Abstract: A temperature controller for semiconductor fabrication comprises a lower chiller connected with a lower chamber of a processing chamber and configured to adjust a temperature of the lower chamber, an electrostatic chuck disposed in the lower chamber and an upper chiller connected with an upper chamber of the processing chamber and configured to adjust a temperature of the upper chamber, a heater disposed in the upper chamber. In the temperature controller for semiconductor fabrication, the three-way valve may be installed on the cooling fluid supplying pipe, and the bypass pipe may be installed between the three-way valve and the cooling fluid collecting pipe to reduce the degree of bypass opening of the three-way valve.

Abstract: A temperature controller for semiconductor fabrication comprises a lower chiller connected with a lower chamber of a processing chamber and configured to adjust a temperature of the lower chamber, an electrostatic chuck disposed in the lower chamber and an upper chiller connected with an upper chamber of the processing chamber and configured to adjust a temperature of the upper chamber, a heater disposed in the upper chamber. In the temperature controller for semiconductor fabrication, the three-way valve may be installed on the cooling fluid supplying pipe, and the bypass pipe may be installed between the three-way valve and the cooling fluid collecting pipe to reduce the degree of bypass opening of the three-way valve.

Abstract: A semiconductor device manufacturing apparatus, an HSG-polysilicon layer forming method, and a method for forming a capacitor having the HSG-polysilicon layer as an electrode equilibrate the temperature of a processing chamber with a temperature close to that at which a semiconductor manufacturing process occurs. The semiconductor device manufacturing apparatus includes a wafer supporter for holding a wafer during the semiconductor manufacturing process. An elevator moves the wafer supporter vertically among a load/unload position, a standby position above the load/unload position, and a process position above the load/unload position. With this apparatus, processing uniformity is enhanced.