Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.

Abstract: Provided are a noise cancellation method and apparatus, an electronic device, a noise cancellation earphone, and a storage medium. The method includes acquiring original sound source information; performing noise reduction (NR) processing on the original sound source information using active noise cancellation (ANC) to obtain first sound information and performing the NR processing on the original sound source information using environmental noise cancellation (ENC) to obtain second sound information; and mixing and adding the first sound information and the second sound information to obtain target sound information and playing the target sound information. In this method, the NR processing can be performed on the sound using the ANC and the ENC, thereby distinguishing environmental noise from human voice, improving the noise cancellation performance, and enabling a user to hear clearer sound.

Abstract: A ranging workflow to interpret the ultradeep harmonic anisotropic attenuation (UHAA) measurements and estimate the distance and orientation of the existing cased well from the well being drilled is presented herein. The ranging workflow applies to scenarios in which the wells are near parallel to each other and performs reasonably well in boreholes which are more or less perpendicular to the formation layers. The ranging workflow generally includes deploying a deep directional resistivity (DDR) tool into a new wellbore; collecting UHAA data via the DDR tool; determining resistivity values based at least in part on the UHAA data; and determining a distance of the DDR tool from a casing of an existing wellbore proximate the new wellbore based at least in part on the resistivity values and a UHAA response table for the DDR tool.

Abstract: A method of fabricating a semiconductor package is provided, including: providing a heat dissipating structure having a heat dissipating portion, a deformable supporting portion coupled to the heat dissipating portion, and a coupling portion coupled to the supporting portion; coupling a carrier having a semiconductor element carried thereon to the coupling portion of the heat dissipating structure to form between the carrier and the heat dissipating portion a receiving space for the semiconductor element to be received therein; and forming in the receiving space an encapsulant that encapsulates the semiconductor element. The use of the supporting portion enhances the bonding between the heat dissipating structure and a mold used for packaging, thereby preventing the heat dissipating structure from having an overflow of encapsulant onto an external surface of the heat-dissipating portion.

Abstract: This disclosure provides a semiconductor package and a method of fabricating the same. The semiconductor package includes an insulating layer; a plurality of traces and connection pads disposed in the insulating layer and protruded from the insulating layer; a plurality of bumps formed on the plurality of traces; a semiconductor chip disposed on the bumps; and an encapsulant formed on the insulating layer to encapsulate the semiconductor chip, the plurality of bumps, traces and connection pads. When the encapsulant is formed, voids can be prevented from being generated in the traces and the connection pads and thus the yield of process is significantly increased.

Abstract: A packaging substrate is disclosed, which includes: an encapsulant having opposite first and second surfaces; a plurality of conductive elements embedded in the encapsulant, wherein each of the conductive elements has a first conductive pad exposed from the first surface of the encapsulant and a second conductive pad exposed from the second surface of the encapsulant; and a protection layer formed on the second surface of the encapsulant and the second conductive pads so as to protect the second surface of the encapsulant from being scratched.

Abstract: A method of fabricating a semiconductor package is provided, including: providing a heat dissipating structure having a heat dissipating portion, a deformable supporting portion coupled to the heat dissipating portion, and a coupling portion coupled to the supporting portion; coupling a carrier having a semiconductor element carried thereon to the coupling portion of the heat dissipating structure to form between the carrier and the heat dissipating portion a receiving space for the semiconductor element to be received therein; and forming in the receiving space an encapsulant that encapsulates the semiconductor element. The use of the supporting portion enhances the bonding between the heat dissipating structure and a mold used for packaging, thereby preventing the heat dissipating structure from having an overflow of encapsulant onto an external surface of the heat-dissipating portion.

Abstract: This disclosure provides a semiconductor package and a method of fabricating the same. The semiconductor package includes an insulating layer; a plurality of traces and connection pads disposed in the insulating layer and protruded from the insulating layer; a plurality of bumps formed on the plurality of traces; a semiconductor chip disposed on the bumps; and an encapsulant formed on the insulating layer to encapsulate the semiconductor chip, the plurality of bumps, traces and connection pads. When the encapsulant is formed, voids can be prevented from being generated in the traces and the connection pads and thus the yield of process is significantly increased.

Abstract: This disclosure provides a semiconductor package and a method of fabricating the same. The semiconductor package includes an insulating layer; a plurality of traces and connection pads disposed in the insulating layer and protruded from the insulating layer; a plurality of bumps formed on the plurality of traces; a semiconductor chip disposed on the bumps; and an encapsulant formed on the insulating layer to encapsulate the semiconductor chip, the plurality of bumps, traces and connection pads. When the encapsulant is formed, voids can be prevented from being generated in the traces and the connection pads and thus the yield of process is significantly increased.

Abstract: This disclosure provides a semiconductor package and a method of fabricating the same. The semiconductor package includes an insulating layer; a plurality of traces and connection pads disposed in the insulating layer and protruded from the insulating layer; a plurality of bumps formed on the plurality of traces; a semiconductor chip disposed on the bumps; and an encapsulant formed on the insulating layer to encapsulate the semiconductor chip, the plurality of bumps, traces and connection pads. When the encapsulant is formed, voids can be prevented from being generated in the traces and the connection pads and thus the yield of process is significantly increased.

Abstract: A semiconductor package includes: a first encapsulant having tapered through holes each having a wide top and a narrow bottom; tapered electrical contacts disposed in the tapered through holes; circuits disposed on a top surface of the first encapsulant and each having one end connecting one of the electrical contacts and the other end having a bonding pad disposed thereon such that the bonding pads are circumferentially arranged to define a die attach area on the top surface of the first encapsulant. As such, a semiconductor chip can be disposed on the top surface of the first encapsulant in the die attach area and electrically connected to the bonding pads through conductive elements, and further a second encapsulant encapsulates the semiconductor chip, the conductive elements, the circuits and the first encapsulant so as to prevent falling off of the electrical contacts and reduce the length of the conductive elements.

Abstract: A method for making a terminal module includes providing a first terminal and a second terminal positioned in the first terminal, forming an insulator between the first terminal and the second terminal, and forming a latching flange on an outer surface of the first terminal. The latching flange forms at least one resisting surface.

Abstract: A method for making a terminal module includes providing a first terminal and a second terminal positioned in the first terminal, forming an insulator between the first terminal and the second terminal, and forming a latching flange on an outer surface of the first terminal. The latching flange forms at least one resisting surface.

Abstract: An exemplary cable connector includes a terminal module, a latching flange, and a housing. The terminal module includes a first terminal, a second terminal, and an insulator. The first terminal and the second terminal are insulated by the insulator. The latching flange is fixed on an outer surface of the terminal module. The housing is fixed on a periphery of the terminal module. The latching flange forms at least one resisting surface. An inner surface of the housing defines a latching groove corresponding to the latching flange. The latching groove forms at least one resisting surface corresponding to the at least one resisting surface of the latching flange. The latching flange is latched in the latching groove.

Abstract: An exemplary terminal module of a cable connector includes a first terminal, a second terminal positioned in the first terminal, an insulator positioned between the first terminal and the second terminal for insulating the first and second terminals from each other, and a latching flange disposed on an outer surface of the first terminal. The latching flange forms at least one resisting surface.

Abstract: An exemplary cable connector includes a housing, a terminal module including a first terminal and a second terminal, a printed circuit board fixed in the housing, and a cable including a first core and a second core. The terminal module is detachably assembled in a first end of the housing, and the first and second terminals are contacting the printed circuit board. The cable is fixed in a second end of the housing, and the first and the second cores of the cable are welded to the printed circuit board. The first and second terminals are electrically communicating with the first and second cores via the printed circuit board.

Abstract: An exemplary terminal module of a cable connector includes a first terminal, a second terminal positioned in the first terminal, an insulator positioned between the first terminal and the second terminal for insulating the first and second terminals from each other, and a latching flange disposed on an outer surface of the first terminal. The latching flange forms at least one resisting surface.

Abstract: An exemplary cable connector includes a housing, a terminal module including a first terminal and a second terminal, a printed circuit board fixed in the housing, and a cable including a first core and a second core. The terminal module is detachably assembled in a first end of the housing, and the first and second terminals are contacting the printed circuit board. The cable is fixed in a second end of the housing, and the first and the second cores of the cable are welded to the printed circuit board. The first and second terminals are electrically communicating with the first and second cores via the printed circuit board.

Abstract: An exemplary cable connector includes a terminal module, a latching flange, and a housing. The terminal module includes a first terminal, a second terminal, and an insulator. The first terminal and the second terminal are insulated by the insulator. The latching flange is fixed on an outer surface of the terminal module. The housing is fixed on a periphery of the terminal module. The latching flange forms at least one resisting surface. An inner surface of the housing defines a latching groove corresponding to the latching flange. The latching groove forms at least one resisting surface corresponding to the at least one resisting surface of the latching flange.

Abstract: The present invention provides an insertion-type semiconductor device and a fabrication method thereof, including the steps of: mounting a chip on a BGA substrate and performing a packaging molding process; providing an electrical connecting board formed with a plurality of electrical terminals thereon for allowing the packaged substrate to electrically connect with the electrical terminals on the electrical connecting board via a conductive element thereof; covering a lid to form an insertion-type semiconductor device. As size of the solder pads is much smaller than the electrical terminals of the insertion-type semiconductor device, the area under the semiconductor chip can be reduced to minimize the deformable area of the semiconductor chip when being pressed in the molding process, thereby preventing damage to the semiconductor chip and also meeting the specification requirement of an insertion-type semiconductor device.