Abstract: A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.

Abstract: A circuit board with anti-corrosion properties, a method for manufacturing the circuit board, and an electronic device are provided. The circuit board includes a circuit substrate, a first protective layer, and a second protective layer. The circuit substrate includes a base layer and an outer wiring layer formed on the base layer. The circuit substrate further defines a via hole connected to the outer wiring layer. The first protective layer is formed on the outer wiring layer and an inner sidewall of the via hole, and is made of a white oil. The second protective layer is formed on the first protective layer.

Abstract: A bonding pad is described. A substrate having integrated circuits formed therein is provided. A dielectric layer having several trench structure formed therein is formed over the substrate, and each trench structure has several trenches radially arranged in the dielectric layer. A conductive layer is formed on the dielectric layer and fills the trenches, and the conductive layer is electrically coupled to the integrated circuits in the substrate through the trenches, respectively. By using the invention, the adhesion of the dielectric layers and the metal layers can be greatly improved and the compressive mechanical stress can be uniformly released to the substrate even if the wire width of the integrated circuit is reduced to the sub-micron level.