Patents by Inventor Yong Hyen PARK

Yong Hyen PARK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ANTENNA MODULE
    Publication number: 20210320428
    Abstract: An antenna module including two or more substrates stacked and having different flexibility, a patch antenna disposed above or within an uppermost substrate from among the two or more substrates, and an IC disposed below or within a lowermost substrate from among the two or more substrates, and electrically connected to the patch antenna through the substrates, wherein the two or more substrates comprise a first substrate and a second substrate, and wherein the second substrate is more flexible than the first substrate, and extends in a lateral direction to have an overlap region overlapping the first substrate and an extension region not overlapping the first substrate.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 14, 2021
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Il Kweon JOUNG, Yong Hyen PARK, Jung Won LEE
  • Antenna module
    Patent number: 11088468
    Abstract: An antenna module including two or more substrates stacked and having different flexibility, a patch antenna disposed above or within an uppermost substrate from among the two or more substrates, and an IC disposed below or within a lowermost substrate from among the two or more substrates, and electrically connected to the patch antenna through the substrates, wherein the two or more substrates comprise a first substrate and a second substrate, and wherein the second substrate is more flexible than the first substrate, and extends in a lateral direction to have an overlap region overlapping the first substrate and an extension region not overlapping the first substrate.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: August 10, 2021
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Il Kweon Joung, Yong Hyen Park, Jung Won Lee
  • ANTENNA MODULE
    Publication number: 20190207323
    Abstract: An antenna module including two or more substrates stacked and having different flexibility, a patch antenna disposed above or within an uppermost substrate from among the two or more substrates, and an IC disposed below or within a lowermost substrate from among the two or more substrates, and electrically connected to the patch antenna through the substrates, wherein the two or more substrates comprise a first substrate and a second substrate, and wherein the second substrate is more flexible than the first substrate, and extends in a lateral direction to have an overlap region overlapping the first substrate and an extension region not overlapping the first substrate.
    Type: Application
    Filed: October 22, 2018
    Publication date: July 4, 2019
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Il Kweon JOUNG, Yong Hyen PARK, Jung Won LEE