Abstract: The inventive concepts provide an apparatus for treating a substrate. The apparatus includes a housing having a treatment space therein, a support unit supporting the substrate in the treatment space, a nozzle unit discharging a solution onto the substrate supported by the support unit, and a solution supply unit supplying the solution to the nozzle unit. The solution supply unit includes a solution supply line connected to the nozzle unit, a heating member installed on the solution supply line to heat the solution, and a recovery line diverging from the solution supply line at a first point disposed downstream from the heating member.

Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus includes a container providing a space in which a supercritical fluid flows or is received, a recovery tube having one end connected to the container to discharge the supercritical fluid within the container, the recovery tube including a valve, and a waste tube connected to the container to discharge the supercritical fluid within the container, the waste tube including a safety valve. The recovery tube having the other end connected to a recovery container in which the supercritical fluid discharged from the container is received for reusing.