Abstract: A method for 3-dimensional vision inspection of objects, such as microelectronic components, which have protrusions as features to be inspected, such as input/output contact balls, is disclosed. The method comprises the steps of determining interior and exterior parameters of a stereo camera system, forming a rectified stereo camera system with a rectified camera coordinate system from the parameters of the stereo cameras determined above. A pair of images of the object having a plurality of co-planar protrusions on one surface is captured by the stereo cameras system and is transformed into the rectified coordinate system to form a pair of rectified images. Conjugate points of each protrusion are then determined in the rectified images for the measurement of its location, co-planarity and height. Various configurations of the apparatus for capturing the images and processing the image data are also disclosed.

Abstract: A method for 3-dimensional vision inspection of objects, such as microelectronic components, which have protrusions as features to be inspected, such as input/output contact balls, is disclosed. The method comprising the steps of determining interior and exterior parameters of a pair of cameras, forming a rectified coordinate system from the parameters of both cameras determined above with a relative pose of second image capturing means with respect to the first image capturing means. A pair of images of the object having a plurality of co-planar protrusions on one surface are captured by the cameras system wherein image coordinates of the images are transformed into coordinates of the rectified coordinate system. Conjugate points of each protrusion are then determined for the measurement of its co-planarity and height. Various configurations of the apparatus for capturing the images and processing the image data are also disclosed.

Abstract: There is disclosed an inspection system that combines 2-D inspection and 3-D inspection of the components of an electronic device into one compact module. The inspection system of the present invention comprises a 2-D image acquisition assembly for inspecting 2-D criteria of the components, a 3-D image acquisition assembly for inspecting 3-D criteria of the components, and a computer for control and data analyzing. The 3-D image acquisition assembly comprises a 3-D image sensor and a 3-D light source. The 3-D light source is preferably a laser capable of generating a planar sheet of light that is substantially perpendicular to the inspection plane of the electronic device. The 2-D image acquisition assembly comprises a 2-D sensor and a 2-D light source positioned above the holder. The 2D and 3D image acquisition assemblies are arranged so that the 2D inspection and 3D inspection can be done while the electronic device is being held in one location.