Abstract: A treatment liquid supply apparatus includes a discharge line through which treatment liquid is discharged from a substrate processing apparatus; a first tank storing recovered treatment liquid, recovered through the discharge line; a treatment liquid supply unit supplying new treatment liquid to the discharge line through a first transfer line; a first heating unit disposed between the treatment liquid supply unit and the discharge line and controlling a temperature of the new treatment liquid passing through the first transfer line; and a second tank resupplying the recovered treatment liquid supplied from the first tank through a second transfer line to the substrate processing apparatus through a supply line.

Abstract: Disclosed is an ozone water supplying unit capable of maintaining a stable ozone concentration of ozone water supplied to a substrate, and a substrate treating apparatus including the same. The substrate treating apparatus includes: a chamber for liquid-treating a substrate loaded into a treating space with a liquid containing ozone water; and an ozone water supplying unit for supplying ozone water to the treating space, in which the ozone water supplying unit includes: an ozone water generator for generating ozone water; an ozone water supply line for supplying ozone water generated by the ozone water generator to the treating space; and a cooler provided in the ozone water supply line to cool the ozone water flowing through the ozone water supply line.

Abstract: A substrate supporting member capable of controlling the flow of charges on a substrate by controlling ground resistance values of a guide pin and a support pin using a variable resistor, and a substrate treating apparatus including the same are provided. The substrate supporting member includes the body; a support pin installed on the body and for supporting the substrate; a guide pin installed on the body and for supporting the substrate; and a charge control device for controlling a charge around the substrate by controlling an electrical connection between the support pin and a first resistor and an electrical connection between the guide pin and a second resistor.

Abstract: A chemical supply apparatus includes an evaporation unit disposed downstream of a chemical supply source to vaporize supplied chemical thereto, a filter unit disposed downstream of the evaporation unit, wherein the filter unit filters impurities in the vaporized chemical while the vaporized chemical passes through the filter unit, a liquefaction unit disposed downstream of the filter unit to liquefy the vaporized chemical, and a chemical storage tank disposed downstream of the liquefaction unit to store the liquefied chemical therein, wherein an electrode is disposed between the chemical supply source and the liquefaction unit, wherein the electrode electrically reacts with the chemical or particles in the chemical to change electrical properties of the chemical or the particles.

Abstract: An apparatus and method for processing a substrate can reduce the concentration of process by-products in a chemical solution.

Abstract: The inventive concept provides a substrate treating apparatus. In an embodiment, the substrate treating apparatus includes a housing having a treatment space for treating a substrate in an interior thereof, a support unit that supports the substrate in the treatment space, a nozzle that supplies a liquid to the substrate positioned on the support unit, a liquid supply unit that supplies the liquid to the nozzle, and a controller that controls the liquid unit, the liquid supply unit includes a tank having an interior space for storing the liquid, and a first circulation line that circulates the liquid stored in the interior space and in which a first heater is installed, and the controller controls the first heater such that the first heater heats the liquid to a first temperature, at which particles in the interior of the liquid are not eluted.

Abstract: The inventive concept relates to an apparatus for treating a substrate. The apparatus includes a support unit that supports the substrate and a nozzle unit having a nozzle that dispenses a chemical onto the substrate, in which the nozzle is connected with a ground line, and a variable resistor is provided on the ground line.

Abstract: A substrate supporting member capable of controlling the flow of charges on a substrate by controlling ground resistance values of a guide pin and a support pin using a variable resistor, and a substrate treating apparatus including the same are provided. The substrate supporting member includes the body; a support pin installed on the body and for supporting the substrate; a guide pin installed on the body and for supporting the substrate; and a charge control device for controlling a charge around the substrate by controlling an electrical connection between the support pin and a first resistor and an electrical connection between the guide pin and a second resistor.

Abstract: The inventive concept provides a substrate treating apparatus. In an embodiment, the substrate treating apparatus includes a housing having a treatment space for treating a substrate in an interior thereof, a support unit that supports the substrate in the treatment space, a nozzle that supplies a liquid to the substrate positioned on the support unit, a liquid supply unit that supplies the liquid to the nozzle, and a controller that controls the liquid unit, the liquid supply unit includes a tank having an interior space for storing the liquid, and a first circulation line that circulates the liquid stored in the interior space and in which a first heater is installed, and the controller controls the first heater such that the first heater heats the liquid to a first temperature, at which particles in the interior of the liquid are not eluted.

Abstract: A chemical supply apparatus includes an evaporation unit disposed downstream of a chemical supply source to vaporize supplied chemical thereto, a filter unit disposed downstream of the evaporation unit, wherein the filter unit filters impurities in the vaporized chemical while the vaporized chemical passes through the filter unit, a liquefaction unit disposed downstream of the filter unit to liquefy the vaporized chemical, and a chemical storage tank disposed downstream of the liquefaction unit to store the liquefied chemical therein, wherein an electrode is disposed between the chemical supply source and the liquefaction unit, wherein the electrode electrically reacts with the chemical or particles in the chemical to change electrical properties of the chemical or the particles.

Abstract: The inventive concept relates to an apparatus for treating a substrate. The apparatus includes a support unit that supports the substrate and a nozzle unit having a nozzle that dispenses a chemical onto the substrate, in which the nozzle is connected with a ground line, and a variable resistor is provided on the ground line.