Patents by Inventor Yong Li Xu

Yong Li Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190328986
    Abstract: A medication dispenser includes a base seat, a circuitry unit and an outer casing. The base seat includes a mouthpiece. The circuitry unit includes a first circuit board, a battery, and first and second switches disposed on the first circuit board. The outer casing is movable relative to the base seat between a close position where the outer casing covers the mouthpiece and where the first switch is actuated such that electric power is prevented from being supplied from the battery to the first circuit board, and an open position where the outer casing uncovers the mouthpiece and where the second switch is actuated such that electric power is supplied from the battery to the first circuit board.
    Type: Application
    Filed: June 19, 2019
    Publication date: October 31, 2019
    Applicant: Jabil Circuit (Shanghai) Ltd.
    Inventors: Ying Li, Ying-Zhen Tong, Yi-Nong Zhao, Fang-Long Xu, Yong-Feng Song, Conor Mulcahy, Xiao Qiang Fei
  • Publication number: 20190326291
    Abstract: A semiconductor device includes a semiconductor substrate having first and second semiconductor fins, an insulating layer on the semiconductor substrate, the insulating layer including a first recess exposing an upper portion of the first semiconductor fin and a second recess exposing an upper portion of the second semiconductor fin, a gate dielectric layer on the first and second recesses and the exposed upper portions of the first and second semiconductor fins, a first work function adjustment layer on the gate dielectric layer, a functional layer on the first function adjustment layer, and first and second gates on portions of the functional layer of the respective first and second semiconductor fins. The surface area of a lateral opening of the first recess is larger than the surface area of a lateral opening of the second recess.
    Type: Application
    Filed: July 3, 2019
    Publication date: October 24, 2019
    Applicants: Semiconductor Manufacturing International (Shanghai) Corporation, Semiconductor Manufacturing International (Beijing) Corporation
    Inventors: Yong Li, Jian Hua Xu
  • Publication number: 20190298946
    Abstract: A medication dispenser includes a base seat, a circuitry unit and an outer casing. The base seat includes a mouthpiece. The circuitry unit includes a first circuit board, a battery, and first and second switches disposed on the first circuit board. The outer casing is movable relative to the base seat between a close position where the outer casing covers the mouthpiece and where the first switch is actuated such that electric power is prevented from being supplied from the battery to the first circuit board, and an open position where the outer casing uncovers the mouthpiece and where the second switch is actuated such that electric power is supplied from the battery to the first circuit board.
    Type: Application
    Filed: June 19, 2019
    Publication date: October 3, 2019
    Applicant: Jabil Circuit (Shanghai) Ltd.
    Inventors: Ying Li, Ying-Zhen Tong, Yi-Nong Zhao, Fang-Long Xu, Yong-Feng Song, Conor Mulcahy, Xiao Qiang Fei
  • Patent number: 10388655
    Abstract: A method of manufacturing a semiconductor device includes providing a substrate having first and second semiconductor fins, forming an insulating layer on the substrate having first and second recesses exposing a portion of the respective first and second semiconductor fins, forming a gate dielectric layer on the first and second recesses and the exposed portions of the first and second semiconductor fins, forming a first work function adjustment layer on the gate dielectric layer, forming a functional layer on the first function adjustment layer, and forming first and second gates on portions of the functional layer of the respective first and second semiconductor fins. The opening area of the first recess is larger than the opening area of the second recess. The thickness of the functional layer on the first semiconductor fin is greater than the thickness of the functional layer on the second semiconductor fin.
    Type: Grant
    Filed: March 29, 2017
    Date of Patent: August 20, 2019
    Assignees: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION, SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING) CORPORATION
    Inventors: Yong Li, Jian Hua Xu
  • Patent number: 10369305
    Abstract: A medication dispenser includes a base seat, a circuitry unit and an outer casing. The base seat includes a mouthpiece. The circuitry unit includes a first circuit board, a battery, and first and second switches disposed on the first circuit board. The outer casing is movable relative to the base seat between a close position where the outer casing covers the mouthpiece and where the first switch is actuated such that electric power is prevented from being supplied from the battery to the first circuit board, and an open position where the outer casing uncovers the mouthpiece and where the second switch is actuated such that electric power is supplied from the battery to the first circuit board.
    Type: Grant
    Filed: October 2, 2017
    Date of Patent: August 6, 2019
    Assignee: Jabil Circuit (Shanghai) Ltd.
    Inventors: Ying Li, Ying-Zhen Tong, Yi-Nong Zhao, Fang-Long Xu, Yong-Feng Song, Conor Mulcahy, Xiao Qiang Fei
  • Patent number: 9583425
    Abstract: A wafer level package includes a wafer, a lead disposed of the wafer for connecting the wafer to an electrical circuit, and a core disposed of the lead. In some embodiments, the lead disposed of the wafer is a copper pillar, and the core is plated onto the copper pillar. In some embodiments, the core is polymer screen-plated onto the lead. In some embodiments, the core extends between at least approximately thirty-five micrometers (35 ?m) and fifty micrometers (50 ?m) from the lead. In some embodiments, the core covers between at least approximately one-third (?) and one-half (½) of the surface area of the lead. In some embodiments, the core comprises a stud-shape extending from the lead. In some embodiments, the core extends perpendicularly across the lead. In some embodiments, the core extends longitudinally along the lead. Further, a portion of the core can extend perpendicularly from a longitudinal core.
    Type: Grant
    Filed: June 28, 2013
    Date of Patent: February 28, 2017
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Yong Li Xu, Tiao Zhou, Xiansong Chen, Kaysar M. Rahim, Viren Khandekar, Yi-Sheng Anthony Sun, Arkadii V. Samoilov
  • Publication number: 20140131859
    Abstract: A wafer level package includes a wafer, a lead disposed of the wafer for connecting the wafer to an electrical circuit, and a core disposed of the lead. In some embodiments, the lead disposed of the wafer is a copper pillar, and the core is plated onto the copper pillar. In some embodiments, the core is polymer screen-plated onto the lead. In some embodiments, the core extends between at least approximately thirty-five micrometers (35 ?m) and fifty micrometers (50 ?m) from the lead. In some embodiments, the core covers between at least approximately one-third (?) and one-half (½) of the surface area of the lead. In some embodiments, the core comprises a stud-shape extending from the lead. In some embodiments, the core extends perpendicularly across the lead. In some embodiments, the core extends longitudinally along the lead. Further, a portion of the core can extend perpendicularly from a longitudinal core.
    Type: Application
    Filed: June 28, 2013
    Publication date: May 15, 2014
    Inventors: Yong Li Xu, Tiao Zhou, Xiansong Chen, Kaysar M. Rahim, Viren Khandekar, Yi-Sheng Anthony Sun, Arkadii V. Samoilov
  • Patent number: 8575493
    Abstract: Semiconductor devices are described that have an extended under ball metallization configured to mitigate dielectric layer cracking due to stress, particularly stress caused by CTE mismatch during thermal cycling tests, dynamic deformation during drop tests, or cyclic bending tests, and so on. In an implementation, the semiconductor package devices include an integrated circuit chip having a solder ball and under ball metallization, formed on the integrated circuit chip, which is configured to receive the solder ball so that the solder ball and the under ball metallization have a contact area there between, wherein the area of the under ball metallization is area greater than the contact area.
    Type: Grant
    Filed: February 24, 2011
    Date of Patent: November 5, 2013
    Assignee: Maxim Integrated Products, Inc.
    Inventors: Yong Li Xu, Duane Thomas Wilcoxen, Yi-Sheng Sun, Viren Khandekar, Arkadii Samoilov
  • Patent number: 8084871
    Abstract: An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress relief during temperature cycle and/or drop testing of the WLP.
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: December 27, 2011
    Assignee: Maxim Integrated Products, Inc.
    Inventors: S. Kaysar Rahim, Tiao Zhou, Arkadii Samoilov, Viren Khandekar, Yong Li Xu
  • Patent number: 7989961
    Abstract: An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress relief during temperature cycle and/or drop testing of the WLP.
    Type: Grant
    Filed: November 10, 2009
    Date of Patent: August 2, 2011
    Assignee: Maxim Integrated Products, Inc.
    Inventors: S. Kaysar Rahim, Tiao Zhou, Arkadii Samoilov, Viren Khandekar, Yong Li Xu
  • Publication number: 20110108981
    Abstract: An enhanced redistribution layer is provided that geometrically expands redistribution layer (RDL) pads associated with a ball grid array of a wafer level package (WLP) to provide tensile stress relief during temperature cycle and/or drop testing of the WLP.
    Type: Application
    Filed: November 10, 2009
    Publication date: May 12, 2011
    Applicant: MAXIM INTEGRATED PRODUCTS, INC.
    Inventors: KAYSAR RAHIM, TIAO ZHOU, ARKADII SAMOILOV, VIREN KHANDEKAR, YONG LI XU
  • Patent number: 7382059
    Abstract: In one embodiment, a semiconductor package is formed by adding a layer of particles to desired portions of a packing substrate. The layer of particles forms a matrix of crevices that provides a micro-lock feature for mechanically locking or engaging encapsulating materials.
    Type: Grant
    Filed: November 18, 2005
    Date of Patent: June 3, 2008
    Assignee: Semiconductor Components Industries, L.L.C.
    Inventors: Harold G. Anderson, Cang Ngo, Yong Li Xu, James Mohr