Abstract: Various examples are provided that are related to fractal-based reactive impedance surfaces. These surfaces allow for miniaturization of antennas. In one example, a fractal rectangular reactive impedance surface (FR-RIS) includes a plurality of fractal rectangular (FR) patches having an outer edge defined by a fractal rectangular pattern that is repeated along each side of inner FR patches of the plurality of FR patches. The fractal rectangular pattern of a FR patch matches with the fractal rectangular pattern of an adjacent FR patch. An antenna can include a planar antenna disposed over the FR-RIS.

Abstract: Various examples are provided for multiferroic thin films. In one example, a multiferroic thin film device includes a thin film of multiferroic material and an electrode disposed on a side of the thin film of multiferroic material. The multiferroic material can be (Fex,Sr1-x)TiO3 In another example, a method for producing a multiferroic thin film includes forming a multiferroic precursor; disposing the multiferroic precursor on a substrate to form a multiferroic coating; pre-baking the multiferroic coating on the substrate to form a pre-baked multiferroic thin film; and annealing the pre-baked multiferroic thin film under an oxygen atmosphere to form a crystalized multiferroic thin film. One or more electrodes can be formed on the crystalized multiferroic thin film.

Abstract: Various integrated high quality electronic components and systems, and methods of their manufacture, are presented. In one example, a device includes a glass substrate or interposer including one or more metalized through-glass vias (TGVs). The one or more metalized TGVs can be used to form a substrate integrated waveguide, a complementary split ring resonator, a disc loaded monopole antenna or other device. An array of metalized TGVs can define side walls of the integrated waveguide. A disc coupled to a tip of a metalized TGV can provide capacitive disc loading of the monopole antenna.

Abstract: Various examples are provided for glass interposer integrated antennas for intrachip, interchip and board communications. In one example, a reflector through-glass via (TGV) antenna includes a TGV or group of TGVs extending through a glass substrate. The TGV can extend from a feeding line disposed on a first side of the glass substrate to a loading disc disposed on a second side of the glass substrate. An array of reflector pillars extending through the glass substrate from a ground plane on the first side of the glass substrate to the second side of the glass substrate can also be provided with the array of reflector pillars distributed beyond an outer edge of the loading disc. The TGV antenna can be implemented as a dual mode design and excited at a first frequency to generate an omni-directional radiation pattern and at a second frequency to generate a broadside radiation pattern.

Abstract: A magnetic field effect transconductor device (M-FET) capable of carrying a modulated current when receiving an external magnetic field includes at least a ferromagnetic layer and a non-ferromagnetic layer disposed on the ferromagnetic layer; the non-ferromagnetic layer has a first skin depth of the current and a first thickness smaller than the first skin depth; and the ferromagnetic layer has a second skin depth of the current and a second thickness smaller than the second skin depth. Applying an external DC magnetic field along the longitudinal axis of the device and an AC EM wave propagating in the same direction as the DC field, the M-FET demonstrates frequency dependent current switching device. A method for making the transconductor includes depositing a photoresist over transconductors and patterning the photoresist, or depositing transconductors over a patterned photoresist and performing a lift off process.

Abstract: Various examples are provided for superlattice conductors. In one example, a planar conductor includes a plurality of stacked layers including copper thin film layers and nickel thin film layers, where adjacent copper thin film layers of the copper thin film layers are separated by a nickel thin film layer of the plurality of nickel thin film layers. In another example, a conductor includes a plurality of radially distributed layers including a non-ferromagnetic core; a nickel layer disposed about and encircling the non-ferromagnetic core; and a copper layer disposed on and encircling the nickel layer. In another example, a hybrid conductor includes a core; and a plurality of radially distributed layers disposed about a portion of an outer surface of the core, the plurality of radially distributed layers include alternating ferromagnetic and non-ferromagnetic layers. In other hybrid conductors, the radially distributed layers can utilize magnetic and non-magnetic materials.

Abstract: Methods and apparatuses for measuring static and dynamic pressures in harsh environments are disclosed. A pressure sensor according to one embodiment of the present invention may include a diaphragm constructed from materials designed to operate in harsh environments. A waveguide may be operably connected to the diaphragm, and an electromagnetic wave producing and receiving (e.g., sensing) device may be attached to the waveguide, opposite the diaphragm. A handle may be connected between the diaphragm and the waveguide to provide both structural support and electrical functionality for the sensor. A gap may be included between the handle and the diaphragm, allowing the diaphragm to move freely. An antenna and a ground plane may be formed on the diaphragm or the handle. Electromagnetic waves may be reflected off the antenna and detected to directly measure static and dynamic pressures applied to the diaphragm.

Abstract: Various examples are provided for hydrothermally grown BaTiO3, SrTiO3, and BaxSr1-xTiO3 on TiO2 nanotube layers, which can be used in ultra-high charge density capacitors. In one example, a method includes forming a first anodized titanium oxide (ATO) layer on a layer of titanium by anodization, the first ATO layer having a nanotubular morphology; removing the first ATO layer from the layer of titanium; forming a second ATO layer having a nanotubular morphology on the layer of titanium by anodization; and hydrothermally growing a layer of MTiO3 on a surface of the second ATO layer, where M is Ba, Sr, or BaxSr1-x. In another example, an ultra-high density charge capacitor includes a first electrode layer; an ATO layer disposed on the first electrode layer; a layer of MTiO3 on a surface of the ATO layer; and a second electrode layer disposed on the layer of MTiO3.

Abstract: Various examples are provided for intelligent mouthguards that can be used in fitness and sport activities. In one example, an intelligent mouthguard system includes a mouthguard including sensors and an internal module in communication with the sensors. The sensors can include a nine-axis inertial sensor comprising a three-axis magnetometer, a three-axis accelerometer and a three-axis gyroscope. The three-axis magnetometer can provide a reference plane in relation to the earth's magnetic field for the three-axis accelerometer and the three-axis gyroscope. The internal module can provide sensor data to an external processing unit when located in an oral cavity.

Abstract: Various examples are provided for smart transportation and sensing systems. In one example, an apparatus for smart transportation sensing includes a reflector integrated in a contoured roadway unit configured to protect the reflector from damage by vehicles traveling along a transportation surface; and a radio frequency identification (RFID) tag integrated in the contoured roadway unit. In another example, a system for smart transportation includes a vehicle including a radio frequency identification (RFID) reader configured to interrogate RFID tags integrated in reflector units disposed along a transportation surface; and a processing system in communication with the RFID reader, the processing system configured to process data obtained from at least one of the RFID tags to determine vehicle location along the transportation surface.

Abstract: Various examples of methods, systems, and apparatus are provided for monitoring using an improved mouth guard apparatus. In one example, a battery-free diagnostic mouth guard includes a biting force-voltage transducer comprising a piezoelectric film; a compact resonance tank comprising a wireless sensor; and a transmitting antenna for transmitting sensing data. A piezo-voltage from the biting force-voltage transducer can bias a varactor diode loaded on the wireless sensor whose response frequency is tuned due to a capacitance change of the varactor diode. In some implementations, an external processing equipment can wirelessly detect a frequency shift of the varactor diode integrated resonator. In another example, a method includes detecting a biting force via a biting force-voltage transducer; biasing a varactor diode with a voltage from the transducer; tuning a response frequency of a split ring resonator using a capacitance change of the varactor diode; and emitting sensing data at the response frequency.

Abstract: Various examples are provided for multiferroic thin films. In one example, a multiferroic thin film device includes a thin film of multiferroic material and an electrode disposed on a side of the thin film of multiferroic material. The multiferroic material can be (Fex,Sr1-x)TiO3 In another example, a method for producing a multiferroic thin film includes forming a multiferroic pre-cursor; disposing the multiferroic precursor on a substrate to form a multiferroic coating; pre-baking the multiferroic coating on the substrate to form a pre-baked multiferroic thin film; and annealing the pre-baked multiferroic thin film under an oxygen atmosphere to form a crystalized multiferroic thin film. One or more electrodes can be formed on the crystalized multiferroic thin film.

Abstract: Various examples are provided for magnetic particle imbedded nanofibrous membranes. In one example, among others, a nanofibrous membrane includes one or more electrospun nanofibers forming form a layer of nanofibers, and a plurality of magnetic nanoparticles embedded in the one or more electrospun nanofibers. In another example, a method includes generating one or more electrospun nanofibers including magnetic nanoparticles from one or more nozzles positioned over a substrate to form a magnetic nanofibrous layer, and affixing the magnetic nanofibrous layer to a support structure. In another example, a system includes a magnetic nanofibrous membrane affixed to a support structure, and a magnetic field generator configured to generate a magnetic field that passes through the magnetic nanofibrous membrane.

Abstract: Various integrated high quality electronic components and systems, and methods of their manufacture, are presented. In one example, a device includes a glass substrate or interposer including one or more metalized through-glass vias (TGVs). The one or more metalized TGVs can be used to form a substrate integrated waveguide, a complementary split ring resonator, a disc loaded monopole antenna or other device. An array of metalized TGVs can define side walls of the integrated waveguide. A disc coupled to a tip of a metalized TGV can provide capacitive disc loading of the monopole antenna.

Abstract: Various examples of methods and systems related to nanofibrous microstructures including carbon nanofibrous microelectrode arrays are provided. In one example, a method includes electrospinning photosensitive nanofibers on a patterned substrate; immersing the photosensitive nanofibers in a refractive index matching medium; and exposing the immersed photosensitive nanofibers to ultraviolet (UV) light through the patterned substrate or through a front side photomask. In another example, a microelectrode array includes a carbon thin film (CTF) trace pattern including a plurality of CTF electrode pads; and a plurality of carbon nanofiber (CNF) pillars disposed on the plurality of CTF electrode pads.

Abstract: Various examples are provided for low ohmic loss radial superlattice conductors. In one example, among others, a conductor includes a plurality of radially distributed layers that include a non-permalloy core, a permalloy layer disposed on and encircling the non-permalloy core, and a non-permalloy layer disposed on and encircling the permalloy layer. The non-permalloy core and non-permalloy layer can include the same or different materials such as, e.g., aluminum, copper, silver, and gold. In some implementations, the non-permalloy core includes a void containing air or a non-conductive material such as, e.g., a polymer. The permalloy layer can include materials such as, e.g., NiFe, FeCo, NiFeCo, or NiFeMo. In another example, a via connector includes the plurality of radially distributed layers including the permalloy layer and the non-permalloy layer disposed on and encircling the permalloy layer. The via connector can extend through glass, silicon, organic, or other types of substrates.

Abstract: Various systems and methods are provided for folded patch antennas. In one embodiment, among others, a folded patch antenna includes a patch disposed on an outer side of a flexible substrate and a ground plane disposed on an inner side of the flexible substrate opposite the patch. The flexible substrate is folded to form an enclosed cavity defined by the inner side of the flexible substrate. The ground plane may provide electromagnetic interference (EMI) shielding of the cavity. In another embodiment, among others, a folded patch antenna platform includes a flexible substrate, a folded patch antenna, and a transceiver mounted on the flexible substrate. The folded patch antenna includes a patch communicatively coupled to the transceiver and a ground plane, which are disposed on opposite sides of the flexible substrate.

Abstract: Various examples are provided for spherical monopole antennas. In one example, among others, a spherical monopole antenna includes a spherical conductor on a first side of a substrate and a ground plane disposed on the substrate. The spherical conductor is electrically coupled to a connector via a tapered feeding line and the ground plane surrounds at least a portion of the connector on the second side of the substrate. In another example, among others, a method includes forming a tapered mold in a die layer disposed on a first side of a substrate, filling the tapered mold with a conductive paste, and disposing a spherical conductor on a large end of the tapered mold. The conductive paste is in contact with a signal line extending through the substrate into a small end of the tapered mold and in contact with the spherical conductor.

Abstract: Various methods and systems are provided for fabrication of nanoporous membranes. In one embodiment, among others, a system includes electrode pairs including substantially parallel electrodes, a controllable power supply to control the electrical potential of each of the electrode pairs, and a syringe to eject an electrically charged solution from a needle to form a nanofiber. The orientation of the nanofiber in a nanofiber layer is determined by the electrical potentials of the electrode pairs. In another embodiment, a method includes providing a nanoporous membrane including nanofiber layers between a transferor and a mainmold of a stamp-through-mold (STM) where adjacent nanofiber layers are approximately aligned in different directions. A patterned membrane is sheared from the nanoporous membrane using the transferor and the mainmold of the STM and transferred to a substrate.

Abstract: Various examples are provided for low ohmic loss radial superlattice conductors. In one example, among others, a conductor includes a plurality of radially distributed layers that include a non-permalloy core, a permalloy layer disposed on and encircling the non-permalloy core, and a non-permalloy layer disposed on and encircling the permalloy layer. The non-permalloy core and non-permalloy layer can include the same or different materials such as, e.g., aluminum, copper, silver, and gold. In some implementations, the non-permalloy core includes a void containing air or a non-conductive material such as, e.g., a polymer. The permalloy layer can include materials such as, e.g., NiFe, FeCo, NiFeCo, or NiFeMo. In another example, a via connector includes the plurality of radially distributed layers including the permalloy layer and the non-permalloy layer disposed on and encircling the permalloy layer. The via connector can extend through glass, silicon, organic, or other types of substrates.