Abstract: Semiconductor package and fabricating method thereof are provided. Semiconductor package comprises a buffer die including a semiconductor substrate having a first surface and a second surface, which face each other, and a passivation layer formed on the first surface, a plurality of core chips stacked on the buffer die, including a first core chip, which is disposed at a lowermost end, among the plurality of core chips, an adhesive layer between the buffer die and the first core chip, and a mold layer surrounding an upper surface of the buffer die and the plurality of core chips, wherein a plurality of recesses recessed inward from an upper surface of the passivation layer are formed on the upper surface of the passivation layer, and the plurality of recesses are formed to surround the first core chip and do not overlap the first core chip horizontally.

Abstract: A device for fixing a measuring instrument for inspecting a display includes a fixed frame unit detachably mounted on the top end of a display, a moving frame extending upward and downward and mounted to be liftable on the fixed frame unit, and an elevating unit which is mounted to be liftable on the moving frame and on which a measuring instrument for inspecting a display is detachably mounted.

Abstract: Disclosed is an inductor device and method of manufacturing the same. The inductor device includes an insulating layer, a coil pattern formed on two opposing surfaces of the insulating layer, a first insulating film and a second insulating film formed with different insulating materials on the coil pattern, and a magnetic member formed to enclose the insulating layer, the coil pattern and the first and the second insulating films. By forming thin dual insulating films having a high adhesive strength and breaking strength on an inductor coil, it is possible to improve Ls characteristics of the inductor device and increase the inductance.

Abstract: The present invention is related to a condensation prevention type transmission window for a CMS module test chamber, the transmission window being provided at the module test chamber. The condensation prevention type transmission window includes: a multilayer glass panel in which heating wires are coated on upper, lower, left, and right side surfaces thereof; and an air injector provided at each of opposite surfaces of the transmission window to inject air from an upper side edge and/or a lower side edge of the transmission window and to form an air curtain. The present invention provides the condensation prevention type transmission window for a CMS module test chamber, which prevents freezing and fogging on inside and outside surfaces of the transmission window of the CMS module test chamber varying in a temperature range from 40° C. to +125° C.

Abstract: The present invention relates to a filter and a method of manufacturing the same, the filter including an RF connector configured to have a predetermined electrical signal line, a filter body having at least one impedance matching space in which the RF connector is installed, a relevant PCB on which one end of the RF connector is fixedly mounted, the relevant PCB coupled to be in close contact with one side surface of the filter body, and an annular gasket interposed between one side surface of the filter body and the relevant PCB to block a signal leak, in which a concave-convex portion is processed on a surface of one side surface of the filter body to which the annular gasket is attached to increase an attachment area, thereby providing an advantage of improving a bonding force of an attachment portion to which the gasket is attached.

Abstract: A RGB simultaneous correction-type device for display gamma correction is proposed, the device including an RGB test pattern output unit forming three division surfaces resulting from dividing a display into three surfaces around a center portion thereof and simultaneously outputting R, G, and B patterns to each of the division surfaces; a unit probe module having three probes disposed one by one at each of the division surfaces corresponding to the R, G, and B patterns; and a correction control unit analyzing each probe detection signal of the unit probe module to simultaneously perform gamma correction for R, G, and B values of each of the division surfaces, whereby there is an advantage of being capable of reducing the display gamma correction time by solving the problem that the time to sequentially output RGB colors during RGB correction is required in the test time.

Abstract: A semiconductor package includes a frame having a wiring structure and having a recess portion, a semiconductor chip having an active surface with a connection pad disposed thereon and disposed in the recess portion, an encapsulant sealing the semiconductor chip, and a redistribution layer having a first via connected to the connection and a second via connected to a portion of the wiring structure. The semiconductor chip includes a protective insulating film disposed on the active surface and having an opening exposing a region of the connection pad, and a redistribution capping layer connected to the region of the connection pad and extending onto the protective insulating film, and a surface of the redistribution capping layer is substantially the same level as a surface of the portion of the wiring structure, exposed from the first surface.

Abstract: A universal folding test device for a foldable display is proposed. The universal folding test device includes: a support plate having a flat-plate shape, being arranged horizontally with a Z axis as a normal line in a space formed by three coordinate axes of X, Y, and Z that are orthogonal to each other, and having opposite sides thereof formed parallel to the Y axis; and a rotary plate being arranged symmetrically on each of the opposite sides of the support plate, being formed as a flat plate having a side thereof adjacent to the support plate and parallel to the Y axis, having a Y-axis rotation actuator formed thereon where the side adjacent to the support plate becomes a rotary shaft, and having a X and Z-axis transfer actuator coupled thereto, wherein a foldable display substrate is attached to the support plate and the rotary plate.

Abstract: A device for fixing a measuring instrument for inspecting a display includes a fixed frame unit detachably mounted on the top end of a display, a moving frame extending upward and downward and mounted to be liftable on the fixed frame unit, and an elevating unit which is mounted to be liftable on the moving frame and on which a measuring instrument for inspecting a display is detachably mounted.

Abstract: A semiconductor package includes a connection structure including an insulating layer, a redistribution layer disposed on the insulating layer, and a connection via penetrating through the insulating layer and connected to the redistribution layer, a frame disposed on the connection structure and having a through-hole, a semiconductor chip disposed in the through-hole on the connection structure and having a connection pad disposed to face the connection structure, and a passive component disposed on the frame.

Abstract: A method for acquiring capacitance of a capacitive touch panel includes acquiring a selected capacitance value at a selected point among a plurality of points at which a plurality of capacitances are present, in the capacitive touch panel, determining the selected capacitance value as a reference capacitance value, and performing a multi-driving using a balanced code, and acquiring a capacitance value from at least one point among the plurality of points using the reference capacitance value.

Abstract: A RGB simultaneous correction-type device for display gamma correction is proposed, the device including an RGB test pattern output unit forming three division surfaces resulting from dividing a display into three surfaces around a center portion thereof and simultaneously outputting R, G, and B patterns to each of the division surfaces; a unit probe module having three probes disposed one by one at each of the division surfaces corresponding to the R, G, and B patterns; and a correction control unit analyzing each probe detection signal of the unit probe module to simultaneously perform gamma correction for R, G, and B values of each of the division surfaces, whereby there is an advantage of being capable of reducing the display gamma correction time by solving the problem that the time to sequentially output RGB colors during RGB correction is required in the test time.

Abstract: A semiconductor package includes a frame having a wiring structure and having a recess portion, a semiconductor chip having an active surface with a connection pad disposed thereon and disposed in the recess portion, an encapsulant sealing the semiconductor chip, and a redistribution layer having a first via connected to the connection and a second via connected to a portion of the wiring structure. The semiconductor chip includes a protective insulating film disposed on the active surface and having an opening exposing a region of the connection pad, and a redistribution capping layer connected to the region of the connection pad and extending onto the protective insulating film, and a surface of the redistribution capping layer is substantially the same level as a surface of the portion of the wiring structure, exposed from the first surface.

Abstract: A semiconductor package includes a support member including a resin body having a first surface and a second surface opposing each other and having a cavity, and at least one passive component embedded in the resin body and having a connection terminal exposed from the first surface; a first connection member disposed on the first surface of the resin body, and having a first redistribution layer on the first insulating layer and connected to the connection terminal; a second connection member disposed on the first connection member and covering the cavity, and having a second redistribution layer on the second insulating layer and connected to the first redistribution layer; and a semiconductor chip disposed on the second connection member in the cavity.

Abstract: A semiconductor package includes a semiconductor chip having connection pads on one surface thereof, a first encapsulant covering at least portions of the semiconductor chip, and a connection structure disposed on the one surface of the semiconductor chip and including one or more redistribution layers electrically connected to the connection pads. A wiring structure is disposed on one surface of the first encapsulant opposing another surface of the first encapsulant facing towards the connection structure. The wiring structure has a passive component embedded therein, and includes one or more wiring layers electrically connected to the passive component. The one or more redistribution layers and the one or more wiring layers are electrically connected to each other.

Abstract: A semiconductor package includes a semiconductor chip having connection pads on one surface thereof, a first encapsulant covering at least portions of the semiconductor chip, and a connection structure disposed on the one surface of the semiconductor chip and including one or more redistribution layers electrically connected to the connection pads. A wiring structure is disposed on one surface of the first encapsulant opposing another surface of the first encapsulant facing towards the connection structure. The wiring structure has a passive component embedded therein, and includes one or more wiring layers electrically connected to the passive component. The one or more redistribution layers and the one or more wiring layers are electrically connected to each other.