Patents by Inventor Yong In

Yong In has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230167588
    Abstract: The present invention relates to a method for manufacturing carbon composite fibers and carbon nanofibers, and more particularly, to a method for manufacturing carbon composite fiber with greatly improved specific tensile strength, specific modulus, electrical conductivity, and thermal conductivity.
    Type: Application
    Filed: November 4, 2022
    Publication date: June 1, 2023
    Inventors: Bon-Cheol KU, Sung Yong Kim, Seo Gyun KIM, NAM HO YOU, Jungwon KIM, Jun Yeon HWANG, Nam Dong KIM, Dae-Yoon KIM
  • Publication number: 20230167068
    Abstract: Disclosed is a benzopyrazole compound. Specifically disclosed are a compound as shown in formula (I) and a pharmaceutically acceptable salt thereof.
    Type: Application
    Filed: December 30, 2020
    Publication date: June 1, 2023
    Applicant: MEDSHINE DISCOVERY INC.
    Inventors: Sheng SU, Xiawei WEI, Yunfu LUO, Guoli ZHANG, Yong WANG, Shuhui CHEN
  • Publication number: 20230168947
    Abstract: Some embodiments provide a method for updating a core allocation among processes of a gateway datapath executing on a gateway computing device having multiple cores. The gateway datapath processes include a first set of data message processing processes to which a first set of the cores are allocated and a second set of processes to which a second set of the cores are allocated in a first core allocation. Based on data regarding usage of the cores, the method determines a second core allocation that allocates a third set of the cores to the first set of processes and a fourth set of the cores to the second set of processes. The method updates a load balancing operation to load balance received data messages over the third set of cores rather than the first set of cores. The method reallocates the cores from the first allocation to the second allocation.
    Type: Application
    Filed: January 31, 2023
    Publication date: June 1, 2023
    Inventors: Yong Wang, Mani Kancherla, Kevin Li, Sreeram Ravinoothala, Mochi Xue
  • Publication number: 20230166741
    Abstract: An apparatus for calculating torque of a vehicle for exiting drift driving may include a processor and a non-transitory computer-readable storage medium storing a program which, when executed by the processor, causes: determining a driver's intention to exit drift driving based on an opening degree of an accelerator pedal and a steering angle; and calculating target torque of a front wheel motor based on the opening degree of the accelerator pedal when the driver's intention to exit drift driving is determined.
    Type: Application
    Filed: March 25, 2022
    Publication date: June 1, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Han Seon GA, Sang Wook HAN, Ki Soo PARK, Yong Hwa LEE, Woo Pyeong SEO, Jin Seok SONG, Ho Wook LEE, So Ra JANG
  • Publication number: 20230166351
    Abstract: The present invention discloses a varifocal laser processing system and method based on a variable light spot diffractive element. The system includes a laser device for generating a laser, a collimating lens for changing a light path and a diffractive optical element module for controlling light spot focal point distribution. The laser emitted by the laser device passes through the collimating lens to irradiate the diffractive optical element module, and the laser focused by the diffractive optical element module irradiates a to-be-processed workpiece; and the diffractive optical element module includes at least two DOE lenses oppositely distributed in an axial direction and a rotary actuator driving the DOE lenses to rotate. The rotary actuator drives at least one DOE lens to rotate with a central axis as a rotating center, thereby changing a position of a focal point generated after the laser is focused by the diffractive optical element module.
    Type: Application
    Filed: November 3, 2022
    Publication date: June 1, 2023
    Applicant: HSG LASER CO., LTD.
    Inventors: Bin DU, Yong CHANG
  • Publication number: 20230166383
    Abstract: A high-rotational speed cup-shaped grinding wheel includes an annular base, several blades and a flow splitting structure. The blades are fixed on a side of the base at an interval in a circumferential direction to form a blade ring. The side of the blade ring away from the base forms an annular working surface, and two adjacent blades are spaced apart from each other to form a water passage channel for delivering cooling water to the working surface. The flow splitting structure is fixed on the blade ring and splits the cooling water into two branches, where a first branch delivers the cooling water to an outer area of the working surface, and a second branch delivers the cooling water to an inner area of the working surface, and then delivers the cooling water from an inner area of the working surface to an outer side area thereof.
    Type: Application
    Filed: March 12, 2021
    Publication date: June 1, 2023
    Applicant: GUILIN CHAMPION UNION DIAMOND CO., LTD.
    Inventors: Jingxin SONG, Anning LIANG, Huiling LONG, Yong YE, Zhiyong WANG, Liang ZHAO, Fengming QIN
  • Publication number: 20230171757
    Abstract: A method of wireless communication by a user equipment (UE) includes determining a first synchronization signal block (SSB) to monitor beam management. The first SSB comprises a primary synchronization signal (PSS), multiple physical broadcast channels (PBCHs), and a secondary synchronization signal (SSS). The method also includes determining a list of receive beams for measuring the first SSB. The method further includes measuring the first SSB by measuring the PSS with a first beam from the list of receive beams, measuring, with a second beam from the list of receive beams, a first demodulation reference signal (DMRS) on a first PBCH symbol of a first of the PBCHs, measuring the SSS with a third beam from the list of receive beams; and measuring, with a fourth beam from the list of receive beams, a second DMRS on a second PBCH symbol of a second of the PBCHs.
    Type: Application
    Filed: December 1, 2021
    Publication date: June 1, 2023
    Inventors: Kang GAO, Jun ZHU, Yong LI, Yongle WU, Raghu Narayan CHALLA
  • Publication number: 20230167950
    Abstract: The embodiments of the present disclosure provide a method for safety management of a compressor in a smart gas pipeline network and an Internet of Things system thereof. The method is implemented based on a smart gas safety management platform of an Internet of Things system for safety management of a compressor in a smart gas pipeline network. The method comprises: obtaining sound data and a target vibration feature of a gas compressor, and determining a target sound feature based on the sound data; obtaining gas data and device data, and determining a standard sound feature and a standard vibration feature based on the gas data and the device data; and predicting whether there is a safety hazard in the gas compressor based on the target vibration feature and the standard vibration feature, or based on the target sound feature and the standard sound feature.
    Type: Application
    Filed: January 12, 2023
    Publication date: June 1, 2023
    Applicant: CHENGDU QINCHUAN IOT TECHNOLOGY CO., LTD.
    Inventors: Zehua SHAO, Yong LI, Yuefei WU, Bin LIU, Guanghua HUANG
  • Publication number: 20230170329
    Abstract: A method of forming a semiconductor package includes providing a metal baseplate including a base section and a plurality of metal posts, the base section being a planar pad of substantially uniform thickness, the plurality of metal posts each extending up from a planar upper surface of the base section, mounting a semiconductor die on the upper surface of the metal baseplate, forming an encapsulant body of electrically insulating mold compound on the upper surface of the base section, electrically connecting terminals of the semiconductor die to the metal posts, and removing the base section so as to form package contacts from the metal posts at a first surface of the encapsulant body.
    Type: Application
    Filed: August 16, 2022
    Publication date: June 1, 2023
    Inventors: Sock Chien Tey, Keck Tim Ang, Chan Lam Cha, Chau Fatt Chiang, Badrul Hisyam Ismail, Desmond Jenn Yong Loo, Ronizan Mohd Salleh, Norliza Morban, Si Hao Vincent Yeo, Chee Mun Wai, Fee Hoon Wendy Wong
  • Publication number: 20230168325
    Abstract: A magnetic resonance imaging system and method, and a computer-readable storage medium are provided. The magnetic resonance imaging method includes: acquiring a plurality of k-space data sets by using a plurality of imaging sequences, each imaging sequence comprising a pre-phase-dispersion gradient pulse and a plurality of phase encoding gradients applied after the pre-phase-dispersion gradient pulse, wherein the pre-phase-dispersion gradient pulses of the plurality of imaging sequences have a standard area difference therebetween when ordered according to area values; respectively reconstructing magnetic resonance images from the respective k-space data sets; and averaging amplitudes of the magnetic resonance images to generate a magnetic resonance image of an average amplitude.
    Type: Application
    Filed: November 17, 2022
    Publication date: June 1, 2023
    Inventors: Lei Gao, Hua Li, Xuan Liu, Yong Chuan Lai, Jiabin Yao
  • Publication number: 20230170150
    Abstract: A multilayer ceramic capacitor includes a ceramic body including dielectric layers, a plurality of internal electrodes disposed in the ceramic body, and a first side margin portion and a second side margin portion respectively arranged on end portions of the internal electrodes exposed to first and second surfaces. The first and second side margin portions each include a first region adjacent to an outward facing side surface of the respective side margin portion, and a second region adjacent to the internal electrodes exposed to the first and second surfaces of the ceramic body, and an average size of dielectric grains included in the second region is larger than an average size of dielectric grains included in the first region.
    Type: Application
    Filed: January 31, 2023
    Publication date: June 1, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jong Ho LEE, Yong PARK, Ki Pyo HONG, Sim Chung KANG
  • Publication number: 20230170638
    Abstract: A connector assembly includes a female connector having a pair of female terminals inserted into a housing of which one side is open, and including a male connector having a male terminal inserted between the pair of female terminals to come into contact with the pair of female terminals. one end of a female terminal of the pair of female terminals is fixed to an inner surface of the housing. The other end thereof is disposed to extend by a predetermined length. A displacement of the other end occurs toward the one end due to the configuration of the male connector. A contact defect problem during coupling does not occur and reworking of the connector assembly is facilitated.
    Type: Application
    Filed: April 7, 2022
    Publication date: June 1, 2023
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Eul-Yong Chae, Min-Gun Jeong
  • Publication number: 20230169843
    Abstract: The present disclosure provides a method, an Internet of Things system and medium for monitoring smart gas harmful components. The method comprises: obtaining composition information of a gas and use information of a user; determining a generation rate of harmful components of the gas based on the composition information and the use information; and generating warning information in response to the generation rate of the harmful components being greater than a generation rate threshold.
    Type: Application
    Filed: January 8, 2023
    Publication date: June 1, 2023
    Applicant: CHENGDU QINCHUAN IOT TECHNOLOGY CO., LTD.
    Inventors: Zehua SHAO, Haitang XIANG, Lei ZHANG, Yong LI, Yongzeng LIANG
  • Publication number: 20230170290
    Abstract: Disclosed is a semiconductor package comprising a redistribution substrate and a semiconductor chip on the redistribution substrate. The redistribution substrate includes a plurality of first conductive patterns including a pair of first signal patterns that are adjacent to each other, and a plurality of second conductive patterns on surfaces of the first conductive patterns and coupled to the first conductive patterns. The second conductive patterns include a ground pattern insulated from the pair of first signal patterns. The ground pattern has an opening that penetrates the ground pattern. When viewed in plan, the pair of first signal patterns overlap the opening.
    Type: Application
    Filed: August 12, 2022
    Publication date: June 1, 2023
    Inventors: YUN-HEE LEE, JAESUN KIM, SEOKBEOM YONG, WONJAE LEE
  • Publication number: 20230168416
    Abstract: An optical film, comprising a substrate, wherein a first plurality of multi-faceted recesses are formed on the substrate, wherein the plurality of multi-faceted recesses are capable of scattering lights that enter into a second surface of the substrate, said first surface and said second surface are two opposite surfaces of the substrate.
    Type: Application
    Filed: October 28, 2022
    Publication date: June 1, 2023
    Inventors: CHING-AN YANG, Lung-Pin Hsin, Hui-Yong Chen, Chien-Chih Lai, Yu-Mei Juan, Chia-Yeh Miu, Ge-Wei Lin, Ming Te Huang, CHENG CHIEH CHIU, WEN JEN WU
  • Publication number: 20230168917
    Abstract: Some embodiments provide novel methods for performing services for machines operating in one or more datacenters. For instance, for a group of related guest machines (e.g., a group of tenant machines), some embodiments define two different forwarding planes: (1) a guest forwarding plane and (2) a service forwarding plane. The guest forwarding plane connects to the machines in the group and performs L2 and/or L3 forwarding for these machines. The service forwarding plane (1) connects to the service nodes that perform services on data messages sent to and from these machines, and (2) forwards these data messages to the service nodes. In some embodiments, the guest machines do not connect directly with the service forwarding plane. For instance, in some embodiments, each forwarding plane connects to a machine or service node through a port that receives data messages from, or supplies data messages to, the machine or service node.
    Type: Application
    Filed: January 31, 2023
    Publication date: June 1, 2023
    Inventors: Fenil Kavathia, Anuprem Chalvadi, Yang Ping, Akhila Naveen, Yong Feng, Kantesh Mundaragi, Rahul Mishra, Pierluigi Rolando, Jayant Jain, Raju Koganty
  • Publication number: 20230170028
    Abstract: A non-volatile memory device includes a memory cell which stores one of first data and second data, and includes a first sub-memory cell connected to a first word line and a first bit line, and a second sub-memory cell connected to a second word line and a second bit line, a source line shared by the first sub-memory cell and the second sub-memory cell, and a sense amplifier connected to the first bit line and the second bit line which reads data stored in the memory cell. The sense amplifier receives a first current from the first bit line, receives a second current from the second bit line, and reads data stored in the memory cell by comparing magnitudes of the first current and the second current. The first sub-memory cell is programmed, and the second sub-memory cell is erased, in response to the memory cell storing the first data.
    Type: Application
    Filed: July 22, 2022
    Publication date: June 1, 2023
    Inventors: Hyun Ik Park, Jae Hun Lee, Chang Min Jeon, Yong Kyu Lee
  • Publication number: 20230171941
    Abstract: The present disclosure provides a manufacturing method of a semiconductor structure and a semiconductor structure, and relates to the technical field of semiconductors. The manufacturing method of a semiconductor structure includes: providing a substrate; forming active pillars arranged at intervals on the substrate, the active pillar includes a first segment, a second segment, and a third segment that are connected sequentially along a first direction; forming a gate oxide layer on sidewalls of each of the second segment and the third segment; and forming a word line structure on a sidewall of the gate oxide layer, the word line structure includes a first word line structure and a second word line structure that are made of different materials, and the first word line structure is connected to the sidewall of the gate oxide layer, and partially covers the second word line structure.
    Type: Application
    Filed: August 5, 2022
    Publication date: June 1, 2023
    Inventors: Deyuan XIAO, Yong Yu, Guangsu Shao
  • Publication number: 20230171939
    Abstract: The present disclosure provides a manufacturing method of a semiconductor structure and a semiconductor structure. The manufacturing method of a semiconductor structure includes: providing a substrate; forming a plurality of silicon pillars on the substrate, where the silicon pillars are arranged as an array; preprocessing the silicon pillar to form an active pillar, where the active pillar includes a first segment, a second segment, and a third segment; forming a first gate oxide layer on sidewalls of the second segment and the third segment; and forming a second gate oxide layer on the first gate oxide layer, where a length of the second gate oxide layer is less than that of the first gate oxide layer, and a thickness of the second gate oxide layer is greater than that of the first gate oxide layer.
    Type: Application
    Filed: August 9, 2022
    Publication date: June 1, 2023
    Inventors: Deyuan XIAO, Yong YU, Guangsu SHAO
  • Publication number: 20230172055
    Abstract: Provided are a compound capable of improving the luminous efficiency, stability and lifespan of an organic electronic device, an organic electronic element using the same, and an electronic device thereof.
    Type: Application
    Filed: June 17, 2022
    Publication date: June 1, 2023
    Applicant: DUK SAN NEOLUX CO., LTD.
    Inventors: Hyoung Keun PARK, Min Ji JO, Sun Hee LEE, Soung Yun MUN, Yong Wook PARK, Jin Woo SHIN