Patents by Inventor Yong-Il Kwak

Yong-Il Kwak has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Package substrate, semiconductor package having the package substrate
    Patent number: 8013432
    Abstract: A package substrate includes an insulating substrate having a mount region including external terminals mounted to the insulating substrate and a clamp region having an opening receiving a molding material therein, the clamp region disposed adjacent to the mount region in a first direction, a circuit pattern formed on the insulating substrate, and a blocking member blocking the molding material from moving from the clamp region to the mount region when the package substrate loaded in a mold die is pressurized to form a molding member, wherein the blocking member is disposed on at least one side of the package substrate in the clamp region, and the blocking member receives the molding material therein.
    Type: Grant
    Filed: September 11, 2009
    Date of Patent: September 6, 2011
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Yong-Il Kwak, Jun-Hyuk Choi, Jeong-Sam Lee, Jong-Kak Jang
  • PACKAGE SUBSTRATE, SEMICONDUCTOR PACKAGE HAVING THE PACKAGE SUBSTRATE
    Publication number: 20100065957
    Abstract: A package substrate includes an insulating substrate having a mount region including external terminals mounted to the insulating substrate and a clamp region having an opening receiving a molding material therein, the clamp region disposed adjacent to the mount region in a first direction, a circuit pattern formed on the insulating substrate, and a blocking member blocking the molding material from moving from the clamp region to the mount region when the package substrate loaded in a mold die is pressurized to form a molding member, wherein the blocking member is disposed on at least one side of the package substrate in the clamp region, and the blocking member receives the molding material therein.
    Type: Application
    Filed: September 11, 2009
    Publication date: March 18, 2010
    Inventors: Yong-Il Kwak, Jun-Hyuk Choi, Jeong-Sam Lee, Jong-Kak Jang