Abstract: Disclosed are a substrate processing method and a substrate processing apparatus. The substrate processing method of etching a thin film formed on a substrate in units of atomic layers includes a modifying step of supplying a modifying gas to a processing space in a chamber accommodating the substrate to modify a surface of the thin film and form a modified film having a first thickness, a surface adsorption step of supplying a precursor to the processing space to adsorb the precursor to the modified surface of the thin film, and an etching step of supplying heat to the substrate adsorbed with the precursor to etch the modified surface of the thin film adsorbed with the precursor. The surface adsorption step and the etching step are repeatedly performed multiple times until the modified film having the first thickness is etched.

Abstract: Disclosed herein is a method for producing a cyst-expressed transgenic animal using a PDK2 gene. The production method comprises preparing a PKD2 protein expression vector, inserting the expression vector into the nucleus of a fertilized egg to produce a PKD2 expression vector-containing fertilized egg, and transplanting the produced fertilized egg into the uterus of a surrogate mother. According to the invention disclosed herein, there is provided a method for producing transgenic animals, in which cysts are expressed only by the overexpression of the PKD2 gene. Also, transgenic mice are provided which can be effectively used in the investigation of cyst expression mechanisms and cyst control systems.