAN system are disclosed. An operation method for a first communication node comprises the steps of: generating a first data frame including first ADDBA information; transmitting the first data frame to a second communication node; and receiving, from the second communication node, a first RA including second ADDBA information generated by the second communication node in response to the first data frame.
    Type: Application
    Filed: November 3, 2020
    Publication date: December 22, 2022
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KOREA NATIONAL UNIVERSITY OF TRANSPORTATION INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Yong Ho Kim, Yong Su Gwak
  • Publication number: 20220408506
    Abstract: Disclosed are a method and apparatus for cooperative communication using a multi-link in a communication system. An operating method of a first device comprises the steps of: generating a first request frame including an information element indicating a link switch time point; transmitting, to a second device, the first request frame via a first link; and receiving, from the second device via the first link, a first response frame indicating that the information element included in the first request frame has been identified.
    Type: Application
    Filed: October 23, 2020
    Publication date: December 22, 2022
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, KOREA NATIONAL UNIVERSITY OF TRANSPORTATION INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Yong Ho Kim, Han Seul Hong
  • Patent number: 11532572
    Abstract: A semiconductor package includes a connection member including an insulating layer and a redistribution layer, a semiconductor chip disposed on the connection member, and an inductance sensing part having a coil form and electrically connected to the semiconductor chip.
    Type: Grant
    Filed: June 24, 2021
    Date of Patent: December 20, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Yoo Rim Cha, Joo Hwan Jung, Jung Chul Gong, Yong Ho Baek, Young Sik Hur
  • Patent number: 11531843
    Abstract: A substrate inspection apparatus generates, when anomalies of a plurality of second solder pastes among a plurality of first solder pastes printed on a first substrate is detected, at least one image indicating a plurality of second solder pastes with anomalies detected by using an image about a first substrate, applies the at least one image to a machine-learning-based model, acquires a plurality of first values indicating relevance of respective first fault types to the at least one image and a plurality of first images indicating regions associated with one of a plurality of first fault types, determines a plurality of second fault types, which are associated with the plurality of second solder pastes by using the plurality of first values and the plurality of first images, and determines at least one third solder paste, which is associated with the respective second fault types.
    Type: Grant
    Filed: January 21, 2020
    Date of Patent: December 20, 2022
    Assignees: KOH YOUNG TECHNOLOGY INC., KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jong Hwan Kim, Juyoun Park, Ye Won Hwang, Jin Man Park, Seung Jae Lee, Tae Min Choi, Yong Ho Yoo, Duk Young Lee
  • Patent number: 11528352
    Abstract: A hinge housing of an electronic device is coupled to a first hinge arm extending into to a first device housing a second hinge arm extending into a second device housing. The first hinge arm has a first pin extending from a terminal edge of the first hinge arm that engages a first slot defined by a first plate fixedly coupled to the first device housing. The second hinge arm has a second pin extending from a terminal edge of the second hinge arm that engages a second slot defined by a second plate fixedly coupled to the second device housing. The pins translate when the first device housing and the second device housing pivot to change a displacement between the hinge housing and the device housings, as well as to separate proximal ends of the first device housing and the second device housing in the closed position.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: December 13, 2022
    Assignee: Motorola Mobility LLC
    Inventors: Yong-Ho Lim, Alberto R. Cavallaro, Thomas Gitzinger
  • Publication number: 20220392405
    Abstract: A pixel includes: an organic light emitting diode; a first transistor including a gate that is connected to a first node, wherein the first transistor is connected between a second node and a third node; a second transistor including a gate that is connected to a corresponding scan line, wherein the second transistor is connected between a data line and the second node; a storage capacitor connected between the first node and a first voltage; a third transistor including a gate that is connected to the corresponding scan line, the third transistor is connected between the first node and the third node; and a fourth transistor connected between a first end of the first transistor and a second voltage.
    Type: Application
    Filed: August 19, 2022
    Publication date: December 8, 2022
    Inventors: Young-In HWANG, Sung Ho KIM, Eung Taek KIM, Yong Ho YANG, Seong Min WANG, Jung-Mi CHOI
  • Patent number: 11522985
    Abstract: An electronic device includes first device housing and a second device housing. The hinge housing is coupled to a first hinge arm extending into to the first device housing a second hinge arm extending into the second device housing. The first hinge arm has a first pin extending from a terminal edge of the first hinge arm that engages a first slot defined by a first bracket fixedly coupled to the first device housing. The second hinge arm has a second pin extending from a terminal edge of the second hinge arm that engages a second slot defined by a second bracket fixedly coupled to the second device housing. The first pin translates with the first slot and the second pin translates within the second slot, respectively, when the first device housing and the second device housing pivot to change a displacement between the hinge housing and the device housings.
    Type: Grant
    Filed: September 30, 2021
    Date of Patent: December 6, 2022
    Assignee: Motorola Mobility LLC
    Inventors: Yong-Ho Lim, Alberto R. Cavallaro, Thomas Gitzinger