Abstract: An electronic device includes a substrate with a conductive structure and a substrate encapsulant. The conductive structure has a lead with a lead via and a lead protrusion. The lead via can include via lateral sides defined by first concave portions and the lead protrusion can include protrusion lateral sides defined by second concave portions. The substrate encapsulant covers the first concave portions at a first side of the substrate but not the second concave portions so that the lead protrusion protrudes from the substrate encapsulant at a second side of the substrate. An electronic component can be adjacent to the first side of the substrate and electrically coupled to the conductive structure. A body encapsulant encapsulates portions of the electronic component and the substrate. The lead can further include a lead trace at the second side of the substrate.

Abstract: A sweatband for headgear is disclosed. The sweatband has a plurality of laminated absorbent non-woven fabric strips. One or more first unabsorbent non-woven fabric strips are interposed between the laminated absorbent non-woven fabric strips. A second unabsorbent non-woven fabric strip is positioned at the back of the laminated absorbent non-woven fabric strips. The fabric strips are bonded together. A plurality of vertical slits are formed along the upper and lower edges of the bonded fabric strips at intervals. According to another embodiment, intervals of the slits may be 6 mm and lengths of the slits may be 5 mm.