Patents by Inventor Yong Hoon Kwak

Yong Hoon Kwak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Power module package
    Patent number: 9105611
    Abstract: Disclosed herein is a power module package including: a substrate having a ceramic layer formed in one surface thereof; a circuit pattern formed on the ceramic layer; a first lead frame having one side contacting the circuit pattern and the other side protruding toward the outside; and a first semiconductor chip mounted on one side of the first lead frame.
    Type: Grant
    Filed: September 11, 2012
    Date of Patent: August 11, 2015
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Kwang Soo Kim, Yong Hoon Kwak, Sun Woo Yun, Young Ki Lee, Kyu Hwan Oh, Jin Suk Son
  • POWER MODULE PACKAGE
    Publication number: 20130105953
    Abstract: Disclosed herein is a power module package including: a substrate having a ceramic layer formed in one surface thereof; a circuit pattern formed on the ceramic layer; a first lead frame having one side contacting the circuit pattern and the other side protruding toward the outside; and a first semiconductor chip mounted on one side of the first lead frame.
    Type: Application
    Filed: September 11, 2012
    Publication date: May 2, 2013
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Soo Kim, Yong Hoon Kwak, Sun Woo Yun, Young Ki Lee, Kyu Hwan Oh, Jin Suk Son