Patents by Inventor Yong-Hoon Sang

Yong-Hoon Sang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of fabricating semiconductor devices including semiconductor layers formed in stacked insulating layers
    Patent number: 8445343
    Abstract: Methods of fabricating a semiconductor device include alternatingly and repeatedly stacking sacrificial layers and first insulating layers on a substrate, forming an opening penetrating the sacrificial layers and the first insulating layers, and forming a spacer on a sidewall of the opening, wherein a bottom surface of the opening is free of the spacer. A semiconductor layer is formed in the opening. Related devices are also disclosed.
    Type: Grant
    Filed: February 18, 2011
    Date of Patent: May 21, 2013
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung Ho Kim, Kihyun Hwang, Sangryol Yang, Yong-Hoon Sang, Ju-Eun Kim
  • Method of Fabricating Semiconductor Devices
    Publication number: 20110207304
    Abstract: Methods of fabricating a semiconductor device include alternatingly and repeatedly stacking sacrificial layers and first insulating layers on a substrate, forming an opening penetrating the sacrificial layers and the first insulating layers, and forming a spacer on a sidewall of the opening, wherein a bottom surface of the opening is free of the spacer. A semiconductor layer is formed in the opening. Related devices are also disclosed.
    Type: Application
    Filed: February 18, 2011
    Publication date: August 25, 2011
    Inventors: Jung Ho Kim, Kihyun Hwang, Sangryol Yang, Yong-Hoon Sang, Ju-Eun Kim