Abstract: A method for controlling an electricity generation mode of a vehicle includes detecting an idle condition of an engine. An electricity generation mode is performed in which a generator generates an electricity. An idle RPM is increased in the electricity generation mode. An managing mode is entered if the electricity generation mode time elapses a reference time. An engine RPM is increased or decreased for a predetermined time in the managing mode.

Abstract: A method for controlling a fuel pump for a hybrid diesel vehicle may include determining, by a control device, whether to drive the hybrid diesel vehicle in an EV driving mode or in an engine driving mode by reflecting a vehicle driving state information value and stopping, by the control device, operation of a fuel pump relay when the determination is made to drive in the EV driving mode.

Abstract: A method for limiting an engine torque when a failure occurs in a water sensor of a fuel filter includes sensing the failure of the water sensor installed in the fuel filter through a failure diagnosis logic in a diesel hybrid vehicle. A current vehicle driving mode is checked when the failure of the water sensor is sensed. Whether or not a first time period elapses a first delay time after sensing the failure of the water sensor when the current vehicle driving mode is an engine driving mode is determined. The engine torque is limited and reduced when the first time period elapses the first delay time.

Abstract: A method for controlling an air control valve in a diesel hybrid vehicle includes an engine stop detection step for detecting whether a diesel engine is stopped and a vehicle speed is less than a predetermined speed, a first noise and vibration blockade step for controlling a throttle valve to be closed when the diesel engine is stopped and the vehicle speed is less than the predetermined speed, and a first throttle valve control step for closing and then opening again the throttle valve for a predetermined time.

Abstract: A malfunction diagnosis method of a middle door or a step for a vehicle may include: a first receiving step receiving a first operating signal from the middle door or the step of the vehicle; a first diagnosis step of diagnosing whether the middle door or the step is in a failure state based on the first operating signal; a second receiving step of receiving a second operating signal from the middle door or the step of the vehicle; a second diagnosis step of diagnosing whether the middle door or the step is in a failure state based on the second operating signal; determining whether an engine is starting if the first and second diagnosing steps indicate the middle door or the step is in the failure state; and setting an interlock on an accelerator pedal if it is determined that the engine is starting.

Abstract: A phase shift mask includes a substrate, a second phase shift pattern on the substrate, the second phase shift pattern extending to an outermost perimeter of the substrate, the second phase shift pattern being formed of a material that is semi-transmissive to light of a first wavelength and the substrate being substantially transparent to the light of the first wavelength such that the mask transmits about 2 to about 10% of the light of the first wavelength at the second phase shift pattern, and a first phase shift pattern on the substrate, the second phase shift pattern being disposed between the outermost perimeter of the substrate and the first phase shift pattern.

Abstract: Provided is a method of manufacturing a semiconductor package. The method includes mounting a semiconductor device on a substrate; disposing a mold on the substrate, wherein the mold is formed to cover the semiconductor device such that at least one inner side surface of the mold has a slope; providing a molding material into the mold to encapsulate the semiconductor device; removing the mold from the substrate; and forming an electromagnetic shielding (EMS) layer to cover a top surface and side surfaces of the molding material.

Abstract: The present disclosure may fix the second yoke without using an upper cover and a lower cover, thereby having an effect of simplifying the entire structure, and reducing the fabrication cost, and decreasing the fabrication time.

Abstract: A system for improving exhaust gas purification performance of a diesel hybrid electric vehicle in which an SCR catalyst is equipped in an exhaust line to reduce nitrogen oxide within exhaust gas may include a hybrid control unit configured to request an engine control unit to turn off an engine to make the diesel hybrid electric vehicle enter a hybrid driving mode, and an engine control unit configured to determine whether urea is required to be injected into a front of the SCR catalyst when receiving a request of an engine off from the hybrid control unit.

Abstract: Embodiments of the inventive concept include a semiconductor package having a plurality of stacked semiconductor chips. A multi-layered substrate includes a central insulation layer, an upper wiring layer disposed on an upper surface of the central insulation layer, and a first lower wiring layer disposed on a lower surface of the central insulation layer. The stacked semiconductor chips are connected to the multi-layered substrate and/or each other using various means. The semiconductor package is capable of high performance operation, like a semiconductor package based on flip-ship bonding, and also meets the need for large capacity by overcoming a limitation caused by a single semiconductor chip. Embodiments of the inventive concept also include methods of manufacturing the semiconductor package.

Abstract: A mineral water bottle having a tea bag receipt part which is provided inside the bottle to make contents in the tea bag infused in a bottle such that a user may easily make drinks such as green tea and coffee. The tea bag receipt part is disposable but is also replaceable, and thus is able to be used for several times economically.

Abstract: Embodiments of the inventive concept include a semiconductor package having a plurality of stacked semiconductor chips. A multi-layered substrate includes a central insulation layer, an upper wiring layer disposed on an upper surface of the central insulation layer, and a first lower wiring layer disposed on a lower surface of the central insulation layer. The stacked semiconductor chips are connected to the multi-layered substrate and/or each other using various means. The semiconductor package is capable of high performance operation, like a semiconductor package based on flip-ship bonding, and also meets the need for large capacity by overcoming a limitation caused by a single semiconductor chip. Embodiments of the inventive concept also include methods of manufacturing the semiconductor package.

Abstract: An overcurrent relay and a molded case circuit breaker (MCCB) including the same are provided. The MCCB includes: a switching mechanism unit; an overcurrent relay; a trip mechanism, wherein the overcurrent relay includes: a case body; a case cover coupled to the case body; a control unit installed within the case body and having an electronic circuit board; and a plurality of setting knobs disposed to be spaced apart from one another on the electronic circuit board, having an indication unit exposed to the outside to indicate a current reference value and a trip operation time marked on the case cover, respectively, and configured to be rotatable, respectively.

Abstract: An air flow sensor chip-heating control device and method of a diesel hybrid electric vehicle controls whether an air flow sensor installed in an engine intake system of the diesel hybrid electric vehicle performs a chip-heating operation. Particularly, the air flow sensor chip-heating control device performs a chip heating operation of the air flow sensor based on a result obtained by deciding a driving history of an engine when the vehicle enters into a hybrid mode during driving of the engine.

Abstract: A semiconductor package may include a substrate including a substrate connection terminal, at least one semiconductor chip stacked on the substrate and having a chip connection terminal, a first insulating layer covering at least portions of the substrate and the at least one semiconductor chip, and/or an interconnection penetrating the first insulating layer to connect the substrate connection terminal to the chip connection terminal. A semiconductor package may include stacked semiconductor chips, edge portions of the semiconductor chips constituting a stepped structure, and each of the semiconductor chips including a chip connection terminal; at least one insulating layer covering at least the edge portions of the semiconductor chips; and/or an interconnection penetrating the at least one insulating layer to connect to the chip connection terminal of each of the semiconductor chips.

Abstract: Method of detecting a touched position on a touch display of a display apparatus includes determining an amount of an electrical charge generated by a touch on the touch display panel of a display apparatus, determining a difference between the amount of the electrical charge generated from the touch and an amount of a reference electrical charge and comparing this difference to a threshold value, detecting the position of the touch if it is determined that the difference between the amount of the electrical charge generated from the touch and the amount of the reference electrical charge is substantially the same as or larger than the threshold value and detecting the touched position using a pressure according to the touch if it is determined that difference between the amount of the electrical charge and the amount of the reference voltage is smaller than the threshold value.

Abstract: The present invention discloses a linear compressor which can rapidly overcome load and improve compression efficiency, by synchronizing an operation frequency of a linear motor with a natural frequency of a movable member varied by the load and varying a stroke of the movable member according to the load. The linear compressor includes a fixed member having a compression space inside, a movable member linearly reciprocated in the fixed member in the axial direction, for compressing refrigerants sucked into the compression space, one or more springs installed to elastically support the movable member in the motion direction of the movable member, spring constants of which being varied by load, and a linear motor installed to be connected to the movable member, for linearly reciprocating the movable member in the axial direction, and varying a stroke of the movable member according to a predetermined refrigeration force, so that the movable member can be linearly reciprocated to reach a top dead center.

Abstract: Embodiments of the inventive concept include a semiconductor package having a plurality of stacked semiconductor chips. A multi-layered substrate includes a central insulation layer, an upper wiring layer disposed on an upper surface of the central insulation layer, and a first lower wiring layer disposed on a lower surface of the central insulation layer. The stacked semiconductor chips are connected to the multi-layered substrate and/or each other using various means. The semiconductor package is capable of high performance operation, like a semiconductor package based on flip-ship bonding, and also meets the need for large capacity by overcoming a limitation caused by a single semiconductor chip. Embodiments of the inventive concept also include methods of manufacturing the semiconductor package.

Abstract: A liquid crystal display includes: a first display panel, a second display panel having a lower surface that faces the first display panel and an opposing an upper surface of the second display panel, a liquid crystal layer disposed between the first display panel and the second display panel, a first resistive layer disposed on the upper surface of the second display panel and extending in a first direction, a pressure sensing layer disposed on the first resistive layer, and a second resistive layer disposed on the pressure sensing layer and extending in a second direction intersecting the first direction.

Abstract: Provided are a semiconductor package and a method of fabricating the same. The semiconductor package includes a first package having a first package substrate mounted with a lower semiconductor chip, and a second package having a second package substrate mounted with upper semiconductor chips. The second package substrate includes a chip region on which the upper semiconductor chips are mounted, and a connection region provided therearound. The chip region includes a first surface defining a first recess region and a second surface defining a first protruding portion. The upper semiconductor chips are mounted on opposite edges of the second surface and spaced apart from each other to have portions protruding toward the connection region beyond the chip region.