Patents by Inventor Yong-Hua Bu

Yong-Hua Bu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100174519
    Abstract: A platform for simulating a chip includes a component module, a configuration module and a top module. The component module is utilized for storing a plurality of component models and information related to the plurality of component models. The configuration module is utilized for generating a configuration result according to the component model needed by the chip. The top module is coupled to the component module and the configuration module, for reading information related to the component model from the component module according to the configuration result, so as to simulate the chip.
    Type: Application
    Filed: December 23, 2009
    Publication date: July 8, 2010
    Inventor: Yong-Hua Bu