Abstract: Disclosed is a die bonding adhesive tape, which eliminates the requirement for additional adhesive tape for attaching a ring frame, decreases the curing time period upon die bonding, essentially prevents the transfer and diffusion of low-molecular-weight compounds between an adhesive film and an adhesive layer on a base substrate to thus exhibit excellent pick-up performance when picking up a die, and easily separates an adhesive film having a die from an adhesive layer on a base substrate when picking up slim and large dies. The die bonding adhesive tape of the invention includes a base substrate and an adhesive layer formed on the base substrate, has a structure in which a core film having a die bonding adhesive film attached thereto is bonded onto the adhesive layer, and enables direct die bonding via dicing and then die pick-up in a state of being mounted on a wafer.