Abstract: A robot welding method based on semantic feature clustering; the method comprises: acquiring an image of a workpiece, and generating an image training sample set; performing semantic annotation on the image of the workpiece to generate a semantic training sample set; establishing a semantic clustering model, and training same by using the image training sample set and the semantic training sample set; by using the trained semantic clustering model, identifying an image of a workpiece to be welded, so as to obtain data of the workpiece to be welded; on the basis of the data of the workpiece to be welded and by using parameterized online programming, generating a welding program for the workpiece to be welded; and on the basis of the welding program, executing welding of the workpiece to be welded. By means of the robot welding method based on semantic feature clustering, neither teaching programming nor offline programming is required, thereby improving the precision, efficiency, universality and flexibility.

Abstract: According to embodiments of the present invention, a method for forming a composite film is provided. The method includes providing a nanowire forming template, forming a plurality of nanowires through the nanowire forming template, removing material from a partial portion of the nanowire forming template to expose a portion of the plurality of nanowires, and forming a polymeric film between the plurality of nanowires to form a composite film.

Abstract: A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking.

Abstract: A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking.

Abstract: A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking.

Abstract: A method of simultaneously bonding components, comprising the following steps. At least first, second and third components are provided and comprise: at least one glass component; and at least one conductive or semiconductive material component. The order of stacking of the components is determined to establish interfaces between the adjacent components. A hydrogen-free amorphous film is applied to one of the component surfaces at each interface comprising an adjacent: glass component; and conductive or semiconductive component. A sol gel with or without alkaline ions film is applied to one of the component surfaces at each interface comprising an adjacent: conductive or semiconductive component; and conductive or semiconductive component. The components are simultaneously anodically bonded in the determined order of stacking.