Abstract: Disclosed are a method and apparatus for reusing wastewater. The method for reusing wastewater disclosed herein includes: generating a mixed wastewater by mixing multiple types of wastewater (S20); performing a first purification by passing the mixed wastewater through a flocculation-sedimentation unit (S40); performing a second purification by passing an effluent of the flocculation-sedimentation unit through a membrane bioreactor (MBR) (S60); performing a third purification by passing an effluent of the MBR through a reverse-osmosis membrane unit (S80); and reusing an effluent of the reverse-osmosis membrane unit as cooling water or industrial water (S100).

Abstract: The objective of the present invention is to provide a poultry weight measurement and weight estimation system, which can estimate weight by considering the unique size of each poultry individual and does not interrupt the transit of poultry.

Abstract: A projection welding gun device includes an upper welding tip and a lower welding tip that are combined with a gun body through a shank, where the upper welding tip presses an upper panel corresponding to a protrusion portion that is formed on a lower panel to weld the upper and lower panels, and a rotation unit that is rotated by a driving portion is disposed between the gun body and the shank to rotate the shank.

Abstract: An animal training apparatus with a radio transceiver is provided, which includes an encoder/tact switch setting animal stimulation levels, a mode designation input unit, a stimulation command input unit, an ID code setting unit, an RF radio signal generation unit, an antenna switch, a signal amplification unit, a received signal demodulation unit, a low-pass filter removing harmonic waves in a transmitted RF signal, a microphone inputting a user input audio signal, an audio output unit, and a first microprocessor operating in a radio transceiver mode if a user command is input, and generating data that corresponds to the stimulation level if a stimulation command is input. The animal training apparatus can subdivide and continuously set stimulation levels for animals, set levels that suit respective animals in the case of multi-dog training, and provide easiness to carry about through condensation of the training apparatus and the radio transceiver into one product.

Abstract: A welded portion quality determining system includes a first plate and a second plate, a welded portion defined at a point where the first plate and the second plate are welded to each other. Magnetic field generators generate a magnetic field to be supplied to the welded portion, and magnetic pickup devices receive the magnetic field generated by the magnetized welded portion to sense the received magnetic field. Therefore, a magnetic field may be generated by the welded portion through the magnetic field generators, and the magnetic field generated by the magnetized welded portion is sensed by the magnetic pickup devices so that quality of the welded portion may be rapidly and correctly verified.

Abstract: A projection welding gun device includes an upper welding tip and a lower welding tip that are combined with a gun body through a shank, where the upper welding tip presses an upper panel corresponding to a protrusion portion that is formed on a lower panel to weld the upper and lower panels, and a rotation unit that is rotated by a driving portion is disposed between the gun body and the shank to rotate the shank.

Abstract: A vehicle welding quality inspection device for checking welding parts of a vehicle body transferred along a transferring line may include a welding part shooting unit fixed on an outside of the transfer line, shoots a welding inspection part of the vehicle body, and outputs the shot data to the controller, and a welding part vision sensor disposed on a front end of an arm of a robot, is moved thereby toward the welding point of the welding inspection part that is recognized by the controller, shoots the welding point, and the vision data to the controller.

Abstract: An animal training apparatus with a radio transceiver is provided, which includes an encoder/tact switch setting animal stimulation levels, a mode designation input unit, a stimulation command input unit, an ID code setting unit, an RF radio signal generation unit, an antenna switch, a signal amplification unit, a received signal demodulation unit, a low-pass filter removing harmonic waves in a transmitted RF signal, a microphone inputting a user input audio signal, an audio output unit, and a first microprocessor operating in a radio transceiver mode if a user command is input, and generating data that corresponds to the stimulation level if a stimulation command is input. The animal training apparatus can subdivide and continuously set stimulation levels for animals, set levels that suit respective animals in the case of multi-dog training, and provide easiness to carry about through condensation of the training apparatus and the radio transceiver into one product.

Abstract: A welded portion quality determining system includes a first plate and a second plate, a welded portion defined at a point where the first plate and the second plate are welded to each other. Magnetic field generators generate a magnetic field to be supplied to the welded portion, and magnetic pickup devices receive the magnetic field generated by the magnetized welded portion to sense the received magnetic field. Therefore, a magnetic field may be generated by the welded portion through the magnetic field generators, and the magnetic field generated by the magnetized welded portion is sensed by the magnetic pickup devices so that quality of the welded portion may be rapidly and correctly verified.

Abstract: A gate is formed on a device formation region of a semiconductor substrate, and source and drain regions are formed in the device formation region of the semiconductor substrate adjacent respective sides of the gate. The gate is formed to include a gate dielectric layer, a gate conductive layer and sidewall spacers located at respective sidewalls of the gate conductive layer. An etch stop layer is formed over the source region, the drain region and the sidewall spacers of the gate to obtain an intermediate structure, and a planarized first interlayer insulating film is formed over a surface of the intermediate structure. The first insulating layer is dry etched until the etch stop layer over the source region, the drain region and the sidewall spacers is exposed to form self-aligned contact holes in the first interlayer insulating over the source region and the drain region, respectively.

Abstract: A gate is formed on a device formation region of a semiconductor substrate, and source and drain regions are formed in the device formation region of the semiconductor substrate adjacent respective sides of the gate. The gate is formed to include a gate dielectric layer, a gate conductive layer and sidewall spacers located at respective sidewalls of the gate conductive layer. An etch stop layer is formed over the source region, the drain region and the sidewall spacers of the gate to obtain an intermediate structure, and a planarized first interlayer insulating film is formed over a surface of the intermediate structure. The first insulating layer is dry etched until the etch stop layer over the source region, the drain region and the sidewall spacers is exposed to form self-aligned contact holes in the first interlayer insulating over the source region and the drain region, respectively.

Abstract: A semiconductor wafer cleaning apparatus and method uses only one inner bath for chemical solution and de-ionized water cleaning, and includes a marangoni dryer for cleaning and drying semiconductor wafers. The apparatus includes a loading unit loaded with a cassette holding wafers; a moving mechanism for extracting the wafers from the cassette and moving the wafers into a loader; an inner bath for cleaning the wafers with a chemical solution or de-ionized water; a marangoni dryer including a hood, for moving the wafers from the loader into the bath, to be sealed to the bath; and a knife for supporting the wafers loaded into the bath at a lower portion thereof and moving the wafers up and down. Since the marangoni dryer is adhered to the bath during drying, the wafers are not affected by laminar flow or exhaustion and water marks do not occur thereon.

Abstract: A wafer dryer for drying a wafer includes a chamber and a support adapted to support the wafer in the chamber. A spray nozzle is disposed in the chamber. A source gas supply tank is in fluid communication with the spray nozzle. At least one heater is operable to heat the chamber and the source gas supply tank. A pumping line is in fluid communication with the chamber. Drive means are operable to rotate the chamber and the spray nozzle. A method for drying a wafer using a wafer dryer including a chamber and a revolving spray nozzle includes the steps of: loading the wafer in the chamber; reducing the pressure in the chamber in which the wafer is loaded to a near vacuum state; creating a temperature controlled atmosphere in the pressure-reduced chamber to quicken drying of the wafer; and spraying the source gas on the wafer while rotating the chamber and the revolving spray nozzle in opposite directions in the pressure-reduced temperature controlled atmosphere.

Abstract: A semiconductor wafer cleaning apparatus and method uses only one inner bath for chemical solution and de-ionized water cleaning, and includes a marangoni dryer for cleaning and drying semiconductor wafers. The apparatus includes a loading unit loaded with a cassette holding wafers; a moving mechanism for extracting the wafers from the cassette and moving the wafers into a loader; an inner bath for cleaning the wafers with a chemical solution or de-ionized water; a marangoni dryer including a hood, for moving the wafers from the loader into the bath, to be sealed to the bath; and a knife for supporting the wafers loaded into the bath at a lower portion thereof and moving the wafers up and down. Since the marangoni dryer is adhered to the bath during drying, the wafers are not affected by laminar flow or exhaustion and water marks do not occur thereon.

Abstract: A wafer dryer for drying a wafer includes a chamber and a support adapted to support the wafer in the chamber. A spray nozzle is disposed in the chamber. A source gas supply tank is in fluid communication with the spray nozzle. At least one heater is operable to heat the chamber and the source gas supply tank. A pumping line is in fluid communication with the chamber. Drive means are operable to rotate the chamber and the spray nozzle. A method for drying a wafer using a wafer dryer including a chamber and a revolving spray nozzle includes the steps of: loading the wafer in the chamber; reducing the pressure in the chamber in which the wafer is loaded to a near vacuum state; creating a temperature controlled atmosphere in the pressure-reduced chamber to quicken drying of the wafer; and spraying the source gas on the wafer while rotating the chamber and the revolving spray nozzle in opposite directions in the pressure-reduced temperature controlled atmosphere.